Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a semiconductor substrate. The semiconductor device structure includes a first gate stack positioned over the semiconductor substrate. The semiconductor device structure includes a first doped structure and a second doped structure positioned at two opposite sides of the first gate stack and embedded in the semiconductor substrate. The semiconductor device structure includes a second gate stack positioned over the semiconductor substrate and adjacent to the second doped structure. The semiconductor device structure includes a third gate stack positioned over the semiconductor substrate. The semiconductor device structure includes an isolation structure embedded in the semiconductor substrate and between the second gate stack and the third gate stack. The isolation structure is wider and thinner than the second doped structure, and the isolation structure is made of an epitaxial material.

Abstract: A method of manufacturing a semiconductor structure includes receiving a substrate; patterning a first active region, a second active region and an isolation between the first active region and the second active region over the substrate; disposing an inter-level dielectric (ILD) over the substrate; forming a first gate extended over the first active region, the isolation and the second active region; and forming a second gate over the first active region and the second active region, wherein the second gate includes a first section disposed over the first active region and a second section disposed over the second active region, a portion of the ILD is disposed between the first section and the second section.

Abstract: Embodiments of a semiconductor device structure and a method for forming the same are provided. The semiconductor device structure includes a substrate and a first metal gate structure formed over the substrate. The first metal gate structure has a first width. The semiconductor device structure further includes a first contact formed adjacent to the first metal gate structure and a second metal gate structure formed over the substrate. The second metal gate structure has a second width smaller than the first width. The semiconductor device structure further includes an insulating layer formed over the second metal gate structure and a second contact self-aligned to the second metal gate structure.

Abstract: A semiconductor structure includes a substrate including a first active region, a second active region and an isolation disposed between the first active region and the second active region; a plurality of gates disposed over the substrate and including a first gate extended over the first active region, the isolation and the second active region, and a second gate over the first active region and the second active region; and an inter-level dielectric (ILD) disposed over the substrate and surrounding the plurality of gates, wherein the second gate is configured not to conduct current flow and includes a first section disposed over the first active region and a second section disposed over the second active region, a portion of the ILD is disposed between the first section and the second section.

Abstract: The present disclosure provides a semiconductor structure includes a semiconductor layer having a first surface, and an interlayer dielectric (ILD) defining a metal gate over the first surface of the semiconductor layer. The metal gate includes a high-k dielectric layer, a barrier layer, and a work function metal layer. A thickness of a first portion of the barrier layer at the sidewall of the metal gate is substantially thinner than a thickness of the barrier layer at the bottom of the metal gate. The present disclosure provides a method for manufacturing a semiconductor structure. The method includes forming a metal gate trench in an ILD, forming a barrier layer in a bottom and a sidewall of the metal gate trench, removing a first portion of the barrier layer at the sidewall of the metal gate trench, and forming a work function metal layer conforming to the barrier layer.

Abstract: Some embodiments of the present disclosure provide a semiconductor device including a semiconductive substrate, a metal gate including a metallic layer proximal to the semiconductive substrate. A dielectric layer surrounds the metal gate. The dielectric layer includes a first surface facing the semiconductive substrate and a second surface opposite to the first surface. A sidewall spacer surrounds the metallic layer with a greater longitudinal height. The sidewall spacer is disposed between the metallic layer and the dielectric layer. An etch stop layer over the metal gate comprises a surface substantially coplanar with the second surface of the dielectric layer. The etch stop layer has a higher resistance to etchant than the dielectric layer. A portion of the etch stop layer is over the sidewall spacer.

Abstract: Embodiments of a semiconductor device structure and a method for forming the same are provided. The semiconductor device structure includes a substrate and a first metal gate structure formed over the substrate. The first metal gate structure has a first width. The semiconductor device structure further includes a first contact formed adjacent to the first metal gate structure and a second metal gate structure formed over the substrate. The second metal gate structure has a second width smaller than the first width. The semiconductor device structure further includes an insulating layer formed over the second metal gate structure and a second contact self-aligned to the second metal gate structure.

