Patents by Inventor Wei O. Shi

Wei O. Shi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit package to provide high-bandwidth communication among multiple dice
    Patent number: 7348678
    Abstract: A system may include a microprocessor die, an integrated circuit package substrate, and a die disposed between the microprocessor die and the integrated circuit package substrate. In some embodiments, the integrated circuit package substrate defines a first cavity, and the die is disposed at least partially within the first cavity.
    Type: Grant
    Filed: December 21, 2005
    Date of Patent: March 25, 2008
    Assignee: Intel Corporation
    Inventors: Qing A. Zhou, Wei O. Shi, Jiangqi He, Daoqiang Lu