Patents by Inventor Wei NMI Koh

Wei NMI Koh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5856235
    Abstract: A thin-film microcircuit comprising fabricating a substrate of high-purity, densely packed alumina ceramic with a fine grain size, and metallization deposited thereon and applying a vacuum anneal to the metallization.
    Type: Grant
    Filed: April 12, 1995
    Date of Patent: January 5, 1999
    Assignee: Northrop Grumman Corporation
    Inventors: Wei NMI Koh, Wesley J. Louie