Patents by Inventor Wei Qin

Wei Qin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260252777
    Abstract: A magnetic core (iron core) is a crucial component of electromagnetic devices including motors, transformers, and reactors, accounting for approximately 50% of the total weight. In electromagnetic devices like air-core transformers, the magnetic core is absent. However, due to the poor magnetic permeability of air, a large excitation current is required, resulting in weak load capacity, bulky size, and limited application scope. According to the present disclosure, a plurality of vector magnetic circuit components are utilized to construct a virtual magnetic circuit with magnetic permeability similar to or even better than that of a physical magnetic core, constituting a virtual magnetic core. Based on this, an application method is provided for constructing electromagnetic devices, including transformers, reactors, and motors, using the virtual magnetic core, which is capable of achieving significant reductions in the weight and volume of such devices.
    Type: Application
    Filed: February 5, 2026
    Publication date: August 27, 2026
    Inventors: Ming CHENG, Wei QIN, Zhejun LUO, Wei HUA, Zheng WANG, Xinkai ZHU
  • Patent number: 12711917
    Abstract: A display substrate and a display device. The display substrate includes a pixel circuit in which the driving circuit controls a driving current driving the light emitter element to emit light; the first light emission control circuit applies a first voltage to a first terminal of the driving circuit in response to a first light emission control signal; the second light emission control circuit applies the driving current to the light emitter element in response to a second light emission control signal; the first reset circuit applies a first reset voltage to the control terminal of the driving circuit in response to a first reset signal; the first reset signal and the first light emission control signal are simultaneously turn-on signals during a period; the first light emission control line and the second light emission control line extend along a first direction and are arranged in a second direction.
    Type: Grant
    Filed: February 19, 2025
    Date of Patent: August 18, 2026
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Xueling Gao, Kuanjun Peng, Chengchung Yang, Xiangxiang Zou, Wei Qin
  • Publication number: 20260234412
    Abstract: A method of determining a sequence for creating a plurality of wire loops is provided. The method includes (a) providing workpiece data for a workpiece. The workpiece data includes (i) position data for bonding locations of the workpiece, and (ii) wire loop data for a plurality of wire loops providing interconnection between ones of the bonding locations. The method also includes (b) analyzing the workpiece data. The step of analyzing includes considering overlap conditions between ones of the plurality of wire loops, considering wire loop heights of ones of the plurality of wire loops, considering lateral bend conditions between ones of the plurality of wire loops, and considering wire loop positions for ones of the plurality of wire loops. The method also includes (c) providing a sequence of creating the plurality of wire loops in connection with the workpiece at least partially based on the results of step (b).
    Type: Application
    Filed: April 6, 2026
    Publication date: August 13, 2026
    Applicant: Kulicke and Soffa Industries, Inc.
    Inventors: Basil Milton, David Jeffery Li, Wei Qin
  • Publication number: 20260228410
    Abstract: A method of determining an acceptable level of variation in the placement of an electronic component in connection with a semiconductor package is provided. The method includes the steps of: (a) providing package data for a semiconductor package, the semiconductor package including an electronic component; (b) simulating placement of the electronic component in a plurality of positions with respect to a substrate of the semiconductor package; and (c) determining an acceptable level of variation in at least one of shift and rotation of the electronic component with respect to the substrate.
    Type: Application
    Filed: March 24, 2026
    Publication date: August 6, 2026
    Applicant: Kulicke and Soffa Industries, Inc.
    Inventors: Basil Milton, Wei Qin
  • Publication number: 20260210542
    Abstract: Provided are a heating energy-saving system and method for deeply utilizing waste heat of a boiler plant, relating to the technical field of heating energy saving. In the heating energy-saving system, a forced draft fan is arranged at an upper part of the boiler plant, an operation level relay induced draft fan is arranged on the operation level, and an air preheater is installed in a bottom level of the boiler plant. The air preheater communicates with an air outlet of a boiler forced draft fan through a first air supply duct, and an air inlet of the boiler forced draft fan communicates with an air inlet device through a second air supply duct. The air inlet device is provided with an outdoor air inlet control valve, and an indoor air inlet control valve.
    Type: Application
    Filed: January 22, 2025
    Publication date: July 23, 2026
    Applicant: SHANDONG YUNQING ENVIRONMENTAL SCI-TECH CO., LTD
    Inventors: Minye BAO, Defeng SUN, Jiapeng PAN, Xinyuan ZHU, Wei QIN, Luming LI, Lufeng GAO, Yubin FENG, Zhenbao GAO, Qingjiang ZOU, Jianming LI, Xiaohua YANG, Long ZHANG, Wenhao SHAN, Yunzi SHENG
  • Patent number: 12667906
    Abstract: A method of calibrating an ultrasonic characteristic on a wire bonding system is provided. The method includes the steps of: (a) determining a reference ultrasonic characteristic for formation of a wire bond; (b) determining a reference non-stick ultrasonic characteristic that results in a non-stick wire bond condition; (c) determining a calibration non-stick ultrasonic characteristic, on a wire bonding system to be calibrated, that results in a non-stick wire bond condition; and (d) determining a calibration factor for the wire bonding system to be calibrated using the reference non-stick ultrasonic characteristic and the calibration non-stick ultrasonic characteristic.
