Patents by Inventor Wei Shuen KAO

Wei Shuen KAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ELECTRONIC PACKAGE
    Publication number: 20230216174
    Abstract: An electronic package and a method of manufacturing an electronic package are provided. The electronic package includes a carrier, an antenna substrate, and an electronic component. The carrier has a first surface and a second surface. The antenna substrate includes a resonant cavity and is disposed over the first surface. The antenna substrate is closer to the first surface than the second surface of the carrier. The electronic component is disposed between the antenna substrate and the second surface of the carrier.
    Type: Application
    Filed: December 30, 2021
    Publication date: July 6, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chung Ju YU, Shao-Lun YANG, Chun-Hung YEH, Hong Jie CHEN, Tsung-Wei LU, Wei Shuen KAO