Abstract: Differing from conventionally-used miniature cubic antenna being provided with a signal transceiving conductor on the outer surface thereof, the present invention provides a multilayer chip antenna formed by sequentially stacking a first coupling substrate, a signal transceiving metal layer, and a second coupling substrate. Particularly, the first coupling substrate and the second coupling substrate are disposed with a first metal layer and a second metal layer, respectively. Therefore, when the signal transceiving metal layer transmits or receives a wireless signal, not only a first coupling capacitor is induced between the signal transceiving metal layer and the first metal layer, but also a second coupling capacitor is simultaneously induced between the signal transceiving metal layer and the third metal layer; meanwhile, the first and second coupling capacitors are helpful to enhance the impedance bandwidth as the multilayer chip antenna transmits and/or receives a high-frequency wireless signal.