Patents by Inventor Wei Ta

Wei Ta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250053865
    Abstract: The technology is generally directed to the training and execution of a model to identify policy violating content that has been obfuscated. The model may be trained using obfuscated training images. The obfuscated training images may be associated with one or more labels, such as a policy, obfuscation label, etc. The obfuscated training images and associated labels may be input into the model. During training, the output of the model may be a policy prediction as to whether the obfuscated input images violate the content policy of a host or are approved content for publishing. During implementation, the model may receive content as input and provide as output a policy prediction for the content. The host may use the policy prediction provided by the model to determine whether or not to publish the content.
    Type: Application
    Filed: December 14, 2022
    Publication date: February 13, 2025
    Inventors: Wei Qiao, Chun-Ta Lu, Yinatao Liu, Ariel Fuxman, Mehmet Nejat Tek, Dongjin Kwon, Florian Nils Stimberg
  • Patent number: 12216257
    Abstract: A plastic light-folding element includes an incident surface, an exit surface, at least one reflective surface, at least one connecting surface and at least one gate vestige structure. The incident surface is configured to lead an imaging light enter the plastic light-folding element. The exit surface is configured to lead the imaging light exit the plastic light-folding element. The reflective surface is configured to fold the imaging light. The connecting surface is connected to the incident surface, the exit surface and the reflective surface. The gate vestige structure is disposed on the connecting surface. At least one of the incident surface, the exit surface and the reflective surface includes an optical portion and an arc step structure, the arc step structure is disposed on a periphery of the optical portion, and an arc is formed by the arc step structure centered on the optical portion.
    Type: Grant
    Filed: January 14, 2022
    Date of Patent: February 4, 2025
    Assignee: LARGAN PRECISION CO., LTD.
    Inventors: Pei-Chi Chang, Wei-Chun Lo, Po-Lun Hsu, Lin-An Chang, Ming-Ta Chou
  • Publication number: 20250030199
    Abstract: An electrical connector includes: a housing extending along a longitudinal direction; and a row of first terminals retained in the housing and including plural signal terminals and plural grounding terminals, each first terminal including a plate portion and a leg portion extending out of the housing, the plate portion defining an outer face exposed upon the housing and an inner face opposite the outer face, the outer face of the plate portion of the first terminal defining a mating face, wherein a transmission line is formed on the housing by laser direct structuring, and the transmission line is electrically connected to plural ground terminals to connect plural ground terminals in series.
    Type: Application
    Filed: July 15, 2024
    Publication date: January 23, 2025
    Inventors: WEI-TA TSENG, Jou-Tzu SHEN
  • Patent number: 12203960
    Abstract: A manufacturing process for electrode of neuromodulation probe includes the steps of: preparing a plurality of the manufacturing fixtures for electrode of neuromodulation probe; preparing a plurality of the manufacturing fixtures for electrode in a surrounding manner by having the first-layer frames to be externally disposed side by side with the bevels of the two neighboring first-layer frames close to each other, so that the second-layer frames, the plurality of electrodes and the plurality of wires are enclosed thereinside; placing a cylinder amid the plurality of manufacturing fixtures for electrode to have the plurality of wires to surround the cylinder; having a fluid plastic to surround the cylinder by filling all the spaces between the plurality of wires and the plurality of electrodes, and waiting the fluid plastic to cure; removing the plurality of first-layer frames and the plurality of second-layer frames; and, pulling off the cylinder.
    Type: Grant
    Filed: December 27, 2022
    Date of Patent: January 21, 2025
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Jo-Ping Lee, Kun-Ta Wu, Wei-Chin Huang, An-Li Chen
  • Patent number: 12196496
    Abstract: A liquid-cooled cooling structure includes a cooling main body having a condensation chamber and an evaporation chamber arranged vertically therein; a separation member arranged between and separating the condensation chamber and the evaporation chamber, and having a first through hole and a second through hole communicating with the condensation chamber and the evaporation chamber, a dimension of the first through hole being greater than that of the second through hole; a longitudinal partition board received in the condensation chamber and arranged between the first through hole and the second through hole and separating the condensation chamber into a first channel and a second channel; cooling fins extended from an outer perimeter of the cooling main body.
