Patents by Inventor Wei Shen

Wei Shen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11954540
    Abstract: Methods and apparatus for split memory allocations in non-kernel space. Many modern networking technologies use asymmetric transmit and/or receive resource. Various aspects described herein split memory resources for transmit and receive, configuring each for their respective hardware optimizations. For example, a receive data paths that support batch processing and packet aggregation may be allocated large memory objects (32 KB) that can route data packets on a per-flow basis. In contrast, transmit data paths that support multiple concurrent network connections may be allocated small memory objects (2 KB) that can route data packets one at a time.
    Type: Grant
    Filed: September 10, 2021
    Date of Patent: April 9, 2024
    Assignee: Apple Inc.
    Inventors: Cahya Adiansyah Masputra, Eric Tsz Leung Cheng, Sandeep Nair, Wei Shen
  • Patent number: 11956919
    Abstract: A cold plate is provided and includes: a housing disposed with a chamber; a base combined with the housing to form a working space separated from the chamber but connected with the chamber through an interconnecting structure to allow a working medium to flow within the chamber and the working space; a heat transfer structure disposed on the inner side of the base; and a pump disposed within the working space to drive the working medium in the working space. As such, the cold plate can provide better heat dissipation performance.
    Type: Grant
    Filed: December 23, 2020
    Date of Patent: April 9, 2024
    Assignee: AURAS TECHNOLOGY CO., LTD.
    Inventors: Chien-An Chen, Chien-Yu Chen, Tian-Li Ye, Jen-Hao Lin, Wei-Shen Lee
  • Publication number: 20240114239
    Abstract: A system for remotely controlling microscopic machinery and a method thereof are provided. The system includes at least one local device and a remote host for sending a control command thereto. A microslide is placed on a microscopic camera device in the local device, and the microscopic camera device captures an image of the microslide according to a capture command in the control command. The local device transmits the image to the remote host in a video format. A motorized stage moves to a next preset position according to a movement command in the control command to capture another image of the microslide. The steps of capturing and transmitting the image and the step of moving are repeated until the microslide is captured completely. The invention can solve the problem of time delay when the image captured by the remote control microscopic camera device is displayed.
    Type: Application
    Filed: November 15, 2022
    Publication date: April 4, 2024
    Applicant: V5 TECHNOLOGIES CO., LTD.
    Inventors: TZU-KUEI SHEN, KUO-TUNG HUNG, GUANG-HAO SUEN, LIANG-WEI SHEU
  • Patent number: 11950432
    Abstract: A semiconductor package includes a first semiconductor device and a second semiconductor device. The first semiconductor device includes a first semiconductor substrate, a first bonding structure and a memory cell. The second semiconductor device is stacked over the first semiconductor device. The second semiconductor device includes a second semiconductor substrate, a second bonding structure in a second dielectric layer and a peripheral circuit between the second semiconductor substrate and the second bonding structure. The first bonding structure and the second bonding structure are bonded and disposed between the memory cell and the peripheral circuit, and the memory cell and the peripheral circuit are electrically connected through the first bonding structure and the second bonding structure.
    Type: Grant
    Filed: June 29, 2021
    Date of Patent: April 2, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsiang-Ku Shen, Ku-Feng Lin, Liang-Wei Wang, Dian-Hau Chen
  • Publication number: 20240106307
    Abstract: A motor with a plurality of stator modules and a driving method of the motor are provided. The motor includes a plurality of stator modules, a control unit, and a rotor. The plurality of stator modules is detachably assembled into a motor stator. Each of the plurality of stator modules includes a driving circuit. Each driving circuit is electrically connected to a plurality of coils of an associated one of the plurality of stator modules. The control unit is coupled to the driving circuits. The control unit designates one of the plurality of stator modules as a starting unit and designates remaining stator modules as relay units. The rotor includes at least one magnetic member corresponding to the plurality of coils of the plurality of stator modules. The starting unit drives the rotor to rotate. The relay units drive the rotor according to a phase change of the starting unit.
