Abstract: A composite with hollow nano-structures includes multiple one dimensional hollow nanowires being dispersed into a polymer film. The polymer film is flexible, a dielectric constant of the one dimensional hollow nanowire is lower than a dielectric constant of the polymer film, and a dielectric constant of the composite is between the dielectric constant of the one dimensional hollow nanowire and the dielectric constant of the polymer film.

Abstract: A method for manufacturing a copper foil with a rough surface in a plating tank includes causing an electrolyte solution to flow between an anode and a cathode with a current density of 5 ASF-40 ASF. The copper foil with a rough surface including dense nodules of single copper crystals is deposited on the cathode. The electrolyte solution includes chloride ions (20 ppm-80 ppm), polyethylene glycol (PEG) with a molecular weight of 400-8000 (100 ppm-700 ppm), sulfuric acid (20 g/L-200 g/L), copper sulfate pentahydrate (70 g/L-320 g/L) and a sulfur compound (1 ppm-60 ppm).

Abstract: A composite with hollow nano-structures comprises multiple one dimensional hollow nanowires being dispersed into a polymer film; the polymer film is flexible; a dielectric constant of the one dimensional hollow nanowire is lower than a dielectric constant of the polymer film; and a dielectric constant of the composite is between the dielectric constant of the one dimensional hollow nanowire and the dielectric constant of the polymer film.

Abstract: Non-conductive substrates, especially the sidewalls of micro/nano holes thereof are chemically modified (i.e., chemically grafted) by reduced graphene oxide (rGO). The rGO possesses excellent electrical conductivity and therefore the modified substrates become conductive, so that it can be directly electroplated. These rGO-grafted holes can pass thermal shock reliability test after electroplating. The rGO grafting process possesses many advantages, such as a short process time, no complex agent (i.e., no chelator), no toxic agents (i.e., formaldehyde for electroless Cu deposition). It is employed in an aqueous solution instead of an organic solvent, and therefore is environmentally friendly and beneficial for industrial production.

Abstract: A method for manufacturing a copper foil with a rough surface in a plating tank includes causing an electrolyte solution to flow between an anode and a cathode with a current density of 5 ASF-40 ASF. The copper foil with a rough surface including dense nodules of single copper crystals is deposited on the cathode. The electrolyte solution includes chloride ions (20 ppm-80 ppm), polyethylene glycol (PEG) with a molecular weight of 400-8000 (100 ppm-700 ppm), sulfuric acid (20 g/L-200 g/L), copper sulfate pentahydrate (70 g/L-320 g/L) and a sulfur compound (1 ppm-60 ppm).

Abstract: The method for producing a transparent conductive substrate includes forming metal meshes on a flexible non-conductive substrate with high transmittance. It's unnecessary to use palladium as a catalyst in this method. The metal meshes are in the form of nano/micro wires and the conductive substrate has high transmittance of 80%-90% at visible light wavelengths of 390-750 nm.

Abstract: A film of single crystal copper is manufactured by means of electrodeposition without heat treatment. The grains of the single crystal copper have an average size of at least 10 ?m. The electrolytic solution used in the method contains chloride ions, a wetting agent, sulfuric acid, CuSO4.5H2O and alkanesulfonate sulfide. The ultra-large copper grains of the present invention contain very few impurities and thus possess low resistance, high conductivity, shining appearance and anti-fingerprint property.

Abstract: The method for producing a transparent conductive substrate includes forming metal meshes on a flexible non-conductive substrate with high transmittance. It's unnecessary to use palladium as a catalyst in this method. The metal meshes are in the form of nano/micro wires and the conductive substrate has high transmittance of 80%-90% at visible light wavelengths of 390-750 nm.

Abstract: Non-conductive substrates, especially the sidewalls of micro/nano holes thereof are chemically modified (i.e., chemically grafted) by reduced graphene oxide (rGO). The rGO possesses excellent electrical conductivity and therefore the modified substrates become conductive, so that it can be directly electroplated. These rGO-grafted holes can pass thermal shock reliability test after electroplating. The rGO grafting process possesses many advantages, such as a short process time, no complex agent (i.e., no chelator), no toxic agents (i.e., formaldehyde for electroless Cu deposition). It is employed in an aqueous solution instead of an organic solvent, and therefore is environmentally friendly and beneficial for industrial production.

Abstract: A method for coating a layer of reduced graphene oxide (rGO) on the surface of substrate holes (especially holes with high aspect ratio) includes a serial wet process steps of hydrophilic treatment of the surface of the substrate, self-assembly of a silane layer, steps of grafting of a polymer layer, grafting of graphene oxide (GO), intercalation of metal ions, and intercalation of metal atom/rGO intercalation. The method further includes the decoration of conductive metals (copper or nickel tungsten) plug on the rGO layer in holes by electroplating process.

Abstract: An additive for copper plating comprising, as an effective ingredient, a nitrogen-containing biphenyl derivative represented by the following formula (I): [wherein X represents a group selected from the following groups (II)-(VII): and Y represents a lower alkyl group, lower alkoxy group, nitro group, amino group, sulfonyl group, cyano group, carbonyl group, 1-pyridyl group, or the formula (VIII): (wherein R? represents a lower alkyl group)], a copper plating solution formed by adding the additive for copper plating to a copper plating solution containing a copper ion ingredient and an anion ingredient, and a method of manufacturing on an electronic circuit substrate having a fine copper wiring circuit, which comprises electroplating in the copper plating solution using as the cathode an electronic circuit substrate in which fine microholes or microgrooves in the shape of an electronic circuit are formed on the surface.

Abstract: A method of analyzing accelerator of copper electroplating includes a selective adsorption step and an electrochemical deposition step. First, a gold electrode is placed into a plating solution, which contains organic additives. Then, the gold electrode is dipped in the plating solution for a while to adsorb the sulfur-containing accelerators. After the sulfur-containing accelerators are adsorbed on the gold electrode, the gold electrode is rinsed with Milli-Q ultra pure water. Then, the gold electrode is put into an electrolyte, which contains PEG and chloride ions to carry out a cathodic cyclic voltammetry (CCV) for copper deposition on the gold electrode. A calibration curve for the accelerator analysis can be obtained by integrating the polarization curve measured from the CCV.

Abstract: A method for monitoring the filling performance of a copper plating formula for microvia filling includes measuring a first potential value at a first rotation speed and a second potential value at a second rotation speed with a Cu-RDE of a plating solution. Then, a potential difference is obtained by subtracting the potential measured at the second rotation speed from the first rotation speed. The filling performance is defined by the potential difference; that is, a high potential difference indicates a good filling performance.