Abstract: A semiconductor package is disclosed. The semiconductor package includes a package substrate. The semiconductor package includes a semiconductor die having a first surface attached to the package substrate and a second surface. The semiconductor package includes a heat sink attached to the second surface of the semiconductor die. The semiconductor package includes a heat dissipation layer interposed between the heat sink and the semiconductor die. The heat dissipation layer comprises one or more high-k dielectric materials.

Abstract: Electronic design automation (EDA) of the present disclosure, in various embodiments, optimizes designing, simulating, analyzing, and verifying of one or more electronic architectural designs for an electronic device. The EDA of the present disclosure identifies one or more electronic architectural features from the one or more electronic architectural designs. In some situations, the EDA of the present disclosure can manipulate one or more electronic architectural models over multiple iterations using a machine learning process until one or more electronic architectural models from among the one or more electronic architectural models satisfy one or more electronic design targets. The EDA of the present disclosure substitutes the one or more electronic architectural models that satisfy the one or more electronic design targets for the one or more electronic architectural features in the one or more electronic architectural designs to optimize the one or more electronic architectural designs.

Abstract: A diagnostic system includes: a processor, arranged to extract a plurality of coordinates of a plurality of pins on an outer surface of a design layout according to a plurality of tagging texts labeling the plurality of pins respectively, and arranged to generate a design exchange format file according to the plurality of coordinates, wherein an order of the plurality of tagging texts are sorted by a predetermined scanning sequence; and a chip diagnostic tool, arranged to scan the plurality of scan components in a physical circuit on a testing platform through the plurality of pins on the outer surface of the physical circuit by following the predetermined scanning sequence to determine a defect component in the physical circuit according to the design exchange format file; wherein the physical circuit corresponds to the design layout.

Abstract: Electronic design automation (EDA) of the present disclosure, in various embodiments, optimizes designing, simulating, analyzing, and verifying of one or more electronic architectural designs for an electronic device. The EDA of the present disclosure identifies one or more electronic architectural features from the one or more electronic architectural designs. In some situations, the EDA of the present disclosure can manipulate one or more electronic architectural models over multiple iterations using a machine learning process until one or more electronic architectural models from among the one or more electronic architectural models satisfy one or more electronic design targets. The EDA of the present disclosure substitutes the one or more electronic architectural models that satisfy the one or more electronic design targets for the one or more electronic architectural features in the one or more electronic architectural designs to optimize the one or more electronic architectural designs.

Abstract: Electronic design automation (EDA) of the present disclosure, in various embodiments, optimizes designing, simulating, analyzing, and verifying of one or more electronic architectural designs for an electronic device. The EDA of the present disclosure identifies one or more electronic architectural features from the one or more electronic architectural designs. In some situations, the EDA of the present disclosure can manipulate one or more electronic architectural models over multiple iterations using a machine learning process until one or more electronic architectural models from among the one or more electronic architectural models satisfy one or more electronic design targets. The EDA of the present disclosure substitutes the one or more electronic architectural models that satisfy the one or more electronic design targets for the one or more electronic architectural features in the one or more electronic architectural designs to optimize the one or more electronic architectural designs.

Abstract: A diagnostic system includes: a processor, arranged to extract a plurality of coordinates of a plurality of pins on an outer surface of a design layout according to a plurality of tagging texts labeling the plurality of pins respectively, and arranged to generate a design exchange format file according to the plurality of coordinates, wherein an order of the plurality of tagging texts are sorted by a predetermined scanning sequence; and a chip diagnostic tool, arranged to scan the plurality of scan components in a physical circuit on a testing platform through the plurality of pins on the outer surface of the physical circuit by following the predetermined scanning sequence to determine a defect component in the physical circuit according to the design exchange format file; wherein the physical circuit corresponds to the design layout.

Abstract: A diagnostic system includes a location extractor, a file generator, and a chip diagnostic tool. The location extractor is arranged to extract at least a coordinate of at least one component in an intellectual property design layout of an integrated circuit design layout according to at least one tagging text labeling the at least one component in the intellectual property design layout. The file generator is arranged to generate a format file according to the at least coordinate. The chip diagnostic tool is arranged to scan a physical intellectual property circuit in a physical integrated circuit to determine a defect component in the physical intellectual property circuit according to the format file. The physical intellectual property circuit corresponds to the intellectual property design layout, and the physical integrated circuit corresponds to the integrated circuit design layout.

Abstract: Electronic design automation (EDA) of the present disclosure, in various embodiments, optimizes designing, simulating, analyzing, and verifying of one or more electronic architectural designs for an electronic device. The EDA of the present disclosure identifies one or more electronic architectural features from the one or more electronic architectural designs. In some situations, the EDA of the present disclosure can manipulate one or more electronic architectural models over multiple iterations using a machine learning process until one or more electronic architectural models from among the one or more electronic architectural models satisfy one or more electronic design targets. The EDA of the present disclosure substitutes the one or more electronic architectural models that satisfy the one or more electronic design targets for the one or more electronic architectural features in the one or more electronic architectural designs to optimize the one or more electronic architectural designs.

