Abstract: A method includes: forming a cooled device by cooling a device in and by a first container of an immersion cooler; performing semiconductor processing by a processing tool in data communication with the cooled device; determining whether the cooled device is in a condition to be removed from the immersion cooler; in response to the cooled device not being in the condition, cooling the device by the immersion cooler; and in response to the cooled device being in the condition, removing the device from the first container, including: positioning a second container over the first container; and with the second container in place covering the first container: opening a lid of the first container; and removing the device from the first container.

Abstract: A method and system for helping people marketing by matching people who are willing to recommend each other's project, e.g., advertisement, brand, product, activity, or news. The system generates a marketing URL for each marketing action of users, so that users can obtain the performance report of each marketing action. One of the keys to get users to trust that the system can prevent users from cheating and help users to establish mutually beneficial cooperation is that the system provides a technology that identifies people who click marketing URLs. The system can recognize whether a person clicking on a marketing URL has clicked on the URL before, even if the person's IP address has changed or browser cookies have been cleared, so that the system can prevent users from cheating.

Abstract: A tandem solar cell module includes a transparent substrate, a first solar cell unit, and a second solar cell unit disposed between the transparent substrate and the first solar cell unit. The first solar cell unit includes a first electrode, a second electrode, and a first absorption layer disposed between the first electrode and the second electrode, and the second solar cell unit includes a third electrode, a fourth electrode, and a second absorption layer disposed between the third electrode and the fourth electrode, wherein the second electrode is located adjacent to the third electrode, and the positions of the second electrode, the third electrode, and the fourth electrode are corresponding to each other.

Abstract: A combined solar cell module includes a solar cell module, an end connection device, and an output connection device. The solar cell module includes first and second connection portions on opposite sides of a substrate, and connection lines which connect solar cells to the first and second connection portions. The first connection portion has a first holding space. The second connection portion has a second holding space corresponding to the first holding space in an up-and-down manner. First and second connection parts are within the first and second holding spaces respectively. At least one of the first and second connection parts is a magnetic material, and another one is a magnetic material or a magnetically attractable material. The end connection device and the first connection portion are detachable and connectable. The output connection device and the second connection portion are detachable and connectable, for outputting current generated by solar cells.

Abstract: An encapsulation structure and a solar cell module are provided, wherein the encapsulation structure is disposed on the light incident surface of the solar cell module and is consisted of a thermoplastic protective layer, a transparent water-barrier layer, and an adhesive layer. The thermoplastic protective layer is disposed on the outermost layer of the light incident surface, and the material thereof includes thermoplastic polyurethane (TPU), thermoplastic polyolefin (TPO), or thermoplastic elastomer (TPE). The transparent water-barrier layer is disposed between the adhesive layer and the thermoplastic protective layer.

Abstract: A molding apparatus is provided, including a mold, a measurement device configured for sensing a state of the mold, and a calibration device electrically connected to the measurement device and configured for determining a state of a sensing function of the measurement device. Therefore, the problem that the measurement device is too old to accurately sense the state of the mold is solved.

Abstract: A tandem solar cell module includes a transparent substrate, a first solar cell unit, and a second solar cell unit disposed between the transparent substrate and the first solar cell unit. The first solar cell unit includes a first electrode, a second electrode, and a first absorption layer disposed between the first electrode and the second electrode, and the second solar cell unit includes a third electrode, a fourth electrode, and a second absorption layer disposed between the third electrode and the fourth electrode, wherein the second electrode is located adjacent to the third electrode, and the positions of the second electrode, the third electrode, and the fourth electrode are corresponding to each other.

Abstract: A PV module includes a transparent substrate, a first solar cell unit, a crystalline silicon solar cell, and a spacer. The first solar cell unit is between the transparent substrate and the crystalline silicon solar cell, and the first solar cell unit includes a first electrode, a second electrode, and a I-III-VI semiconductor layer between the first electrode and the second electrode. The I-III-VI semiconductor layer includes at least gallium (Ga) and sulfur (S), and the energy gap thereof is more than that of crystalline silicon. Moreover, the crystalline silicon solar cell and the first solar cell unit are separated by the spacer.

Abstract: A method for forming a thin film having sulfide single-crystal nanoparticles includes dropping a sulfide precursor solution on the surface of a Group VI absorption layer, and then performing thermal decomposition on the sulfide precursor solution under a predetermined temperature to form a thin film consisting of sulfide single-crystal nanoparticles on the surface of the Group VI absorption layer.