    Type: Application
    Filed: January 17, 2023
    Publication date: March 28, 2024
    Inventors: Wei-Qian Jian, Ching-Shen Hong
  • Publication number: 20240106217
    Abstract: The present invention discloses a manual type C-shaped wire clamp operating device, includes an insulating operating rod, wherein an upper end of the insulating operating rod is provided with a threaded rod, and the threaded rod includes an upper thread and a lower thread; a wire clamp clamping device, wherein the wire clamp clamping device includes a first spring, a wire clamp seat and a floating clamping block located above the wire clamp seat, a wire clamp seat threaded hole is formed in the wire clamp seat, the wire clamp seat threaded hole is in fit connection with the lower thread of the threaded rod; a drainage wire pressing device, wherein the drainage wire pressing device includes a guide rod arranged on the wire clamp seat and a drainage wire pressing block sliding along the guide rod, and a pressing block threaded hole is formed in the drainage wire pressing block.
    Type: Application
    Filed: December 9, 2022
    Publication date: March 28, 2024
    Applicant: STATE GRID ZHEJIANG TONGXIANG ELECTRIC POWER SUPPLY COMPANY
    Inventors: Dong Qian, Guoliang Liu, Hong Xu, Chongxi Zhu, Shengwei Shen, Jinfan Sun, Aoyang Hu, Wei Zeng
  • Publication number: 20240104588
    Abstract: A system including one or more processors, and one or more non-transitory computer-readable media storing computing instructions that, when executed on the one or more processors, cause the one or more processors to perform operations: segmenting each respective user of one or more users into a respective user state of one or more respective user states; predicting, using a machine learning LTV update model, a respective LTV for each respective user of the one or more users; determining a respective transition path from the respective user state of the respective user to a different respective user state; determining a respective online advertisement to transition a respective user of the one or more users from a respective transition state to the different respective user state; and displaying the respective online advertisement for the respective user of the one or more users. Other embodiments are disclosed herein.
    Type: Application
    Filed: December 4, 2023
    Publication date: March 28, 2024
    Applicant: Walmart Apollo, LLC.
    Inventors: Wei Shen, Lu Wang, Zhao Zhao
  • Publication number: 20240105642
    Abstract: A method of manufacturing a package structure at least includes the following steps. An encapsulant laterally is formed to encapsulate the die and the plurality of through vias. A plurality of first connectors are formed to electrically connect to first surfaces of the plurality of through vias. A warpage control material is formed over the die, wherein the warpage control material is disposed to cover an entire surface of the die. A protection material is formed over the encapsulant and around the plurality of first connectors and the warpage control material. A coefficient of thermal expansion of the protection material is less than a coefficient of thermal expansion of the encapsulant.
    Type: Application
    Filed: November 29, 2023
    Publication date: March 28, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hao-Jan Pei, Ching-Hua Hsieh, Hsiu-Jen Lin, Wei-Yu Chen, Chia-Shen Cheng, Chih-Chiang Tsao, Jen-Jui Yu, Cheng-Shiuan Wong
  • Patent number: 11942464
    Abstract: In an embodiment, a method includes: aligning a first package component with a second package component, the first package component having a first region and a second region, the first region including a first conductive connector, the second region including a second conductive connector; performing a first laser shot on a first portion of a top surface of the first package component, the first laser shot reflowing the first conductive connector of the first region, the first portion of the top surface of the first package component completely overlapping the first region; and after performing the first laser shot, performing a second laser shot on a second portion of the top surface of the first package component, the second laser shot reflowing the second conductive connector of the second region, the second portion of the top surface of the first package component completely overlapping the second region.
    Type: Grant
    Filed: July 19, 2021
    Date of Patent: March 26, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hao-Jan Pei, Hsiu-Jen Lin, Wei-Yu Chen, Philip Yu-Shuan Chung, Chia-Shen Cheng, Kuei-Wei Huang, Ching-Hua Hsieh, Chung-Shi Liu, Chen-Hua Yu
  • Publication number: 20240098166
    Abstract: Provided is a terminal device, which includes: a light-emitting layer and a cover plate, camera unit; the light-emitting layer includes a first light-emitting layer and a second light-emitting layer; when the first light-emitting layer is located at a first preset position, a first orthographic projection area of the first light-emitting layer in a first direction coincides with a second orthographic projection area of the camera unit, wherein the first direction a direction pointing from the light-emitting layer to the cover plate; and when the first light-emitting layer is located at a second preset position, a third orthographic projection area of the light-emitting layer does not coincide with at least part of the second orthographic projection area.
