Abstract: An electrostatic discharge protection circuit is provided. The electrostatic discharge protection circuit includes an electrostatic discharge detection circuit, a discharge circuit, and a switch. The electrostatic discharge detection circuit detects whether an electrostatic discharge event occurs at the bounding pad to generate a first detection circuit. The discharge circuit receives the first detection signal. When the electrostatic discharge event occurs at the bounding pad, the discharge circuit provides a discharge path between the bounding pad and a ground terminal according to the first detection signal. The switch is coupled between the core circuit and the ground terminal and controlled by the first detection signal. When the electrostatic discharge event occurs at the bounding pad, the switch is turned off according to the first detection signal.

Abstract: An electrostatic discharge protection circuit is provided. The electrostatic discharge protection circuit includes an electrostatic discharge detection circuit, a discharge circuit, and a switch. The electrostatic discharge detection circuit detects whether an electrostatic discharge event occurs at the bounding pad to generate a first detection circuit. The discharge circuit receives the first detection signal. When the electrostatic discharge event occurs at the bounding pad, the discharge circuit provides a discharge path between the bounding pad and a ground terminal according to the first detection signal. The switch is coupled between the core circuit and the ground terminal and controlled by the first detection signal. When the electrostatic discharge event occurs at the bounding pad, the switch is turned off according to the first detection signal.

Abstract: A burn-in method for SRAMs and chips. For a memory cell of the SRAM, the SRAM burn-in method controls the control signals of the memory cell to generate current paths to pass through the memory cell, the corresponding bit-line and the corresponding bit-line-bar. The contacts/vias in the current paths are tested by providing burn-in currents to flow through the current paths, so that mismatched contacts/vias are burned by the burn-in currents. SRAMs that fail the burn-in test are abandoned after the burn-in procedure.

Abstract: A burn-in method for SRAMs and chips. For a memory cell of the SRAM, the SRAM burn-in method controls the control signals of the memory cell to generate current paths to pass through the memory cell, the corresponding bit-line and the corresponding bit-line-bar. The contacts/vias in the current paths are tested by providing burn-in currents to flow through the current paths, so that mismatched contacts/vias are burned by the burn-in currents. SRAMs that fail the burn-in test are abandoned after the burn-in procedure.

Abstract: An asymmetric static random access memory (SRAM) device that includes at least one SRAM cell is provided. The SRAM cell includes the first inverter and the second inverter. The first inverter is coupled between a first power and a ground power, and includes a first output terminal coupled to a first node and a first input terminal coupled to a second node. The second inverter is coupled between the first power and the ground power, and includes a second input terminal coupled to the first node and a second output terminal coupled to the second node. When the first inverter and the second inverter receive current from the first power, the SRAM cell is programmed to a predetermined value in advance according to different conductance levels of the first inverter and the second inverter.

Abstract: A memory system is provided, comprising at least one memory unit and a source power supply circuit. Each memory unit is coupled between a source voltage and a ground voltage and accesses digital data according to a word line signal and a bit line signal. The source power supply circuit provides the source voltage to the memory units. When the memory unit is in a writing status, the source voltage is the first power voltage. When the memory unit is in a reading status, the source voltage is the second power voltage. The second power voltage equals to the first power voltage subtracted by a specific voltage for avoiding rewriting error.

Abstract: A memory system is provided, comprising at least one memory unit and a source power supply circuit. Each memory unit is coupled between a source voltage and a ground voltage and accesses digital data according to a word line signal and a bit line signal. The source power supply circuit provides the source voltage to the memory units. When the memory unit is in a writing status, the source voltage is the first power voltage. When the memory unit is in a reading status, the source voltage is the second power voltage. The second power voltage equals to the first power voltage subtracted by a specific voltage for avoiding rewriting error.

Abstract: A detection apparatus for sequentially programming a memory is provided. The detection apparatus comprises a current sensor and a programming controller. The current sensor is coupled to a programming source and a memory cell. The current sensor detects change of a programming current between the programming source and the memory cell and generates a control signal according to the detection result. The programming controller is coupled to the current sensor. The programming controller receives the control signal and generates a programming state signal.