Patents by Inventor Wei Qi
Wei Qi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11965826Abstract: The present invention provides a method for determining hydrogen sulfide (H2S) by headspace single-drop liquid phase microextraction and intelligent device colorimetry, which comprises: taking a silver-gold core-shell triangular nanosheet (Ag@Au TNS) as a nanodetection probe, in combination with an analysis method of headspace single-drop microextraction (HS-SDME), specifically extracting H2S volatilized from a sample to be detected by the nanodetection probe, and detecting H2S in the extracted sample with the help of the photographing function of an intelligent device and a color picking software. Compared with the prior art, the present invention adopts intelligent device colorimetry, with the limit of detection of about 65 nM and the linear range of 0.1-100 ?M, and the established method can be applied to the determination of H2S in actual samples such as egg white, milk and other opaque samples, and has the advantages of few procedures, simple operation, high detection efficiency and the like.Type: GrantFiled: February 28, 2020Date of Patent: April 23, 2024Assignee: JIANGSU UNIVERSITY OF SCIENCE AND TECHNOLOGYInventors: Sheng Tang, Wei Shen, Tong Qi, Mengchan Xu, Mengyuan Xu, Anni Zhu
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Patent number: 11962357Abstract: The present disclosure provides a method and system for testing wireless performance of a wireless terminal configured as a DUT having multiple transmitting antennas and placed in an anechoic chamber. The method includes: obtaining antenna pattern of the multiple transmitting antennas, and importing the antenna pattern into a channel emulator; selecting a same number of testing antennas in the anechoic chamber as a number of the transmitting antennas; the selected testing antennas receiving a signal from the transmitting antennas, and sending the signal to the channel emulator, the channel emulator processing the signal to generate an analog signal and sending the analog signal to an analog base station; and the analog base station receiving the analog signal and performing a throughput test to obtain an uplink wireless performance test of the DUT.Type: GrantFiled: May 26, 2021Date of Patent: April 16, 2024Assignee: GENERAL TEST SYSTEMS INC.Inventors: Yihong Qi, Wei Yu, Penghui Shen
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Publication number: 20240116707Abstract: A powered industrial truck includes a lateral movement assembly including four sliding members and four pivotal members both on a wheeled carriage, four links having a first end pivotably secured to the sliding member and a second end pivotably secured to either end of the pivotal member, a motor shaft having two ends pivotably secured to the pivotal members respectively, a first electric motor on one frame member, and four mounts attached to the sliding members respectively; two lift assemblies including a second electric motor, a shaft having two ends rotatably secured to the sliding members respectively, two gear trains at the ends of the shaft respectively, a first gear connected to the second electric motor, a second gear on the shaft, and a first roller chain on the first and second gears; two electric attachments on the platform and being laterally moveable, each attachment. The mount has rollers.Type: ApplicationFiled: September 21, 2023Publication date: April 11, 2024Inventors: Jung-Chieh Chang, Yi-Sheng Chen, Jen-Yung Hsiao, Chia-Fu Hsiao, Wei-Qi Lao, Chen-Chih Chan, Chung-Yu Liu
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Patent number: 11947372Abstract: A device includes a voltage regulator circuit configured to pull up a voltage at an output terminal to equal to half of a supply voltage; multiple first transistors coupled between the output terminal and a voltage terminal providing the supply voltage; and a control circuit configured to pull down gate voltages of the first transistors from the supply voltage to a voltage level between the supply voltage and a ground voltage at a first time. The first transistors are configured to pull up the voltage at the output terminal to the supply voltage at a second time.Type: GrantFiled: January 18, 2023Date of Patent: April 2, 2024Assignees: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., TSMC CHINA COMPANY LIMITEDInventors: Yong-Liang Jin, Ya-Qi Ma, Wei Li, Di Fan
