Patents by Inventor Wei Soh

Wei Soh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electrical circuits with button plated contacts and assembly methods
    Publication number: 20050242160
    Abstract: Exemplary methods for making a solder joint between two articles are disclosed. The method includes the steps of positioning a first article and a second article to be soldered together. At least one of the first article and the second article has at least one button attached to it. The button has a desired height above a surface of the article to which it is attached. The second article has a quantity of solder located in a position where the solder joint is to be formed. A heat source is applied until the quantity of solder liquefies. The heat source is removed until the solder solidifies with a uniform thickness approximately equal to the height of the button.
    Type: Application
    Filed: April 30, 2004
    Publication date: November 3, 2005
    Inventors: Kinya Nippa, Wei Soh