Abstract: A semiconductor device includes a transistor and a contact pad over a substrate. The transistor includes a high-k dielectric layer, a work function metal layer, a metal gate, two spacers, a metal compound, an insulator and a doped region. The high-k dielectric layer is over the substrate. The work function metal layer is over the high-k dielectric layer. The metal gate is over the work function metal layer. The two spacers sandwich the work function metal layer and the metal gate. The metal compound is over inner walls of the two spacers and over the top surface of the work function metal layer and the metal gate. The insulator covers the metal compound. The doped region is in the substrate. The contact pad is electrically connected to the metal gate.

Abstract: A method for forming a semiconductor device is provided. The method includes providing a semiconductor substrate with an insulating layer formed thereon. The method includes forming a gate dielectric layer in the first opening and the second opening. The method includes forming a film over the gate dielectric layer. The method includes forming a first work function metal layer in the first opening. The method includes depositing a second work function metal layer in the first opening and the second opening and in direct contact with the first work function metal layer in the first opening and the film in the second opening. A first deposition rate of the second work function metal layer over the first work function metal layer is greater than a second deposition rate of the second work function metal layer over the film.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a semiconductor substrate. The semiconductor device structure includes a first gate stack positioned over the semiconductor substrate. The semiconductor device structure includes a first doped structure and a second doped structure positioned at two opposite sides of the first gate stack and embedded in the semiconductor substrate. The semiconductor device structure includes a second gate stack positioned over the semiconductor substrate and adjacent to the second doped structure. The semiconductor device structure includes a third gate stack positioned over the semiconductor substrate. The semiconductor device structure includes an isolation structure embedded in the semiconductor substrate and between the second gate stack and the third gate stack. The isolation structure is wider and thinner than the second doped structure, and the isolation structure is made of an epitaxial material.

Abstract: Methods of modifying a self-aligned contact process in a semiconductor fabrication and a semiconductor device are provided. A method includes forming a transistor over a substrate, including depositing a high-k dielectric layer over the substrate; depositing a work function metal layer over the high-k dielectric layer; forming a metal gate over the work function metal layer; forming two spacers sandwiching the work function metal layer and the metal gate; and forming a doped region in the substrate; etching the work function metal layer and the metal gate to leave a metal residue over inner walls of the two spacers exposing the work function metal layer and the metal gate; modifying the metal residue and the exposed work function metal layer and metal gate to form a metal compound; depositing an insulator covering the metal compound; and forming contact pads respectively electrically connected to the metal gate and the doped region.

Abstract: Embodiments of mechanisms for forming a semiconductor device are provided. The semiconductor device includes a semiconductor substrate and a first gate stack. The first gate stack includes a gate dielectric layer, a first work function metal layer and a second work function metal layer directly on the first work function metal layer. The second work function metal layer and the first work function metal layer have the same metal element. The semiconductor device also includes a second gate stack. The second gate stack includes a gate dielectric layer, a barrier layer and a second work function metal layer. The second work function metal layer and the barrier layer do not have the same metal element. A first thickness of the second work function metal layer of the first gate stack is larger than a second thickness of the second work function metal layer of the second gate stack.

Abstract: Embodiments of the present disclosure relate generally to a semiconductor device and method of fabricating the same, the semiconductor device includes a semiconductor substrate and a gate stack disposed over a channel region of the semiconductor device, the gate stack includes an oxidation layer, a gate dielectric and a gate electrode, the oxidation layer at least covers a portion of the channel region of the semiconductor device and may act as a barrier to prevent damage to the underlying features, such as the source and drain regions, during removal of a dummy gate in a gate last process.

Abstract: Some embodiments of the present disclosure provide a semiconductor device including a semiconductive substrate, a metal gate including a metallic layer proximal to the semiconductive substrate. A dielectric layer surrounds the metal gate. The dielectric layer includes a first surface facing the semiconductive substrate and a second surface opposite to the first surface. A sidewall spacer surrounds the metallic layer with a greater longitudinal height. The sidewall spacer is disposed between the metallic layer and the dielectric layer. An etch stop layer over the metal gate comprises a surface substantially coplanar with the second surface of the dielectric layer. The etch stop layer has a higher resistance to etchant than the dielectric layer. A portion of the etch stop layer is over the sidewall spacer.