    Type: Grant
    Filed: September 25, 2022
    Date of Patent: January 14, 2025
    Assignee: AIC INC.
    Inventors: Yen-Chih Chen, Chi-Fu Chen, Wei-Ta Chen, Hung-Hui Chang
  • Publication number: 20240359433
    Abstract: A composition, composite material, and copper clad laminate are provided. The composition includes 100 parts by weight of a compound having two epoxy groups, 20-80 parts by weight of a compound having at least two phenolic hydroxy groups, and 0.01-1.5 parts by weight of an ionic liquid. The ionic liquid is not imidazolium ionic liquid.
    Type: Application
    Filed: April 25, 2024
    Publication date: October 31, 2024
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Wen-Chin Lee, Meng-Song Yin, Man-Chun Yu, Wei-Ta Yang
  • Publication number: 20240321973
    Abstract: A power metal-oxide-semiconductor structure includes a semiconductor substrate, a gate electrode disposed above the semiconductor substrate, a field plate, and an electrically conductive pattern. The gate electrode and the field plate are disposed above the semiconductor substrate, the electrically conductive pattern is disposed between the field plate and the semiconductor substrate in a vertical direction, and the field plate and the electrically conductive pattern are located at the same side of the gate electrode in a horizontal direction. A manufacturing method of a power metal-oxide-semiconductor structure includes the following steps. The electrically conductive pattern and the field plate are formed above a first region of the semiconductor substrate. Subsequently, the gate electrode is formed above the first region of the semiconductor substrate.
    Type: Application
    Filed: April 24, 2023
    Publication date: September 26, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Cheng-Hua Yang, Chih-Chien CHANG, Shen-De WANG, JIANJUN YANG, Wei Ta, Yuan-Hsiang Chang
  • Publication number: 20240222552
    Abstract: A semiconductor device is disclosed. The quantum well structure of the semiconductor element is disposed between a first type semiconductor layer and a second type semiconductor layer, and includes a pair of barrier layers and a first active layer and a second active layer disposed between the pair of barrier layers. The first active layer and the second active layer respectively include a group 13 elements of different concentrations. The first reflection unit is disposed under the first type semiconductor layer. The second reflection unit is disposed on the second type semiconductor layer, and defines a resonant cavity with the first reflection unit. The quantum well structure is arranged in the resonant cavity.
    Type: Application
    Filed: December 10, 2023
    Publication date: July 4, 2024
    Applicant: InnoLux Corporation
    Inventors: Wei-Ta HUANG, Tzu-Yi Lee, Hao-Chung Kuo, Chun-Hui Huang, Tsau-Hua Hsieh
  • Publication number: 20240222916
    Abstract: A coaxial connector assembly includes: a coaxial connector having an upper mating cavity, a lower mating cavity, and a center pin with a lower pin end extending in the lower mating cavity; and a coaxial socket adapted for being received in the lower mating cavity of the coaxial connector, the socket having: an insulating base having a mating face and a mating hole through the mating face and defining a central axis; and a terminal retained in the insulating base and having plural elastic arms with contacting portions extending into the mating hole for contacting with the lower pin end of the center pin, at least one of the contacting portions of the terminal being located nearer to the mating face than other contacting portions of the terminal.
    Type: Application
    Filed: December 26, 2023
    Publication date: July 4, 2024
    Applicants: FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD., FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventors: WEI-TA TSENG, Shih-Wei Hsiao
  • Publication number: 20240102742
    Abstract: A liquid-cooled cooling structure includes a cooling main body having a condensation chamber and an evaporation chamber arranged vertically therein; a separation member arranged between and separating the condensation chamber and the evaporation chamber, and having a first through hole and a second through hole communicating with the condensation chamber and the evaporation chamber, a dimension of the first through hole being greater than that of the second through hole; a longitudinal partition board received in the condensation chamber and arranged between the first through hole and the second through hole and separating the condensation chamber into a first channel and a second channel; cooling fins extended from an outer perimeter of the cooling main body.
