Abstract: A mixed light light-emitting diode device includes first, second, and third chips, each having a first-type semiconductor layer with a first surface, a second-type semiconductor layer with a second surface opposite to the first surface, and a third surface indenting from the first surface and situated on the second-type semiconductor layer. The second and third chips have their first surfaces disposed above and facing the first surface of the first chip. A first-type electrode penetrates through the second and first surfaces of the first chip and contacts all first surfaces of first, second, and third chips. Two second-type electrodes each penetrates through the second and third surfaces of the first chip and connect the first chip to one of the second and third chips.

Abstract: A method includes implanting impurities in a semiconductor substrate to form an etch stop region within the semiconductor substrate; forming a transistor structure on a front side of the semiconductor substrate; forming a front-side interconnect structure over the transistor structure; performing a thinning process on a back side of the semiconductor substrate to reduce a thickness of the semiconductor substrate, wherein the thinning process is slowed by the etch stop region; and forming a back-side interconnect structure over the back side of the semiconductor substrate.

Abstract: A method for transferring micro light emitting diodes (micro-LEDs) includes forming a plurality of micro light emitting diode (micro-LED) chips having an epitaxial stacked layer and an electrode on a base; attaching the electrodes of the micro-LED chips to a temporary substrate and removing the base from the micro-LED chips; forming a light shielding layer on the temporary substrate; forming a light-transmissible packaging layer to cover the light shielding layer and the micro-LED chips; removing the temporary substrate to form a light emitting assembly; dividing the light emitting assembly to separate a plurality of pixels constituted by the micro-LEDs; and transferring the pixels to a permanent substrate.

Abstract: An example computing device includes a power switch, a power management device to control a power state change of the computing device based on a command from a power control device, and a controller. The controller is to, in response to receiving a power control request message from an external device, change the power control device from the power switch to the external device.

Abstract: A retractable card reader is described herein. In some examples, the retractable card reader can comprise a reader body having an incision to insert a card and a rotatable bracket attached to the reader body to guide the card into the reader body.

Abstract: In some examples, an apparatus can include a first locking member, the first locking member including a column, a first magnet movably located in the first locking member, a second locking member rotatably connected to the column, and a second magnet located in the second locking member, where when the first magnet is in a disengaged position, the second locking member is rotatable about the column, and when the first magnet is translated from the disengaged position to an engaged position in the first locking member, a magnetic force is created between the first magnet and the second magnet to align the first locking member and the second locking member.

Abstract: A mixed light light-emitting diode device includes first, second, and third chips, each having a first-type semiconductor layer with a first surface, a second-type semiconductor layer with a second surface opposite to the first surface, and a third surface indenting from the first surface and situated on the second-type semiconductor layer. The second and third chips have their first surfaces disposed above and facing the first surface of the first chip. A first-type electrode penetrates through the second and first surfaces of the first chip and contacts all first surfaces of first, second, and third chips. Two second-type electrodes each penetrates through the second and third surfaces of the first chip and connect the first chip to one of the second and third chips.

Abstract: A method for transferring micro light emitting diodes (micro-LEDs) includes forming a plurality of micro light emitting diode (micro-LED) chips having an epitaxial stacked layer and an electrode on a base; attaching the electrodes of the micro-LED chips to a temporary substrate and removing the base from the micro-LED chips; forming a light shielding layer on the temporary substrate; forming a light-transmissible packaging layer to cover the light shielding layer and the micro-LED chips; removing the temporary substrate to form a light emitting assembly; dividing the light emitting assembly to separate a plurality of pixels constituted by the micro-LEDs; and transferring the pixels to a permanent substrate.

Abstract: A chip on board (COB) display device includes a substrate, an array of spaced-apart micro light-emitting diode (LED) chips, a light-shielding layer, and an anti-glare layer. The micro LED chips are disposed on the substrate to define thereamong, a recessed portion recessed relative to the micro LED chips. The light-shielding layer is filled in the recessed portion. The anti-glare layer is disposed to cover the light-shielding layer and the micro LED chips, and has a surface which is opposite to the substrate and which is formed with a patterned microstructure. A method for making the COB display device is also disclosed herein.

Abstract: An electronic device includes a lens assembly, a lens focusing rod, a power switch and a lens protective cover. When the lens protective cover is located in the first position, the lens assembly is shielded by the lens protective cover, the power switch is turned off, and the lens protective cover is separated from the lens focusing rod. When the lens protective cover is located in the second position, the power switch is turned on, and the lens protective cover is contacted with the lens focusing rod. When the lens protective cover is moved between the second position and the third position, the power switch is turned on, and the lens assembly is driven by the lens protective cover through the lens focusing rod for focusing operation.

Abstract: An electronic device includes a lens assembly, a lens focusing rod, a power switch and a lens protective cover. When the lens protective cover is located in the first position, the lens assembly is shielded by the lens protective cover, the power switch is turned off, and the lens protective cover is separated from the lens focusing rod. When the lens protective cover is located in the second position, the power switch is turned on, and the lens protective cover is contacted with the lens focusing rod. When the lens protective cover is moved between the second position and the third position, the power switch is turned on, and the lens assembly is driven by the lens protective cover through the lens focusing rod for focusing operation.