    Type: Grant
    Filed: August 13, 2024
    Date of Patent: June 30, 2026
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Jon W. Brunner, Wei Qin, Aashish Shah, Hui Xu, Jeong Ho Yang
  • Publication number: 20260178382
    Abstract: A control method for an autonomous working machine, an autonomous working machine and a storage medium are provided. The autonomous working machine is configured to work in a working area, the working area includes at least two sub-working areas, the at least two sub-working areas are respectively set with different working frequencies, and the control method for the autonomous working machine includes: respectively obtaining working frequencies of the autonomous working machine in the at least two sub-working areas; and controlling the autonomous working machine to work in the at least two sub-working areas to satisfy requirements of the working frequencies of the at least two sub-working areas. The autonomous working machine may work in a sub-working area according to a working frequency, so that a user may diversely customize own working preferences.
    Type: Application
    Filed: February 13, 2026
    Publication date: June 25, 2026
    Inventors: Shuailong LU, Xin ZHAO, Xiaoqi YANG, Wei QIN
  • Publication number: 20260167929
    Abstract: A culture medium and culture method for inducing olfactory mucosa mesenchymal stem cells into olfactory ensheathing cells are provided, belonging to the technical field of cell induction and culture. The culture medium provided in the present disclosure is mainly composed of cellular trophic factors, and does not contain animal proteins. The present disclosure further provides a method for inducing olfactory mucosa mesenchymal stem cells into olfactory ensheathing cells using the culture medium.
    Type: Application
    Filed: December 8, 2025
    Publication date: June 18, 2026
    Inventors: Li WEN, Wenshui LI, Wen LU, Li HU, Yu LIU, Wei QIN
  • Patent number: 12657820
    Abstract: This application provides a virtual weather interaction method performed by an electronic device. The method includes: displaying a virtual scene; in response to a zoomed-in-state trigger operation, displaying a map of a first region of the virtual scene in a zoomed-in state; and in accordance with a determination that the first region in the map in the zoomed-in state is in a first weather state, playing a first special effect corresponding to the first weather state in at least one map grid comprised in the first region.
    Type: Grant
    Filed: April 9, 2024
    Date of Patent: June 16, 2026
    Assignee: TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
    Inventors: Liang Kang, Wei Qin
  • Patent number: 12652041
    Abstract: A circuit. The circuit includes a switch having a gate terminal, a source terminal and a drain terminal, a switch driver circuit connected to the gate terminal and arranged to control an on-state and an off-state of the switch, the switch drive circuit including: a signal conversion circuit arranged to receive a control signal and in response generate a high-side signal; a signal buffer circuit coupled to the signal conversion circuit and arranged to receive the high-side signal and in response generate a buffered signal; and a drive circuit coupled to the signal buffer circuit and arranged to receive the buffered signal and in response generate a gate drive signal that causes the switch to transition between the on-state and the off-state. In one aspect, the switch is an NMOS transistor having a gate, a source and a drain, where the source and drain are at substantially high voltage.
    Type: Grant
    Filed: March 5, 2024
    Date of Patent: June 9, 2026
    Assignee: NAVITAS SEMICONDUCTOR LIMITED
    Inventors: Wei Qin, Zhenxu Zha, Huanxi Wang, Zhijun Hu, Yueliang Luo, Yunkai Sun
  • Patent number: 12628683
    Abstract: A method of determining a new search height for a wire bonding process is provided. The method includes the steps of: providing a search height; performing a plurality of wire bonding operations using the search height; monitoring wire bonding evaluation criteria during each of the plurality of wire bonding operations; and determining a new search height using the monitored wire bonding evaluation criteria.
    Type: Grant
    Filed: April 25, 2023
    Date of Patent: May 12, 2026
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Hui Xu, Wei Qin, Jeongho Yang
  • Patent number: 12616051
    Abstract: A method of determining a sequence for creating a plurality of wire loops is provided. The method includes (a) providing workpiece data for a workpiece. The workpiece data includes (i) position data for bonding locations of the workpiece, and (ii) wire loop data for a plurality of wire loops providing interconnection between ones of the bonding locations. The method also includes (b) analyzing the workpiece data. The step of analyzing includes considering overlap conditions between ones of the plurality of wire loops, considering wire loop heights of ones of the plurality of wire loops, considering lateral bend conditions between ones of the plurality of wire loops, and considering wire loop positions for ones of the plurality of wire loops. The method also includes (c) providing a sequence of creating the plurality of wire loops in connection with the workpiece at least partially based on the results of step (b).
    Type: Grant
    Filed: November 19, 2024
    Date of Patent: April 28, 2026
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Basil Milton, David Jeffery Li, Wei Qin
  • Patent number: 12614019
    Abstract: A method of determining an effect of electronic component placement accuracy on wire loops in a semiconductor package is provided. The method includes the steps of: (a) providing package data for a semiconductor package, the semiconductor package including an electronic component; (b) simulating placement of the electronic component in a plurality of positions with respect to a substrate in the semiconductor package; and (c) determining, using a software tool, an effect of each of the plurality of positions of the electronic component on a plurality of wire loops included in the semiconductor package.
