Abstract: A cold plate is provided and includes: a housing disposed with a chamber; a base combined with the housing to form a working space separated from the chamber but connected with the chamber through an interconnecting structure to allow a working medium to flow within the chamber and the working space; a heat transfer structure disposed on the inner side of the base; and a pump disposed within the working space to drive the working medium in the working space. As such, the cold plate can provide better heat dissipation performance.

Abstract: A method of manufacturing a package structure at least includes the following steps. An encapsulant laterally is formed to encapsulate the die and the plurality of through vias. A plurality of first connectors are formed to electrically connect to first surfaces of the plurality of through vias. A warpage control material is formed over the die, wherein the warpage control material is disposed to cover an entire surface of the die. A protection material is formed over the encapsulant and around the plurality of first connectors and the warpage control material. A coefficient of thermal expansion of the protection material is less than a coefficient of thermal expansion of the encapsulant.

Abstract: In an embodiment, a method includes: aligning a first package component with a second package component, the first package component having a first region and a second region, the first region including a first conductive connector, the second region including a second conductive connector; performing a first laser shot on a first portion of a top surface of the first package component, the first laser shot reflowing the first conductive connector of the first region, the first portion of the top surface of the first package component completely overlapping the first region; and after performing the first laser shot, performing a second laser shot on a second portion of the top surface of the first package component, the second laser shot reflowing the second conductive connector of the second region, the second portion of the top surface of the first package component completely overlapping the second region.

Abstract: A package structure includes a die, an encapsulant laterally encapsulating the die, a warpage control material disposed over the die, and a protection material disposed over the encapsulant and around the warpage control material. A coefficient of thermal expansion of the protection material is less than a coefficient of thermal expansion of the encapsulant.

Abstract: A data processing system applying optical identification devices includes a printed matter having a plurality of encoded data printed thereon; an optical identification device for reading at least one encoded data from the printed matter; and a data processing device coupled to the optical identification device and storing a plurality of content data for reading the at least one encoded data through the optical identification device, obtaining at least one first data corresponding to an operation and one second data corresponding to one of the content data from the read encoded data and performing the corresponding operation of the first data on the one of the content data that the second data corresponds to.

Abstract: A named entity marking apparatus, a named entity marking method, and a computer program product thereof are provided. The named entity marking apparatus comprises a processor and a storage unit, wherein the processor is electrically connected to the storage unit. The storage unit is stored with an electronic document and a named entity database. The processor marks the electronic document into a first marked document by a first set of the named entity database. The processor decides a second set of the named entity database according to the first marked document. The processor re-marks the electronic document into a second marked document by the second set of the named entity database.

Abstract: A data processing system applying optical identification devices includes a printed matter having a plurality of encoded data printed thereon; an optical identification device for reading at least one encoded data from the printed matter; and a data processing device coupled to the optical identification device and storing a plurality of content data for reading the at least one encoded data through the optical identification device, obtaining at least one first data corresponding to an operation and one second data corresponding to one of the content data from the read encoded data and performing the corresponding operation of the first data on the one of the content data that the second data corresponds to.

Abstract: A named entity marking apparatus, a named entity marking method, and a computer program product thereof are provided. The named entity marking apparatus comprises a processor and a storage unit, wherein the processor is electrically connected to the storage unit. The storage unit is stored with an electronic document and a named entity database. The processor marks the electronic document into a first marked document by a first set of the named entity database. The processor decides a second set of the named entity database according to the first marked document. The processor re-marks the electronic document into a second marked document by the second set of the named entity database.