    Type: Application
    Filed: September 25, 2022
    Publication date: March 28, 2024
    Inventors: Yen-Chih CHEN, Chi-Fu CHEN, Wei-Ta CHEN, Hung-Hui CHANG
  • Patent number: 11937901
    Abstract: An arteriovenous fistula (AVF) stenosis detection system and method thereof and sensing device are provided. The AVF stenosis detection system includes: a sensing device including a microphone; and a server coupled to the sensing device. The sensing device contacts a first location of a patient body, wherein there is a first distance between the first location and a second location of an AVF of the patient body, and the first location is located on an extended path of an artery or a vein corresponding to the AVF. The sensing device receives a frequency spectrum signal through the microphone and transmits the frequency spectrum signal to the server. The server calculates a stenosis percentage of the AVF corresponding to the frequency spectrum signal through a machine learning module and transmits the stenosis percentage to the sensing device.
    Type: Grant
    Filed: April 19, 2019
    Date of Patent: March 26, 2024
    Assignee: Above Care Inc.
    Inventors: Wei-Ta Chen, Yung-Hsin Chen
  • Patent number: 11932714
    Abstract: A copolymer, a film composition and a composite material employing the same are provided. The copolymer is a copolymerization product of a composition, wherein the composition includes a monomer (a), a monomer (b) and a monomer (c). The monomer (a) is a compound having a structure represented by Formula (I), the monomer (b) is a compound having a structure represented by Formula (II), and the monomer (c) is a compound having a structure represented by Formula (III) wherein R1, R2, R3, R4, R5 and R6 are as defined in specification.
    Type: Grant
    Filed: July 22, 2022
    Date of Patent: March 19, 2024
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yen-Yi Chu, Yun-Ching Lee, Li-Chun Liang, Wei-Ta Yang, Hsiang-Chin Juan
  • Patent number: 11886296
    Abstract: An apparatus comprises a processing device that is configured to obtain information about driver installations of a given driver on a plurality of computing devices and to obtain information about system failures from the plurality of computing devices. The processing device is further configured to determine a correlation between the driver installations and the system failures and to determine that the given driver is likely to cause a system failure based at least in part on the determined correlation between the driver installations and the system failures. The processing device is further configured to provide an indication that the given driver is likely to cause a system failure to a given computing device. The indication is configured to cause the given computing device to inhibit a presentation of a recommendation to install the given driver to a user of the given computing device.
    Type: Grant
    Filed: February 26, 2021
    Date of Patent: January 30, 2024
    Assignee: Dell Products L.P.
    Inventors: Wei-Ta Chen, Landon Martin Chambers, John Li
  • Patent number: 11799231
    Abstract: An electrical connector includes: an insulative base; a fixed terminal secured to the insulative base; and a movable terminal including a securing portion fixed to the insulative base, a connecting portion, a contacting portion in touch with the fixed terminal, a first and a second beams at two opposite sides of the connecting portion, and a tail, wherein at least one of the first and second beams has a first portion substantially perpendicular to the connecting portion and a second portion substantially parallel to the connecting portion.
    Type: Grant
    Filed: October 26, 2021
    Date of Patent: October 24, 2023
    Assignees: FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD., FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventors: Kai-Chieh Yang, Wei-Ta Tseng, Ming-Ching Chen
  • Publication number: 20230313511
    Abstract: The present invention relates to a shower head hanger comprising a framework and at least one placement basket, where the framework is formed by bending a hollow tube body, a top of the framework is provided with a ring sleeve enabled to be clamped to a shower head fixing seat set on a wall for fixing, the placement basket has a frame and a carrying surface, both sides of one end of the frame are kept horizontal and secured, respectively, on both sides of the framework, the carrying surface is connected below the frame and formed by bending one bar-shaped piece. By using the framework, the present invention realizes easy fixation on the wall and bathroom space saving, and then various bathroom items are placed in the placement basket for convenient access and operation of personnel.
