Abstract: A liquid containing assembly includes a clamping device, a supplementary package and a positioning mechanism. The clamping device includes a first and second surrounding bodies rotatably connected to each other. A clamping space is formed when the first and second surrounding bodies are closed to each other. The supplementary package includes an accommodating body to accommodate liquid and an open tube connected to the accommodating body. The positioning mechanism includes a first positioning portion on a portion of the accommodating body adjacent to the open tube, a second positioning portion corresponding to the first positioning portion and is at least on one of the first and second surrounding bodies, a third positioning portion on the accommodating body, and a fourth positioning portion corresponding to the third positioning portion and at least on one of the first and second surrounding bodies.

Abstract: A liquid containing assembly includes a clamping device, a supplementary package and a positioning mechanism. The clamping device includes a first and second surrounding bodies rotatably connected to each other. A clamping space is formed when the first and second surrounding bodies are closed to each other. The supplementary package includes an accommodating body to accommodate liquid and an open tube connected to the accommodating body. The positioning mechanism includes a first positioning portion on a portion of the accommodating body adjacent to the open tube, a second positioning portion corresponding to the first positioning portion and is at least on one of the first and second surrounding bodies, a third positioning portion on the accommodating body, and a fourth positioning portion corresponding to the third positioning portion and at least on one of the first and second surrounding bodies.

Abstract: A first film layer is formed over a substrate. A portion of the first film layer is removed to form a first alignment mark pattern and a first conductive layer is formed to fill the first alignment mark pattern to form a first alignment mark. A second film layer is formed and a portion of the second film layer is removed to form openings and to form a second alignment mark pattern. A second conductive layer is formed to fill the openings to form first conductive wires and to fill the second alignment mark pattern to form a second alignment mark. A third film layer and a hard mask layer are formed over the second film layer and a portion of the hard mask layer and the third film layer is removed to form via openings. A third conductive layer is formed in the via openings.

Abstract: A stacked alignment mark. The stacked alignment mark comprises a first alignment mark and a second alignment mark. The first alignment mark is located in a first film layer, wherein the first alignment mark is composed of a plurality of conductive wires. The second alignment mark is located in a second film layer under the first film layer. The first alignment mark is located in a first region corresponding to a second region in which the second alignment mark is located. Moreover, the second alignment mark at least contains a third region directly under a space between each two adjacent first conductive wires.

Abstract: A first film layer is formed over a substrate. A portion of the first film layer is removed to form a first alignment mark pattern and a first conductive layer is formed to fill the first alignment mark pattern to form a first alignment mark. A second film layer is formed and a portion of the second film layer is removed to form openings and to form a second alignment mark pattern. A second conductive layer is formed to fill the openings to form first conductive wires and to fill the second alignment mark pattern to form a second alignment mark. A third film layer and a hard mask layer are formed over the second film layer and a portion of the hard mask layer and the third film layer is removed to form via openings. A third conductive layer is formed in the via openings.

Abstract: A stacked alignment mark. The stacked alignment mark comprises a first alignment mark and a second alignment mark. The first alignment mark is located in a first film layer, wherein the first alignment mark is composed of a plurality of conductive wires. The second alignment mark is located in a second film layer under the first film layer. The first alignment mark is located in a first region corresponding to a second region in which the second alignment mark is located. Moreover, the second alignment mark at least contains a third region directly under a space between each two adjacent first conductive wires.

Abstract: A container of coolant used in a NIKON.TM. stepper is utilizing a screw cap to air-tightly close a coolant inlet of the container of coolant. The container of coolant is a closed system except the coolant inlet, a circulative input duct and a circulative output duct.

Abstract: A container of coolant used in a NIKON.TM. stepper is utilizing a transparent duct mounted on a side of the container of coolant to check a liquid level. The container of coolant can be conventional or other similar container of coolant.