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Publication number: 20240106406Abstract: A packaging structure of a film bulk acoustic resonator includes a resonant cavity main structure that includes a first substrate and a film bulk acoustic resonant structure over the first substrate with a first cavity formed there-between. A resonator cover includes a second substrate and an elastic bonding material layer that has lost elasticity and is sandwiched between the second substrate and the film bulk acoustic resonant structure. The elastic bonding material layer contains a second cavity, and the second cavity is at least partially aligned with the first cavity. A through-hole is formed through the resonator cover on a periphery of the second cavity and exposes a corresponding electrical connection part of the film bulk acoustic resonant structure. A conductive interconnection layer covers a sidewall of the through-hole and a portion of a surface of the resonator cover on a periphery of the through-hole.Type: ApplicationFiled: December 6, 2023Publication date: March 28, 2024Inventors: Hailong LUO, Wei LI, Fei QI
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Publication number: 20240105377Abstract: A magnetic structure can include: a first magnetic component and a second magnetic component; two magnetic columns configured to form a magnetic flux loop with at least part of the first magnetic component and at least part of the second magnetic component, where at least one of the two magnetic columns is wound with one or more windings; and where the at least part of the first magnetic component is located between the two magnetic columns.Type: ApplicationFiled: September 15, 2023Publication date: March 28, 2024Inventors: Gao Fan, Yu Qi, Wei Chen
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Patent number: 11937677Abstract: A piece of luggage including a main body and a power supplying module is disclosed. The main body includes a moving module including a plurality of wheels and a main motor and a power unit electrically connected to the moving module. The wheels include an active wheel electrically connected to the main motor. The power supplying module includes a power supplying unit including a power supplying box and a battery and a connecting unit including a connecting part, a holding part and a conducting wire. The power supplying box has an output port. The battery is disposed in the power supplying box and electrically connected to the output port. The connecting part has a power port corresponding to the output port. The holding part and the conducting wire are connected to the connecting part. The conducting wire is electrically connected to the power port and the power unit.Type: GrantFiled: September 26, 2019Date of Patent: March 26, 2024Assignee: LINGDONG TECHNOLOGY (BEIJING) CO. LTDInventors: Wei Song, Herrickhui Yaozhang, Song Li, Ou Qi, Yaming Tang, Botao Zheng, Guopeng Zhang
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Patent number: 11940382Abstract: A homogeneous assay method that employs a device is provided. In some embodiments, the device contains a pair of plates that can be opened and closed. The sample is placed between two plates. In some embodiments, the thickness of the sample in a closed configuration, the concentration of labels, and amplification factor of the amplification surface are configured to make the label(s) bound on the amplification surface visible without washing away of the unbound labels.Type: GrantFiled: February 8, 2018Date of Patent: March 26, 2024Assignee: Essenlix CorporationInventors: Stephen Y. Chou, Wei Ding, Yufan Zhang, Ji Qi, Ji Li
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Publication number: 20240093443Abstract: Disclosed in the present disclosure is a double-deck multi-span bridge construction method. According to the double-deck bridge construction method of the present disclosure, construction is carried out by using a method of disassembling a support jig frame in a graded and span-separated mode, an upper chord jig frame and a lower chord jig frame can be used in a recycle manner, and construction costs are reduced. In addition, a construction period of building the support jig frame is shortened, and other construction operations can be synchronously carried out on a span in which the jig frame is disassembled, for example, fire retardant coating construction can be carried out on a mounted bridge deck after the jig frame is disassembled, and the construction period of a double-deck multi-span bridge is effectively shortened.Type: ApplicationFiled: September 23, 2021Publication date: March 21, 2024Applicant: CHINA CONSTRUCTION SCIENCE AND INDUSTRY CORPORATION LTD.Inventors: Jinglei REN, Bing SUN, Yonggang GAO, Hongyu SHEN, Shaohui ZHU, Jianguo QI, Cui LIU, Ruihua YAN, Zhiqiang HE, Longfei LI, Sijie YANG, Huaidong ZHANG, Xu CHEN, Wei JIANG, Wenbo LI, Yingwu SUN, Yuhang ZHANG