    Type: Application
    Filed: November 1, 2021
    Publication date: March 21, 2024
    Inventors: Xipeng LI, Xiaoliang ZHANG, Meijuan SHEN, Lina QI, Wei HUANG
  • Publication number: 20240097011
    Abstract: A method includes forming a fin structure over a substrate, wherein the fin structure comprises first semiconductor layers and second semiconductor layers alternately stacked over a substrate; forming a dummy gate structure over the fin structure; removing a portion of the fin structure uncovered by the dummy gate structure; performing a selective etching process to laterally recess the first semiconductor layers, including injecting a hydrogen-containing gas from a first gas source of a processing tool to the first semiconductor layers and the second semiconductor layers; and injecting an F2 gas from a second gas source of the processing tool to the first semiconductor layers and the second semiconductor layers; forming inner spacers on opposite end surfaces of the laterally recessed first semiconductor layers of the fin structure; and replacing the dummy gate structure and the first semiconductor layers with a metal gate structure.
    Type: Application
    Filed: December 1, 2023
    Publication date: March 21, 2024
    Applicants: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., TSMC NANJING COMPANY LIMITED
    Inventors: Han-Yu LIN, Fang-Wei LEE, Kai-Tak LAM, Raghunath PUTIKAM, Tzer-Min SHEN, Li-Te LIN, Pinyen LIN, Cheng-Tzu YANG, Tzu-Li LEE, Tze-Chung LIN
  • Publication number: 20240093443
    Abstract: Disclosed in the present disclosure is a double-deck multi-span bridge construction method. According to the double-deck bridge construction method of the present disclosure, construction is carried out by using a method of disassembling a support jig frame in a graded and span-separated mode, an upper chord jig frame and a lower chord jig frame can be used in a recycle manner, and construction costs are reduced. In addition, a construction period of building the support jig frame is shortened, and other construction operations can be synchronously carried out on a span in which the jig frame is disassembled, for example, fire retardant coating construction can be carried out on a mounted bridge deck after the jig frame is disassembled, and the construction period of a double-deck multi-span bridge is effectively shortened.
    Type: Application
    Filed: September 23, 2021
    Publication date: March 21, 2024
    Applicant: CHINA CONSTRUCTION SCIENCE AND INDUSTRY CORPORATION LTD.
    Inventors: Jinglei REN, Bing SUN, Yonggang GAO, Hongyu SHEN, Shaohui ZHU, Jianguo QI, Cui LIU, Ruihua YAN, Zhiqiang HE, Longfei LI, Sijie YANG, Huaidong ZHANG, Xu CHEN, Wei JIANG, Wenbo LI, Yingwu SUN, Yuhang ZHANG
  • Patent number: 11937515
    Abstract: Semiconductor device and methods of forming the same are provided. A semiconductor device according to one embodiment includes a dielectric layer including a top surface, a plurality of magneto-resistive memory cells disposed in the dielectric layer and including top electrodes, a first etch stop layer disposed over the dielectric layer, a common electrode extending through the first etch stop layer to be in direct contact with the top electrodes, and a second etch stop layer disposed on the first etch stop layer and the common electrode. Top surfaces of the top electrodes are coplanar with the top surface of the dielectric layer.
    Type: Grant
    Filed: August 9, 2022
    Date of Patent: March 19, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chih-Fan Huang, Hsiang-Ku Shen, Liang-Wei Wang, Chen-Chiu Huang, Dian-Hau Chen, Yen-Ming Chen
  • Patent number: 11933549
    Abstract: A high-performance thermal interface comprising a nanowire array disposed between a bottom metal layer and a top metal layer in which each nanowire is coated with a 3D fuzzy graphene layer. The thermal interface can be used by bonding it to the surfaces of adjoining substrates using layers of solder.