Abstract: A PV module includes a transparent substrate, a first solar cell unit, a crystalline silicon solar cell, and a spacer. The first solar cell unit is between the transparent substrate and the crystalline silicon solar cell, and the first solar cell unit includes a first electrode, a second electrode, and a I-III-VI semiconductor layer between the first electrode and the second electrode. The I-III-VI semiconductor layer includes at least gallium (Ga) and sulfur (S), and the energy gap thereof is more than that of crystalline silicon. Moreover, the crystalline silicon solar cell and the first solar cell unit are separated by the spacer.

Abstract: A compound solar cell includes a substrate, a first electrode located on the substrate, a Group VI absorption layer located on the first electrode, and a second electrode located on the group VI absorption layer. Moreover, a first buffer layer is between the second electrode and the Group VI absorption layer, wherein the first buffer layer is a thin film consisting of sulfide single-crystal nanoparticles.

Abstract: A method of eliminating a defective bonding wire is provided, including moving a bonding member from a first region of a carrier to a second region of the carrier if the bonding wire of the bonding member is defective, and cooperatively operating a movement member and the bonding member so as to cause the defective bonding wire to be removed from the bonding member and bonded to the second region of the carrier, thereby auto-debugging the bonding member and improving the production efficiency.

Abstract: A method for fabricating a wire bonding structure is disclosed, which includes: providing a substrate having a plurality of bonding pads; and foaming a ball end of a bonding wire on at least one of the bonding pads by performing a scrubbing process along a path around a periphery of the bonding pad, thereby preventing delamination of the ball end of small size from the bonding pad.

Abstract: A method of eliminating a defective bonding wire is provided, including moving a bonding member from a first region of a carrier to a second region of the carrier if the bonding wire of the bonding member is defective, and cooperatively operating a movement member and the bonding member so as to cause the defective bonding wire to be removed from the bonding member and bonded to the second region of the carrier, thereby auto-debugging the bonding member and improving the production efficiency.

Abstract: A method for fabricating a wire bonding structure is disclosed, which includes: providing a substrate having a plurality of bonding pads; and foaming a ball end of a bonding wire on at least one of the bonding pads by performing a scrubbing process along a path around a periphery of the bonding pad, thereby preventing delamination of the ball end of small size from the bonding pad.

Abstract: A semiconductor package is provided, including a carrier having electrical connecting pads, a semiconductor element disposed on the carrier and having electrode pads, conductive elements electrically connected to the electrode pads and the electrical connecting pads, fluorine ions formed between the conductive elements and the electrode pads or between the conductive elements and the electrical connecting pads, and an encapsulant formed on the carrier and the conductive elements, wherein the electrode pads or the electrical connecting pads are formed by aluminum materials to form fluorine aluminum by way of packaging the fluorine ions after the completion of the packaging process. Accordingly, the corrosion resistance of the semiconductor package is increased.

Abstract: A method for fabricating an integrated AC LED module comprises steps: forming a junction layer on a substrate, and defining a first growth area and a second growth area on the junction layer; respectively growing a Schottky diode and a LED on the first growth area and the second growth area; forming a passivation layer and a metallic layer on the Schottky diode, the LED and the substrate. Thereby, the Schottky diode is electrically connected with the LED via the metallic layer. Thus is promoted the reliability of electric connection of diodes, reduced the layout area of the module, and decreased the fabrication cost.

Abstract: A method for fabricating an integrated AC LED module comprises steps: forming a junction layer on a substrate, and defining a first growth area and a second growth area on the junction layer; respectively growing a Schottky diode and a LED on the first growth area and the second growth area; forming a passivation layer and a metallic layer on the Schottky diode, the LED and the substrate. Thereby, the Schottky diode is electrically connected with the LED via the metallic layer. Thus is promoted the reliability of electric connection of diodes, reduced the layout area of the module, and decreased the fabrication cost.

Abstract: A system for verifying the validity of assembled PCI devices of a computer includes: a device database (2) for storing data of PCI devices being inserted in PCI slots of a computer; a slot database (3) for storing PCI slot data of the computer; a data checking module (1) for obtaining the computer's PCI device data and PCI slot data from the device database and the slot database, integrating the PCI device data and PCI slot data, generating configuration data of a PCI device, and determining whether the PCI device is assembled with validity. A method for verifying the validity of assembled PCI devices of a computer is also disclosed.

Abstract: A lead frame for improving molding reliability and a semiconductor package with the lead frame are proposed. At least one embossed structure, such as a metal bump or recessed portion, is formed on a bonding layer of a wire-bonding area of the lead frame. At least one semiconductor chip is electrically connected to the lead frame via bonding wires bonded to the bonding layer. During a molding process for fabricating an encapsulant to encapsulate the chip, the bonding wires and a portion of the lead frame, the embossed structure makes the bonding layer become uneven and thus increases the contact area and adhesion between the bonding layer and the encapsulant, so as to prevent cracks of the bonding wires and improve the electrical performances and molding reliability.