Abstract: A semiconductor structure includes a substrate including a first active region, a second active region and an isolation disposed between the first active region and the second active region; a plurality of gates disposed over the substrate and including a first gate extended over the first active region, the isolation and the second active region, and a second gate over the first active region and the second active region; and an inter-level dielectric (ILD) disposed over the substrate and surrounding the plurality of gates, wherein the second gate is configured not to conduct current flow and includes a first section disposed over the first active region and a second section disposed over the second active region, a portion of the ILD is disposed between the first section and the second section.

Abstract: Methods of modifying a self-aligned contact process in a semiconductor fabrication and a semiconductor device are provided. A method includes forming a transistor over a substrate, including depositing a high-k dielectric layer over the substrate; depositing a work function metal layer over the high-k dielectric layer; forming a metal gate over the work function metal layer; forming two spacers sandwiching the work function metal layer and the metal gate; and forming a doped region in the substrate; etching the work function metal layer and the metal gate to leave a metal residue over inner walls of the two spacers exposing the work function metal layer and the metal gate; modifying the metal residue and the exposed work function metal layer and metal gate to form a metal compound; depositing an insulator covering the metal compound; and forming contact pads respectively electrically connected to the metal gate and the doped region.

Abstract: Embodiments of a semiconductor device structure and a method for forming the same are provided. The semiconductor device structure includes a substrate and a first metal gate structure formed over the substrate. The first metal gate structure has a first width. The semiconductor device structure further includes a first contact formed adjacent to the first metal gate structure and a second metal gate structure formed over the substrate. The second metal gate structure has a second width smaller than the first width. The semiconductor device structure further includes an insulating layer formed over the second metal gate structure and a second contact self-aligned to the second metal gate structure.

Abstract: Embodiments of mechanisms for forming a semiconductor device are provided. The semiconductor device includes a semiconductor substrate and a first gate stack. The first gate stack includes a gate dielectric layer, a first work function metal layer and a second work function metal layer directly on the first work function metal layer. The second work function metal layer and the first work function metal layer have the same metal element. The semiconductor device also includes a second gate stack. The second gate stack includes a gate dielectric layer, a barrier layer and a second work function metal layer. The second work function metal layer and the barrier layer do not have the same metal element. A first thickness of the second work function metal layer of the first gate stack is larger than a second thickness of the second work function metal layer of the second gate stack.

Abstract: The present disclosure provides a semiconductor structure includes a semiconductor layer having a first surface, and an interlayer dielectric (ILD) defining a metal gate over the first surface of the semiconductor layer. The metal gate includes a high-k dielectric layer, a barrier layer, and a work function metal layer. A thickness of a first portion of the barrier layer at the sidewall of the metal gate is substantially thinner than a thickness of the barrier layer at the bottom of the metal gate. The present disclosure provides a method for manufacturing a semiconductor structure. The method includes forming a metal gate trench in an ILD, forming a barrier layer in a bottom and a sidewall of the metal gate trench, removing a first portion of the barrier layer at the sidewall of the metal gate trench, and forming a work function metal layer conforming to the barrier layer.

Abstract: A solar cell includes a semiconductor substrate and a first antireflective layer. The semiconductor substrate has a first-type semiconductor surface and a second-type semiconductor surface opposite to each other. The first antireflective layer includes a plurality of refraction convexes and a coverage layer. The refraction convexes are formed on the second-type semiconductor surface. Each refraction convex includes a first refraction part and a second refraction part. The first refraction parts are conformally coated with the respective second refraction parts, and the first refraction part is configured to have a refractive index greater than the refractive index of the second refraction part. The coverage layer is formed to cover the second-type semiconductor surface and the refraction convexes, and the coverage layer is configured to have a refractive index smaller than the refractive index of the second refraction part. A solar cell manufacturing method is also provided.