Abstract: A method (1200) performed by a wireless device (110) includes receiving (1202), from a network node (160), a Minimization of Drive Test, MDT, configuration for a master cell group, MCG, and a secondary cell group, SCG. While the wireless device is in an idle state or an inactive state and operating according to a first Radio Access Technology, RAT, the wireless device logs (1204) MDT measurements for the MCG and the SCG based on the MDT configuration. After transitioning from the idle or inactive state to a connected state and after handover from a source cell associated with the first RAT to a target cell associated with a second RAT, the wireless device transmits (1206) at least one MDT report to a target network node associated with the target cell.

Abstract: An imaging device is provided. The imaging device includes: one or more imaging sources; and a plurality of detectors combined by joining, the plurality of detectors being configured to receive one or more imaging beams emitted by the one or more imaging sources.

Abstract: A compound having a BCL-XL protein degradation function as shown in Formula I and a use thereof in preparation of a drug for diseases associated with BCL-XL activity.

Abstract: The present disclosure discloses a method for collaboratively controlling a multi-channel braking system of a mine hoist, including obtaining the abrasion loss of the brake shoe by detecting position information of the brake shoe of each of disc brakes in real time, dividing abrasion loss levels by determining different abrasion degrees of the brake shoe, formulating three braking force distributing modes: an average distribution, a proportional distribution, and an index distribution according to the abrasion loss levels, thereby dynamically adjusting a set braking pressure of each of the disc brakes, tracking and controlling the set braking pressure through the disc brakes by adopting a pressure closed-loop control method by utilizing a pressure signal feedback from an oil pressure sensor, implementing a collaborative braking control of the multi-channel braking system of the mine hoist based on the abrasion loss of the brake shoe.

Abstract: The present disclosure relates to exclusion rings for use in processing a semiconductor substrate in a processing chamber, such as a chemical vapor deposition chamber. The exclusion ring includes an alignment structure that cooperates with an alignment structure on a platen on which the exclusion ring will rest during processing of the wafer. The first alignment structure includes a guiding surface which promotes the reception of and positioning of the second alignment structure within the first alignment structure. Methods of utilizing the described exclusion rings are also described.

Abstract: A light guide plate has a bottom surface and a light-emitting surface opposite to the bottom surface, and comprises light-guiding lenses, accommodating regions, and separating portions. The light-guiding lenses are arranged along a first direction and a second direction, and form a light-guiding lens array, where the first direction is perpendicular to the second direction, and the first direction and the second direction are parallel to the bottom surface and the light-emitting surface. The accommodating regions are arranged in the light-guiding lenses, respectively, and are configured to dispose at least one light-emitting component. Each of the separating portions is located between adjacent two of the light-guiding lenses, and the plurality of light-guiding lenses are arranged along the first direction or the second direction on two sides of each of the separating portions. The present invention further provides a backlight module.

Abstract: A model training method includes obtaining an image sample set and brief-prompt information; generating a content mask set according to the image sample set and the brief-prompt information; generating a to-be-trained image set according to the content mask set; obtaining, based on the image sample set and the to-be-trained image set, a predicted image set through a to-be-trained information synthesis model, the predicted image set comprising at least one predicted image, the predicted image being in correspondence to the image sample; and training, based on the predicted image set and the image sample set, the to-be-trained information synthesis model by using a target loss function, to obtain an information synthesis model.

Abstract: The compositions and methods described herein are directed to treating solid tumors using CAR T therapy. For example, the compositions include CAR T cells comprising an extracellular domain that binds OR2I1P, LY6G6D, LRRC15, LY6K, GCC, GFRA4, F2RL2, QRFPR, IQGAP3, SIGLEC15, HAVCR1, PSG9, KISS1R, PRAME, HCN4, DPEP3, TMEM270, HER2, SLC7A3, SPRR2F, SLC45A2, CHRM1, CHRNA2, STEAP1B, FCRL2, Luteinizing hormone receptor, EDB, or CLDN18.2.

Abstract: A method for preparing a sustained-release antibacterial film includes: (1) mixing a cyclodextrin metal-organic framework (CD-MOF) material with a silver nitrate short-chain alcohol solution to prepare an intermediate material A; (2) mixing the intermediate material A with a caffeic acid short-chain alcohol solution to prepare an intermediate material B; (3) dispersing the intermediate material B in a solvent, adding a polydimethylsiloxane main agent and a PDMS auxiliary agent in sequence, and mixing well by stirring to obtain a casting solution; and (4) coating the casting solution on a film support material, conducting vacuum drying, and peeling off a film from the film support material to obtain the sustained-release antibacterial film. A mixed matrix-based film material in which the CD-MOF and the PDMS are physically blended is prepared based on CD-MOF and PDMS for the first time, and may be used in application researches of food, environment and other fields.

Abstract: A semiconductor package includes a semiconductor element, at least one electronic die, at least one optical die, an encapsulant, and a substrate. The semiconductor element has a first side and a second side opposing to the first side. The at least one electronic die is disposed over the first side. The at least one optical die is disposed over the first side and next to the at least one electronic die. The encapsulant is disposed on the first side and covers the at least one electronic die, where a sidewall of the at least one optical die is distant from the encapsulant, and a sidewall of the encapsulant is aligned with a sidewall of the semiconductor element. The substrate is disposed over the second side, where the at least one electronic die is electrically coupled to the substrate and the at least one optical die through the semiconductor element.