    Type: Grant
    Filed: September 22, 2022
    Date of Patent: March 19, 2024
    Assignee: Carnegie Mellon University
    Inventors: Sheng Shen, Wei Gong, Pengfei Li, Lin Jing, Itzhaq Cohen-Karni, Raghav Garg
  • Patent number: 11930853
    Abstract: An electronic cigarette atomizer and an electronic cigarette are disclosed. The electronic cigarette atomizer comprises an air inlet (1), an air inlet passage (2), an atomization cavity (3), an air outlet passage (4), an air outlet (5), and a suction nozzle (6) that are communicated in sequence. The electronic cigarette atomizer further comprises a housing (8) and an adjustment mechanism (7) for adjusting the air input of the air inlet (1). The air inlet passage (2), the atomization cavity (3), and the air outlet passage (4) are all arranged in the housing (8), and a top of the housing (8) is provided with a top cover (9). The adjustment mechanism (7) comprises a movable member (10) located in the top cover (9) and movable axially along the top cover (9).
    Type: Grant
    Filed: June 20, 2019
    Date of Patent: March 19, 2024
    Assignee: CHINA TOBACCO HUNAN INDUSTRIAL CO., LTD.
    Inventors: Jianfu Liu, Kejun Zhong, Xiaoyi Guo, Wei Huang, Xinqiang Yin, Jianhua Yi, Lizhou Shen, Yongquan Zhou
  • Patent number: 11933087
    Abstract: A storage console includes a housing with a storage chamber, two closure members connected to the housing, an actuator movably arranged in the housing and a latch mechanism rotatably connected to the housing. The two closure members can be rotated to open or close the storage chamber. The latch mechanism includes two latch members and a synchronizer connected between the two latch members. The movement of the actuator actuates the two latch members to rotate to a lock position in which the two latch members engage with the two closure members or a release position in which the two latch members are separated from the two closure members. The two closure members of the storage console can be opened synchronously by use of the actuator and closed independently of each other.
    Type: Grant
    Filed: February 21, 2022
    Date of Patent: March 19, 2024
    Assignee: Ford Global Technologies, LLC
    Inventors: Mona Li, Wei Xu, Leo Chen, Kevin Shen
  • Patent number: 11934027
    Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.
    Type: Grant
    Filed: June 21, 2022
    Date of Patent: March 19, 2024
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Chih-Wei Weng, Chia-Che Wu, Chien-Yu Kao, Hsiao-Hsin Hu, He-Ling Chang, Chao-Hsi Wang, Chen-Hsien Fan, Che-Wei Chang, Mao-Gen Jian, Sung-Mao Tsai, Wei-Jhe Shen, Yung-Ping Yang, Sin-Hong Lin, Tzu-Yu Chang, Sin-Jhong Song, Shang-Yu Hsu, Meng-Ting Lin, Shih-Wei Hung, Yu-Huai Liao, Mao-Kuo Hsu, Hsueh-Ju Lu, Ching-Chieh Huang, Chih-Wen Chiang, Yu-Chiao Lo, Ying-Jen Wang, Shu-Shan Chen, Che-Hsiang Chiu
  • Publication number: 20240087934
    Abstract: A method for operating a conveying system is provided. An overhead hoist transport (OHT) vehicle is provided, wherein the OHT vehicle includes a gripping member configured to grip and hold a carrier, and a receiver configured to receive a signal. The signal is transmitted to the receiver of the OHT vehicle. The OHT vehicle is moved toward the carrier, and the carrier is gripped by the gripping member of the OHT vehicle. A lifting force is determined based on a weight of a carrier, a number of workpieces in the carrier, or a vertical distance between the OHT vehicle and the carrier, and the lifting force is applied to the carrier.
    Type: Application
    Filed: November 23, 2023
    Publication date: March 14, 2024
    Inventors: YONG-JYU LIN, FU-HSIEN LI, CHEN-WEI LU, CHI-FENG TUNG, HSIANG YIN SHEN
  • Publication number: 20240088062
    Abstract: A package structure includes a die, an encapsulant laterally encapsulating the die, a warpage control material disposed over the die, and a protection material disposed over the encapsulant and around the warpage control material. A coefficient of thermal expansion of the protection material is less than a coefficient of thermal expansion of the encapsulant.
    Type: Application
    Filed: November 23, 2023
    Publication date: March 14, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hao-Jan Pei, Ching-Hua Hsieh, Hsiu-Jen Lin, Wei-Yu Chen, Chia-Shen Cheng, Chih-Chiang Tsao, Jen-Jui Yu, Cheng-Shiuan Wong
  • Patent number: D1018727
    Type: Grant
    Filed: August 18, 2023
    Date of Patent: March 19, 2024
    Inventor: Wei Shen