Abstract: A lid attach process includes dipping a periphery of a lid in a dipping tank of adhesive material such that the adhesive material attaches to the periphery of the lid. The lid attach process further includes positioning the lid over a die attached to a substrate using a lid carrier, wherein the periphery of the lid is aligned with a periphery of the lid carrier. The lid attach process further includes attaching the lid to the substrate with the adhesive material forming an interface with the substrate. The lid attach process further includes contacting a thermal interface material (TIM) on the die with the lid.

Abstract: A method of manufacturing a package structure at least includes the following steps. An encapsulant laterally is formed to encapsulate the die and the plurality of through vias. A plurality of first connectors are formed to electrically connect to first surfaces of the plurality of through vias. A warpage control material is formed over the die, wherein the warpage control material is disposed to cover an entire surface of the die. A protection material is formed over the encapsulant and around the plurality of first connectors and the warpage control material. A coefficient of thermal expansion of the protection material is less than a coefficient of thermal expansion of the encapsulant.

Abstract: In an embodiment, a method includes: aligning a first package component with a second package component, the first package component having a first region and a second region, the first region including a first conductive connector, the second region including a second conductive connector; performing a first laser shot on a first portion of a top surface of the first package component, the first laser shot reflowing the first conductive connector of the first region, the first portion of the top surface of the first package component completely overlapping the first region; and after performing the first laser shot, performing a second laser shot on a second portion of the top surface of the first package component, the second laser shot reflowing the second conductive connector of the second region, the second portion of the top surface of the first package component completely overlapping the second region.

Abstract: A package structure includes a die, an encapsulant laterally encapsulating the die, a warpage control material disposed over the die, and a protection material disposed over the encapsulant and around the warpage control material. A coefficient of thermal expansion of the protection material is less than a coefficient of thermal expansion of the encapsulant.

Abstract: The present disclosure provides a control method applied to a first electronic device and a second electronic device in a physical environment. The first electronic device and the second electronic device are configured to communicate with each other through a first wireless connection established between the first electronic device and the second electronic device. The control method includes: by at least one of the first electronic device and the second electronic device, determining whether to update a map of the physical environment; and in response to a determination to update the map of the physical environment, establishing a second wireless connection different from the first wireless connection between the first electronic device and the second electronic device, wherein the second wireless connection is configured to transmit a map updated data, and the map updated data is configured to update the map of the physical environment.

Abstract: A scanner is provided and includes a load bearing element, a scan assembly, a transparent plate and a casing. The load bearing element includes a support element and a base. The support element is disposed on the base and surrounds the base. The scan assembly is configured to perform a scan operation and is disposed on the base. The transparent plate is disposed on the support element and is configured to bear an object. The casing includes a first casing part and a second casing part. The second casing part includes a bottom plate and at least one cylinder. The at least one cylinder is disposed on the bottom plate. The load bearing element is disposed on the at least one cylinder, and is located between the first casing part and the second casing part. A first buffer space is formed between the base and the bottom plate.

Abstract: A scanner is provided and includes a load bearing element, a scan assembly, a transparent plate and a casing. The load bearing element includes a support element and a base. The support element is disposed on the base and surrounds the base. The scan assembly is configured to perform a scan operation and is disposed on the base. The transparent plate is disposed on the support element and is configured to bear an object. The casing includes a first casing part and a second casing part. The second casing part includes a bottom plate and at least one cylinder. The at least one cylinder is disposed on the bottom plate. The load bearing element is disposed on the at least one cylinder, and is located between the first casing part and the second casing part. A first buffer space is formed between the base and the bottom plate.

Abstract: The present invention provides a surface treatment method for magnesium alloy, which comprising the following steps: 1) preparation; 2) fusion and uniformly coating; 3) heat diffusion, and 4) finish; so a coating alloy is placed on a magnesium alloy substrate, and the magnesium alloy substrate is heated so that the coating alloy is uniformly melted on the magnesium alloy substrate; when heating up to a preset temperature, the coating alloy generates heat diffusion on the magnesium alloy substrate; the coating alloy finally forms a corrosion-resistant hard layer on the magnesium alloy substrate. So, this invention features simple treatment process, stable structure and environmental-friendliness in a wide range of applications.

Abstract: The present invention relates to a method for manufacturing a two-phase flow heat sink. The two-phase flow heat sink comprises an evaporation chamber and a capillary layer. The material of the capillary layer, which has at least a porous structure, is cooled and disposed on the inner side of the evaporation chamber from a melted state. The method first sprays the thermally melted material of the capillary layer on the substrate of the evaporation chamber for forming the capillary layer on the substrate. Because the capillary layer is sprayed on the substrate of the evaporation chamber, the capillary layer is distributed irregularly on the substrate and forming irregularly distributed holes. Thereby, the flowing space for fluids in the evaporation chamber is increased, and hence enhancing the heat transfer efficiency of the heat sink.

Abstract: The present invention provides a surface treatment method for magnesium alloy, which comprising the following steps: 1) preparation; 2) fusion and uniformly coating; 3) heat diffusion, and 4) finish; so a coating alloy is placed on a magnesium alloy substrate, and the magnesium alloy substrate is heated so that the coating alloy is uniformly melted on the magnesium alloy substrate; when heating up to a preset temperature, the coating alloy generates heat diffusion on the magnesium alloy substrate; the coating alloy finally forms a corrosion-resistant hard layer on the magnesium alloy substrate. So, this invention features simple treatment process, stable structure and environmental-friendliness in a wide range of applications.