Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a substrate having a base portion and a fin portion over the base portion. The semiconductor device structure includes an isolation layer over the base portion and surrounding the fin portion. The semiconductor device structure includes a metal gate stack over the isolation layer and wrapping around an upper part of the fin portion. The metal gate stack includes a gate dielectric layer and a metal gate electrode layer over the gate dielectric layer, and the gate dielectric layer includes fluorine. A first part of the isolation layer is not covered by the metal gate stack, the first part includes fluorine, and a first concentration of fluorine in the first part increases toward a first top surface of the first part.

Abstract: A manufacturing method of a semiconductor structure includes the following steps. A first wafer is provided. The first wafer includes a first substrate and a first device layer. A second wafer is provided. The second wafer includes a second substrate and a second device layer. The second device layer is bonded to the first device layer. An edge trimming process is performed on the first wafer and the second wafer to expose a first upper surface of the first substrate and a second upper surface of the first substrate and to form a damaged region in the first substrate below the first upper surface and the second upper surface. The second upper surface is higher than the first upper surface. A first photoresist layer is formed. The first photoresist layer is located on the second wafer and the second upper surface and exposes the first upper surface and the damaged region. The damaged region is removed by using the first photoresist layer as a mask. The first photoresist layer is removed.

Abstract: A semiconductor device includes a semiconductor layer. A gate structure is disposed over the semiconductor layer. A spacer is disposed on a sidewall of the gate structure. A height of the spacer is greater than a height of the gate structure. A liner is disposed on the gate structure and on the spacer. The spacer and the liner have different material compositions.

Abstract: An image displaying device includes a planar display panel and a light penetrating unit. The planar display panel displays a plane image. The planar display panel at least includes a first pixel group, a second pixel group and a third pixel group. The second pixel group is located between the first pixel group and the third pixel group. When vision passes through the light penetrating unit toward the planar display panel, the vision acquires a second distance of a second imaging position within the plane image relevant to the second pixel group relative to the planar display panel being greater than a first distance of a first imaging position within the plane image relevant to the first pixel group relative to the planar display panel and a third distance of a third imaging position within the plane image relevant to the third pixel group relative to the planar display panel.

Abstract: Techniques pertaining to power saving by data throughput pattern prediction in wireless communications are described. A user equipment (UE) determines whether a probability of a first value being greater than a second value is higher than a threshold. The UE triggers a radio resource control (RRC) connection release with a network responsive to the probability being higher than the threshold. The first value represents a succeeding continuous duration of no uplink (UL) and downlink (DL) data. The second value represents an RRC inactivity timer duration plus a threshold duration.

Abstract: A semiconductor device includes a first transistor and a second transistor. The first transistor includes: a first source and a first drain separated by a first distance, a first semiconductor structure disposed between the first source and first drain, a first gate electrode disposed over the first semiconductor structure, and a first dielectric structure disposed over the first gate electrode. The first dielectric structure has a lower portion and an upper portion disposed over the lower portion and wider than the lower portion. The second transistor includes: a second source and a second drain separated by a second distance greater than the first distance, a second semiconductor structure disposed between the second source and second drain, a second gate electrode disposed over the second semiconductor structure, and a second dielectric structure disposed over the second gate electrode. The second dielectric structure and the first dielectric structure have different material compositions.

Abstract: Examples of providing access to a switch of an electronic device are described herein. In an example, a housing of the electronic device includes a sidewall having an opening to receive an external actuator to access a switch of the electronic device. The housing further includes a first bracket and a second bracket, both movably coupled to the sidewall. The first bracket includes an actuator opening, which when aligned with the opening of the sidewall, allows the external actuator to access the switch. Further, the second bracket is moveable to co-operate with the first bracket to align the actuator opening with the opening to provide access to the switch.

Abstract: Examples of providing access to a switch of an electronic device are described herein. In an example, a housing of the electronic device includes a sidewall having an opening to receive an external actuator to access a switch of the electronic device. The housing further includes a first bracket and a second bracket, both movably coupled to the sidewall. The first bracket includes an actuator opening, which when aligned with the opening of the sidewall, allows the external actuator to access the switch. Further, the second bracket is moveable to co-operate with the first bracket to align the actuator opening with the opening to provide access to the switch.

Abstract: In an example, an enclosure lock may include a lock port disposed in a device enclosure, the lock port to receive a device lock. The enclosure lock may also include a lock latch, which may be disposed within such a device enclosure. The lock latch may be movable from a released position to a locked position by the device lock if the device lock is engaged with the lock port. The lock latch may engage with an enclosure ledge of the device enclosure if the lock latch is disposed in the locked position such that the device enclosure is not able to be disassembled.

Abstract: A camera module includes a base and at least one camera unit. The camera unit is mounted on the base, and the camera unit includes a circuit substrate, an image sensor, a lens assembly, a circuit board, a plurality of metal wires. The circuit substrate is rectangular, and has four edges and a plurality of first pads. The first pads are located along two adjacent edges of the circuit substrate. The image sensor and the lens assembly are mounted on the circuit substrate. The circuit board has two notched edges and a plurality of second pads. The second pads are located along the two notched edges of the circuit board. The second pads correspond to the first pads. Each second pad is connected to a corresponding first pad by one of the metal wires. The camera module uses wire bonding to connect the circuit substrate to the circuit board.