    Type: Grant
    Filed: March 14, 2023
    Date of Patent: April 28, 2026
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Basil Milton, Wei Qin
  • Publication number: 20260050192
    Abstract: An array substrate and a display apparatus are provided. The array substrate includes a base substrate and a plurality of sub-pixels located on the base substrate. The plurality of sub-pixels is arranged in an array along a first direction and a second direction; and the first direction and the second direction intersect with each other. The array substrate includes a plurality of pixel regions; each pixel region includes sub-pixels with different colors arranged along the first direction, and different pixel regions have a same area; in a same pixel region, sub-pixel regions of at least two sub-pixels with different colors have different sizes in the first direction; a size ratio of sub-pixel regions of at least two sub-pixels with different colors in the first direction is 1 to 2; and the sub-pixel region includes an effective light-exiting region.
    Type: Application
    Filed: March 3, 2023
    Publication date: February 19, 2026
    Applicants: Beijing BOE Display Technology Co., Ltd., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Junying XIAO, Xiaohan TIAN, Wei QIN, Jianhua HUANG, Yingying QU, Yingmeng MIAO, Dongchuan CHEN, Yanping LIAO, Seungmin LEE, Hui LI
  • Publication number: 20260032680
    Abstract: A channel monitoring method and apparatus, and a terminal, a network device and a storage medium are provided. The method includes: a terminal determining, on the basis of a first carrier indication value, a CCE index occupied by a PDCCH candidate corresponding to first DCI, wherein the first DCI represents DCI capable of simultaneously scheduling uplink and/or downlink channels of at least two cells; and the first carrier indication value represents a carrier indication value configured by a network side for a first cell combination, the first cell combination being a cell combination scheduled by the first DCI.
    Type: Application
    Filed: July 27, 2023
    Publication date: January 29, 2026
    Inventors: Wei QIN, Tuo YANG, Lijie HU
  • Patent number: 12536196
    Abstract: Embodiments of this specification provide distributed data processing methods, apparatuses, and devices. One method includes: determining an active vertex set that currently participates in data processing in target graph data, in response to determining that an external memory of a first distributed node stores an active vertex in the active vertex set, determining, from a plurality of predetermined data processing modes, a target data processing mode that matches the active vertex set, determining, based on the target data processing mode, a to-be-updated vertex according to the association relationship with the active vertex, and sending, based on first data of the active vertex in the external memory, a first update message to a target distributed node in which the to-be-updated vertex is located.
    Type: Grant
    Filed: December 19, 2023
    Date of Patent: January 27, 2026
    Assignee: Alipay (Hangzhou) Information Technology Co., Ltd.
    Inventors: Wei Qin, Jiping Yu, Xiaowei Zhu, Wenguang Chen
  • Patent number: 12538759
    Abstract: A method of determining a height value of a wire loop on a wire bonding machine is provided. The method includes the steps of: (a) imaging at least a portion of a wire loop using an imaging system on a wire bonding machine to detect a path of the portion of the wire loop; (b) moving a wire bonding tool towards a first contact portion of the wire loop in the path; (c) detecting when a portion of a conductive wire engaged with the wire bonding tool contacts the first contact portion of the wire loop; and (d) determining a height value of the wire loop at the first contact portion based on a position of the wire bonding tool when the portion of the conductive wire contacts the first contact portion of the wire loop.
    Type: Grant
    Filed: March 23, 2023
    Date of Patent: January 27, 2026
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Basil Milton, Wei Qin, Zhijie Wang, Vladimir Pribula, Pavel Shusharin
  • Publication number: 20260025073
    Abstract: A method for controlling a buck-boost circuit includes: obtaining an input voltage and an output voltage; controlling the buck-boost circuit to enter a buck-boost mode when an absolute value of a voltage difference between the input voltage and the output voltage is less than a preset voltage threshold; and executing within each control cycle: in a first stage, controlling both first and second low-side switching transistors to be conductive and controlling both first and second high-side switching transistors to be non-conductive; in a second stage, controlling both the first and second high-side switching transistors to be conductive and controlling both first and second low-side switching transistors to be non-conductive; and in a third stage, controlling both the first and second high-side switching transistors to be conductive and controlling both the first and second low-side switching transistors to be non-conductive.
    Type: Application
    Filed: September 26, 2025
    Publication date: January 22, 2026
    Inventors: Wei QIN, Dong WU, Xi CHEN, Lei WANG
  • Patent number: D1142631
    Type: Grant
    Filed: June 9, 2025
    Date of Patent: August 18, 2026
    Assignee: PAX COMPUTER TECHNOLOGY (SHENZHEN) CO., LTD.
    Inventors: Shaowen Luo, Fu Zhao, Wei Qin
  • Patent number: D1142632
    Type: Grant
    Filed: June 23, 2025
    Date of Patent: August 18, 2026
    Assignee: PAX COMPUTER TECHNOLOGY (SHENZHEN) CO., LTD.
    Inventors: Shaowen Luo, Zhihua Lin, Wei Qin