Abstract: A system may include a gimbal defining a plurality of pockets, where each pocket may include a first portion and a second portion that extends between the first portion and a base of the pocket. The second portion may have a greater diameter than the first portion. The system may include a plurality of conditioning disks, where each conditioning disk is seated within the first portion of a respective pocket. The system may include a plurality of gaskets, where each gasket is seated within the second portion of a respective pocket. The system may include a plurality o-rings, each o-ring disposed between a peripheral edge of one of the plurality of conditioning disks and a lateral wall of one of the plurality of pockets. The system may include a plurality of shoulder screws for coupling the gimbal with one of the plurality of gaskets and a conditioning disk.

Abstract: The disclosed method includes acquiring sample models and marking sample feature points; selecting target feature points and regional points on bones; transforming the target feature points and the regional points, and registering the target feature points with the sample feature points; formulating a strategy for assigning impact factors to the sample models, linearly combining all sample models to construct an initial model, and determining initial feature points corresponding to the target feature points in the initial model; adjusting the strategy according to the distance between initial feature points and the target feature points, selecting the strategy corresponding to the minimum distance as an optimal strategy, and determining an optimal initial model; determining a matching point corresponding to each regional point in the optimal initial model, and calculating a transformation relationship; and transmitting all points of the optimal initial model according to the transformation relationship to obt

Abstract: A first aspect relates to a computer-implemented method for performing model compression. The method includes compressing a machine learning (ML) network model comprising a multiple layer structure to produce a compressed ML network model. The compressed ML network model maintains the multiple layer structure of the ML network model. The method generates a model file for the compressed ML network model. The model file includes the compressed ML network model and decoding information for enabling the ML network model to be decompressed and executed layer-by-layer.

Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.

Abstract: Implementations of the present disclosure provide methods for preventing contact damage or oxidation after via/trench opening formation. In one example, the method includes forming an opening in a structure on the substrate to expose a portion of a surface of an electrically conductive feature, and bombarding a surface of a mask layer of the structure using energy species formed from a plasma to release reactive species from the mask layer, wherein the released reactive species form a barrier layer on the exposed surface of the electrically conductive feature.

Abstract: The application provides a method for simultaneously removing oxygen-containing compounds and aromatics from high-temperature Fischer-Tropsch synthetic light oil, comprising: subjecting the light oil and a composite extractant to a countercurrent single-stage or multi-stage extraction process in an extraction equipment, to obtain a raffinate phase stream, and an extract phase stream of oxygen-containing compounds+aromatics; washing the raffinate phase stream with water, to obtain a raffinate oil stream, from which oxygen-containing compounds and aromatics have been removed, and a water stream containing a small amount of extractants; and subjecting the extract phase stream to an extractive distillation process, to obtain a recycled stream rich in alkanes and olefins and a recycled solvent-rich stream, and carrying out a regeneration cycle on the solvent-rich stream through a solvent recovery tower and a regeneration distillation tower.

Abstract: The present application retransmits the LTM random access-less cell switch completion information based on a scheduling method, and provides an information retransmission mechanism applicable to the LTM cell switch process, which can improve the transmission reliability of the LTM random access-less cell switch completion information, thereby reducing LTM cell switch failures and/or reduce service interruption delays.

Abstract: A semiconductor package includes a semiconductor die, an interposer disposed below the semiconductor die, first joints electrically coupling the semiconductor die to the interposer, at least one second joint coupling the semiconductor die to the interposer, and a first underfill disposed between the semiconductor die and the interposer to surround the active and second joints. The semiconductor die includes a first region, a seal ring region surrounding the first region, and a second region between the seal ring region and a die edge. The first joints are located within the first region, and the second joint is disposed at a die corner within the second region and is electrically floating in the semiconductor package.

Abstract: The present invention discloses a manual type C-shaped wire clamp operating device, includes an insulating operating rod, wherein an upper end of the insulating operating rod is provided with a threaded rod, and the threaded rod includes an upper thread and a lower thread; a wire clamp clamping device, wherein the wire clamp clamping device includes a first spring, a wire clamp seat and a floating clamping block located above the wire clamp seat, a wire clamp seat threaded hole is formed in the wire clamp seat, the wire clamp seat threaded hole is in fit connection with the lower thread of the threaded rod; a drainage wire pressing device, wherein the drainage wire pressing device includes a guide rod arranged on the wire clamp seat and a drainage wire pressing block sliding along the guide rod, and a pressing block threaded hole is formed in the drainage wire pressing block.

Abstract: A manufacturing method of a semiconductor structure including the following steps is provided. A first substrate is provided. A first dielectric structure is formed on the first substrate. At least one first cavity is formed in the first dielectric structure. A first stress adjustment layer is formed in the first cavity. The first stress adjustment layer covers the first dielectric structure. A second substrate is provided. A second dielectric structure is formed on the second substrate. At least one second cavity is formed in the second dielectric structure. A second stress adjustment layer is formed in the second cavity. The second stress adjustment layer covers the second dielectric structure. The first stress adjustment layer and the second stress adjustment layer are bonded.