Patents by Inventor Wei-Shin Tien

Wei-Shin Tien has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7180227
    Abstract: An o-ring sealing device, molded with an imbedded piezoelectric element, for use in vacuum systems. The imbedded element, of a circumferential length, has an oblong cross-sectional shape, the oblong shape having a pair of ends for externally connecting to a signal processor. The piezoelectric element is concentrically disposed and centrally placed within a mold cavity of a predetermined diameter. The cavity is filled with an elastic material fully encapsulating and insulating the piezoelectric element.
    Type: Grant
    Filed: January 16, 2004
    Date of Patent: February 20, 2007
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ming-Hung Tseng, Chin-Chih Chen, Tzu-Chan Wang, Wei-Shin Tien
  • Publication number: 20050156487
    Abstract: An o-ring sealing device, molded with an imbedded piezoelectric element, for use in vacuum systems. The imbedded element, of a circumferential length, has an oblong cross-sectional shape, the oblong shape having a pair of ends for externally connecting to a signal processor. The piezoelectric element is concentrically disposed and centrally placed within a mold cavity of a predetermined diameter. The cavity is filled with an elastic material fully encapsulating and insulating the piezoelectric element.
    Type: Application
    Filed: January 16, 2004
    Publication date: July 21, 2005
    Inventors: Ming-Hung Tseng, Chin-Chih Chen, Tzu-Chan Wang, Wei-Shin Tien