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Publication number: 20240098166Abstract: Provided is a terminal device, which includes: a light-emitting layer and a cover plate, camera unit; the light-emitting layer includes a first light-emitting layer and a second light-emitting layer; when the first light-emitting layer is located at a first preset position, a first orthographic projection area of the first light-emitting layer in a first direction coincides with a second orthographic projection area of the camera unit, wherein the first direction a direction pointing from the light-emitting layer to the cover plate; and when the first light-emitting layer is located at a second preset position, a third orthographic projection area of the light-emitting layer does not coincide with at least part of the second orthographic projection area.Type: ApplicationFiled: November 1, 2021Publication date: March 21, 2024Inventors: Xipeng LI, Xiaoliang ZHANG, Meijuan SHEN, Lina QI, Wei HUANG
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Patent number: 11933720Abstract: The disclosure provides an apparatus, a device, and methods for improving optical analysis of a thin layer of a sample between two plates, particularly for multiple wavelengths.Type: GrantFiled: June 22, 2020Date of Patent: March 19, 2024Assignee: Essenlix CorporationInventors: Stephen Y. Chou, Wei Ding, Ji Qi, Jun Tian, Wu Chou, Hongbing Li
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Patent number: 11931363Abstract: A compound of Formula (I), or a pharmaceutically acceptable salt thereof, is provided that has been shown to be useful for treating a PRC2-mediated disease or disorder: wherein R1, R2, R3, R4, R5, and n are as defined herein.Type: GrantFiled: October 19, 2021Date of Patent: March 19, 2024Assignee: NOVARTIS AGInventors: Ho Man Chan, Xiang-Ju Justin Gu, Ying Huang, Ling Li, Yuan Mi, Wei Qi, Martin Sendzik, Yongfeng Sun, Long Wang, Zhengtian Yu, Hailong Zhang, Ji Yue (Jeff) Zhang, Man Zhang, Qiong Zhang, Kehao Zhao
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Publication number: 20240087955Abstract: A method and apparatus for forming tungsten features in semiconductor devices is provided. The method includes exposing a top opening of a feature formed in a substrate to a physical vapor deposition (PVD) process to deposit a tungsten liner layer within the feature. The PVD process is performed in a first processing region of a first processing chamber and the tungsten liner layer forms an overhang portion, which partially obstructs the top opening of the feature. The substrate is transferred from the first processing region of the first processing chamber to a second processing region of a second processing chamber without breaking vacuum. The overhang portion is exposed to nitrogen-containing radicals in the second processing region to inhibit subsequent growth of tungsten along the overhang portion. The feature is exposed to a tungsten-containing precursor gas to form a tungsten fill layer over the tungsten liner layer within the feature.Type: ApplicationFiled: September 1, 2023Publication date: March 14, 2024Inventors: Yi XU, Xianyuan ZHAO, Zhimin QI, Aixi ZHANG, Geraldine VASQUEZ, Dien-Yeh WU, Wei LEI, Xingyao GAO, Shirish PETHE, Wenting HOU, Chao DU, Tsung-Han YANG, Kyoung-Ho BU, Chen-Han LIN, Jallepally RAVI, Yu LEI, Rongjun WANG, Xianmin TANG
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Publication number: 20240088594Abstract: The present application provides a cable connector and an electronic device. The cable connector includes a socket and a plug; the socket is provided with an opening and a connection part for connecting with a circuit board; the plug includes a fixing member and an elastic connection member; the elastic connection member each includes a fixing part and a first elastic contact part connected with the fixing part, the fixing part being fixedly connected with the fixing member for connecting with an inner conductor of the cable; the fixing member is capable of connecting with the socket, and enables the first elastic contact part to elastically contact a signal connection contact on the circuit board through the opening to form electrical connection.Type: ApplicationFiled: January 22, 2021Publication date: March 14, 2024Applicant: Zhuhai LinkE Technology Co., Ltd.Inventors: Gang Feng, Changming Wu, Yihong Qi, Wei YU
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Publication number: 20240085304Abstract: The present disclosure relates to devices, apparatus and methods of improving the accuracy of image-based assay, that uses imaging system having uncertainties or deviations (imperfection) compared with an ideal imaging system. One aspect of the present invention is to add the monitoring marks on the sample holder, with at least one of their geometric and/optical properties of the monitoring marks under predetermined and known, and taking images of the sample with the monitoring marks, and train a machine learning model using the images with the monitoring mark.Type: ApplicationFiled: January 18, 2022Publication date: March 14, 2024Applicant: Essenlix CorporationInventors: Xing LI, Wu CHOU, Stephen Y. CHOU, Wei DING, Ji QI