Abstract: A method for screening samples for building a prediction model and a computer program product thereof are provided. When a set of new sample data is added to a dynamic moving window (DMW), a clustering step is performed with respect to all of the sets of sample data within the window for grouping the sets of sample data with similar properties as one group. If the number of the sets of sample data in the largest group is greater than a predetermined threshold, it means that there are too many sets of sample data with similar properties in the largest group, and the oldest sample data in the largest group can be deleted; if smaller than or equal to a predetermined threshold, it means that the sample data in the largest group are quite unique, and should be kept for building or refreshing the prediction model.

Abstract: A method for searching, analyzing, and optimizing process parameters and a computer product thereof are provided. At first, sets of process data that are generated when a process tool processes workpieces are obtained respectively, each set of process data including process parameters. Then, sets of metrology data measured by a metrology tool are obtained, wherein the sets of metrology data are corresponding to the sets of the process data in a one-to-one manner, each workpiece having at least one measurement point, each set of metrology data including at least one actual measurement value of at least one measurement item at the at least one measurement point. Thereafter, critical parameters are selected from the process parameters. Then, values of the critical parameters are adjusted to enable predicted measurement values of the measurement points of one workpiece to meet a quality target value.

Abstract: An advanced process control (APC) system, an APC method, and a computer program product, which, when executed, performs an APC method are provided for incorporating virtual metrology (VM) into APC. The present inventions uses a reliance index (RI) and a global similarity index (GSI) to adjust at least one controller gain of a run-to-run (R2R) controller when the VM value of a workpiece is adopted to replace the actual measurement value of the workpiece. The RI is used for gauging the reliability of the VM value, and the GSI is used for assessing the degree of similarity between the set of process data for generating the VM value and all the sets of historical process data used for building the conjecturing model.

Abstract: A method of handling packet loss uses error-correcting codes and block rearrangement. This method divides the original data stream into data blocks, then codes the blocks by error-correcting codes. After coding the blocks, rearranges the coding blocks for spreading original data into new blocks and then transmitting the new blocks. After receiving the transmitted blocks, reverse-rearrangs the received blocks and decode the blocks. Combine the decoded blocks into original data stream in the end.

Abstract: The present invention provides a stand assembly for supporting an electronic device. The stand assembly includes a main stand member and an auxiliary stand member. The main stand member includes a first stand and a second stand. The first stand is pivotally connected to the electronic device. The second stand is pivotally connected to the first stand and capable of sliding relative to the electronic device. The auxiliary stand member is pivotally connected to the electronic device.

Abstract: An advanced process control (APC) system, an APC method, and a computer program product, which, when executed, performs an APC method are provided for incorporating virtual metrology (VM) into APC. The present inventions uses a reliance index (RI) and a global similarity index (GSI) to adjust at least one controller gain of a run-to-run (R2R) controller when the VM value of a workpiece is adopted to replace the actual measurement value of the workpiece. The RI is used for gauging the reliability of the VM value, and the GSI is used for assessing the degree of similarity between the set of process data for generating the VM value and all the sets of historical process data used for building the conjecturing model.

Abstract: A method of handling packet loss uses errorcorrecting codes and block rearrangement. This method divides the original data stream into data blocks, then codes the blocks by errorcorrecting codes. After coding the blocks, rearranges the coding blocks for spreading original data into new blocks and then transmitting the new blocks. After receiving the transmitted blocks, reverserearrangs the received blocks and decode the blocks. Combine the decoded blocks into original data stream in the end.

Abstract: An Internet telephone includes a main body and a function module. The main body includes a recess. One side of the function module has a first function section, and the other side has a second function section. The function module is electrically connected with the main body through an end of the first function section while the function module is assembled into the recess and exposes the first function section. Furthermore, the function module can be flipped to expose the second function section before assembling into the recess and electrically connected with the main body through an and of the second function module.

Abstract: The present invention provides a stand assembly for supporting an electronic device. The stand assembly includes a main stand member and an auxiliary stand member. The main stand member includes a first stand and a second stand. The first stand is pivotally connected to the electronic device. The second stand is pivotally connected to the first stand and capable of sliding relative to the electronic device. The auxiliary stand member is pivotally connected to the electronic device.

Abstract: A camera module with a hinge mechanism is installed on an electronic device. The camera module housing has two hollow cylinder-shaped shafts at two opposite ends. Two hollow cylinder-shaped shafts are pivotally connected with the electronic device. A camera is disposed in the housing. A hinge portion is configured inside at least one of the two hollow cylinder-shaped shafts. Two ends of the hinge portion are first and second brackets, which are respectively secured to ground terminals of the camera module and the electronic device. A first cam is secured to the first bracket. A connection shaft, of which one end is secured to the second bracket, goes through a spring, through holes of a second cam, the first cam and the first bracket. When the housing rotates, interactions among the spring, the first cam and the second cam provide regional positioning and regional automatic rotation functionalities.