    Type: Application
    Filed: March 29, 2022
    Publication date: October 5, 2023
    Applicant: LC US CORPORATION
    Inventor: Wei-Ta Chiang
  • Publication number: 20230280107
    Abstract: A rapid heat dissipation device is provided to use for a heat source, and includes a heat conducting plate, a heat dissipating fin group, one or a plurality of heat pipes and a siphon heat-dissipating device. The heat conducting plate is thermally attached to the heat source. The heat dissipating fin group is arranged on one side of the heat conducting plate. One end of the heat pipe is fixed to the heat conducting plate, and another end is fixed to the heat dissipating fin group. The siphon heat-dissipating device is stacked above the heat pipe, and one end is fixed to the heat-conducting plate and another end is fixed to the heat-dissipating fin group. Through the siphon heat-dissipating device overlapping up and down with the heat pipe and having the same direction to achieve uniformly heat dissipating and cooling.
    Type: Application
    Filed: March 2, 2022
    Publication date: September 7, 2023
    Inventors: Yen-Chih CHEN, Hsih-Ting YOU, Chi-Fu CHEN, Wei-Ta CHEN, Chien-Yang LIN
  • Patent number: 11746083
    Abstract: A compound, a resin composition and a laminated substrate thereof are provided. The compound has a structure represented by Formula (I) wherein A1 is C24-48 alkylene group, C24-48 alkenylene group, C24-48 alkynylene group, C24-48 alicyclic alkylene group, C24-48 alicyclic alkenylene group, or C24-48 alicyclic alkynylene group. A2 is C2-12 alkylene group, C6-C25 arylene group with two reactive groups, C4-8 cycloalkylene group, C5-25 heteroarylene group, divalent C7-C25 alkylaryl group, divalent C7-25 acylaryl group, divalent C6-25 aryl ether group, or divalent C7-25 acyloxyaryl group; and, n?1.
    Type: Grant
    Filed: December 30, 2020
    Date of Patent: September 5, 2023
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Jyh-Long Jeng, Jeng-Yu Tsai, Wei-Ta Yang
  • Publication number: 20230268437
    Abstract: A power device includes a substrate, an ion well in the substrate, a body region in the ion well, a source doped region in the body region, a drain doped region in the ion well, and gates on the substrate between the source doped region and the drain doped region. The gates include a first gate adjacent to the source doped region, a second gate adjacent to the drain doped region, and a stacked gate structure between the first gate and the second gate.
    Type: Application
    Filed: March 24, 2022
    Publication date: August 24, 2023
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Chih-Chien Chang, Shen-De Wang, Cheng-Hua Yang, LINGGANG FANG, JIANJUN YANG, Wei Ta
  • Patent number: 11732976
    Abstract: A rapid heat dissipation device is provided to use for a heat source, and includes a heat conducting plate, a heat dissipating fin group, one or a plurality of heat pipes and a siphon heat-dissipating device. The heat conducting plate is thermally attached to the heat source. The heat dissipating fin group is arranged on one side of the heat conducting plate. One end of the heat pipe is fixed to the heat conducting plate, and another end is fixed to the heat dissipating fin group. The siphon heat-dissipating device is stacked above the heat pipe, and one end is fixed to the heat-conducting plate and another end is fixed to the heat-dissipating fin group. Through the siphon heat-dissipating device overlapping up and down with the heat pipe and having the same direction to achieve uniformly heat dissipating and cooling.
    Type: Grant
    Filed: March 2, 2022
    Date of Patent: August 22, 2023
    Assignee: AIC INC.
    Inventors: Yen-Chih Chen, Hsih-Ting You, Chi-Fu Chen, Wei-Ta Chen, Chien-Yang Lin
  • Patent number: D1029717
    Type: Grant
    Filed: August 20, 2021
    Date of Patent: June 4, 2024
    Assignee: TRAN HUNG INTERNATIONAL CO., LTD.
    Inventor: Wei Ta Wang