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Publication number: 20240088071Abstract: Methods for reducing resistivity of metal gapfill include depositing a conformal layer in an opening of a feature and on a field of a substrate with a first thickness of the conformal layer of approximately 10 microns or less, depositing a non-conformal metal layer directly on the conformal layer at a bottom of the opening and directly on the field using an anisotropic deposition process. A second thickness of the non-conformal metal layer on the field and on the bottom of the feature is approximately 30 microns or greater. And depositing a metal gapfill material in the opening of the feature and on the field where the metal gapfill material completely fills the opening without any voids.Type: ApplicationFiled: September 14, 2022Publication date: March 14, 2024Inventors: Yi XU, Yu LEI, Zhimin QI, Aixi ZHANG, Xianyuan ZHAO, Wei LEI, Xingyao GAO, Shirish A. PETHE, Tao HUANG, Xiang CHANG, Patrick Po-Chun LI, Geraldine VASQUEZ, Dien-yeh WU, Rongjun WANG
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Patent number: 11927533Abstract: A multi-mode illumination system, including: a first illumination module; a second illumination module; and a third illumination module, as disclosed herein.Type: GrantFiled: November 11, 2022Date of Patent: March 12, 2024Assignee: Essenlix CorporationInventors: Ji Qi, Stephen Y. Chou, Wei Ding
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Patent number: 11926787Abstract: A well cementing method is described for improving cementing quality by controlling the hydration heat of cement slurry. By controlling the degree and/or rate of hydration heat release from cement slurry, the method improves the hydration heat release during formation of cement with curing of cement slurry, improves the binding quality between the cement and the interfaces, and in turn improves the cementing quality at the open hole section and/or the overlap section. The cementing method improves cementing quality of oil and gas wells and reduces the risk of annular pressure.Type: GrantFiled: April 21, 2020Date of Patent: March 12, 2024Assignees: PetroChina Company Limited, CNPC Engineering Technology R&D Company LimitedInventors: Shuoqiong Liu, Hua Zhang, Jianzhou Jin, Ming Xu, Yongjin Yu, Fengzhong Qi, Congfeng Qu, Hong Yue, Youcheng Zheng, Wei Li, Yong Ma, Youzhi Zheng, Zhao Huang, Jinping Yuan, Zhiwei Ding, Chongfeng Zhou, Chi Zhang, Zishuai Liu, Hongfei Ji, Yuchao Guo, Xiujian Xia, Yong Li, Jiyun Shen, Huiting Liu, Yusi Feng, Bin Lyu
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Patent number: 11926608Abstract: The invention discloses a synthesis method and device for rapidly producing lactide at high yield. The method comprises: adding a single component of lactic acid or two components of lactic acid and catalyst, passing the mixture through a mixer to enter an oligomer preparation system, increasing a residence time through bottom circulation, synthesizing oligomeric lactic acid, and passing a gas-phase component through a rectification system. With the adoption of the device, the lactide is capable of being efficiently synthesized, crude lactide with a yield of 94% to 98% is capable of being obtained.Type: GrantFiled: March 4, 2021Date of Patent: March 12, 2024Assignees: NANJING UNIVERSITY, NANJING QUANKAI RESEARCH INSTITUTE OF BIOMATERIALS CO., LTD.Inventors: Wei Jiang, Yunbiao Qi, Ping Sun, Wei Huang, Aimin Li, Quanxing Zhang
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Patent number: 11929574Abstract: An electrical connector with HDMI 2.1 specification, including an insulating body, multiple terminals, and a metallic shell partially enclosing the insulating body and the terminals, is provided. The terminals include ten terminals located in an upper row and nine terminals located in a lower row. The ten terminals are sequentially a first terminal Data2+, a third terminal Data2?, a fifth terminal Data Shield, a seventh terminal Data0+, a ninth terminal Data0?, a eleventh terminal Data3 Shield, a thirteenth terminal CEC, a fifteenth terminal SCL, a seventeenth terminal DDC/CEC Ground, and a nineteenth terminal Hot Plug Detec1 along an arrangement direction. The nine terminals are sequentially a second terminal Data2 Shield, a fourth terminal Data1+, a sixth terminal Data1?, an eighth terminal Data0 Shield, a tenth terminal Data3+, a twelfth terminal Data3?, a fourteenth terminal Utility, a sixteenth terminal SDA, and an eighteenth terminal +5V Power along the arrangement direction.Type: GrantFiled: December 8, 2021Date of Patent: March 12, 2024Assignee: Advanced Connectek Inc.Inventors: Chingtien Chen, Wei Wan, Xiaojuan Qi