Abstract: Provided is a monolithic stacked integrated circuit (IC). The IC includes a first layer over a substrate and a second layer over the first layer. The first layer includes first circuit elements where a first portion of the first circuit elements has a defect. The second layer includes second circuit elements. The IC further includes interconnect elements coupling the first portion to a second portion of the second circuit elements for mitigating the defect.

Abstract: A diagnostic system includes a location extractor, a file generator, and a chip diagnostic tool. The location extractor is arranged to extract at least a coordinate of at least one component in an intellectual property design layout of an integrated circuit design layout according to at least one tagging text labeling the at least one component in the intellectual property design layout. The file generator is arranged to generate a format file according to the at least coordinate. The chip diagnostic tool is arranged to scan a physical intellectual property circuit in a physical integrated circuit to determine a defect component in the physical intellectual property circuit according to the format file. The physical intellectual property circuit corresponds to the intellectual property design layout, and the physical integrated circuit corresponds to the integrated circuit design layout.

Abstract: An integrated circuit (IC) semiconductor device has a high oxide definition (OD) density region, a low OD density region adjacent to the high OD density region, and dummy cells in the high OD density region and the low OD density region to smooth a density gradient between the high OD density region and the low OD density region.

Abstract: Among other things, an integrated circuit and method for routing electrical pathways of an integrated circuit is provided. The integrated circuit comprises a buffer chain coupling a first cell of the integrated circuit to a second cell of the integrated circuit. An electrical pathway coupling a first inverter of the buffer chain with a second inverter of the buffer chain extends through a first set of metal layers and is routed to form a pulse-like shape having an apex at a top layer of the first set.

Abstract: Provided is a monolithic stacked integrated circuit (IC). The IC includes a first layer over a substrate and a second layer over the first layer. The first layer includes first circuit elements where a first portion of the first circuit elements has a defect. The second layer includes second circuit elements. The IC further includes interconnect elements coupling the first portion to a second portion of the second circuit elements for mitigating the defect.

Abstract: An integrated circuit (IC) semiconductor device has a high oxide definition (OD) density region, a low OD density region adjacent to the high OD density region, and dummy cells in the high OD density region and the low OD density region to smooth a density gradient between the high OD density region and the low OD density region.

Abstract: The present disclosure relates to a diagnosis framework to shorten yield learning cycles of technology node manufacturing processes from the high defect density stage to technology maturity. A plurality of defect under test (DUT) structures are designed to capture potential manufacturing issues associated with defect formation. A test structure is formed by arranging the DUT structures within a DUT carrier unit, which has been yield-hardened though heuristic yield analysis such that a defect density of the DUT carrier unit is essentially zero. Possible outcomes of an application of test patterns and various failure scenarios associated with defects formed within the DUT structures within the DUT carrier unit are simulated and stored in a look-up table (LUT). The LUT may then be referenced to determine a location of a defect within the test structure without the need for iterative analysis to correctly select defect candidates for physical failure analysis (PFA).

Abstract: A pull cell scan flip-flop includes a scan flip-flop and a pull cell. The pull cell is configured to receive a scan flip-flop output signal from the scan flip-flop, the scan flip-flop output signal having a scan flip-flop output value. The pull cell is configured to receive a scan-enable signal and to generate a modified flip-flop output signal. The modified flip-flop output signal has a specified fixed value responsive to the scan-enable signal having a first logic value, and the modified flip-flop output signal has the scan flip-flop output value responsive to the scan-enable signal having a second logic value.

Abstract: A method of reducing an oxide definition (OD) density gradient in an integrated circuit (IC) semiconductor device having a placed layout and a set of design rule checking (DRC) rules associated with the placed layout. The method includes computing OD density in insertion regions from OD density information corresponding to the placed layout to identify an OD density gradient. The method further includes selecting and adding dummy cells to at least one insertion region to reduce the OD density gradient.

Abstract: Provided is a monolithic stacked integrated circuit (IC). The IC includes a first layer over a substrate and a second layer over the first layer. The first layer includes a first plurality of circuit elements where a first portion of the first plurality of circuit elements has defects. The second layer includes a second plurality of circuit elements. The IC further includes interconnect elements coupling the first portion to a second portion of the second plurality of circuit elements for mitigating the defects.

Abstract: System and method for diagnosing failures within an integrated circuit is provided. In an embodiment, the apparatus includes a diagnostic cell coupled in series with a buffer chain. The diagnostic cell includes a plurality of logic operators that when activated invert a signal received from the buffer chain. The inversion of the signal from the buffer chain allows the diagnostic cell to determine the location of a failure within an integrated circuit previously determined by a scan chain design for test methodology to contain a failure.

Abstract: Among other things, an integrated circuit and method for routing electrical pathways of an integrated circuit is provided. The integrated circuit comprises a buffer chain coupling a first cell of the integrated circuit to a second cell of the integrated circuit. An electrical pathway coupling a first inverter of the buffer chain with a second inverter of the buffer chain extends through a first set of metal layers and is routed to form a pulse-like shape having an apex at a top layer of the first set.