Patents by Inventor Wei-Ta Lo

Wei-Ta Lo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7401642
    Abstract: A heat sink for dissipating heat generated by an integrated circuit package includes a flat base 10, two vertical U-shaped heat pipes 20 and a heat dissipation body. The heat dissipation body includes a pair of side plates 40 and a plurality of fins 50 sandwiched between the side plates 40. Each heat pipe 20 has a horizontal heat absorbing portion 22 attached to the base 10, and two heat dissipation portions 24 extending perpendicularly from opposite ends of the heat absorbing portion 22 and through the side plates 40.
    Type: Grant
    Filed: September 22, 2004
    Date of Patent: July 22, 2008
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Wei-Ta Lo
  • Patent number: 7218525
    Abstract: A fastener for mounting a heat sink on a chip mounted on a printed circuit board includes a cylindrical spring member and a locking member. The locking member includes a pair of action portions extending through the spring member, an elastic insertion portion formed at the bottom of the action portions and located beneath the spring member, and a pair of spaced hooking portions formed from the action portions and engaged with the spring member.
    Type: Grant
    Filed: September 30, 2004
    Date of Patent: May 15, 2007
    Assignees: Fu Zhün Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Wei-Ta Lo, Yi-Qiang Wu
  • Publication number: 20050254217
    Abstract: A fastener for mounting a heat sink on a chip mounted on a printed circuit board includes a cylindrical spring member and a locking member. The locking member includes a pair of action portions extending through the spring member, an elastic insertion portion formed at the bottom of the action portions and located beneath the spring member, and a pair of spaced hooking portions formed from the action portions and engaged with the spring member.
    Type: Application
    Filed: September 30, 2004
    Publication date: November 17, 2005
    Applicant: HON HAI Precision Industry CO., LTD.
    Inventors: Wei-Ta Lo, Yi-Qiang Wu
  • Publication number: 20050133199
    Abstract: A heat sink for dissipating heat generated by an integrated circuit package includes a flat base 10, two vertical U-shaped heat pipes 20 and a heat dissipation body. The heat dissipation body includes a pair of side plates 40 and a plurality of fins 50 sandwiched between the side plates 40. Each heat pipe 20 has a horizontal heat absorbing portion 22 attached to the base 10, and two heat dissipation portions 24 extending perpendicularly from opposite ends of the heat absorbing portion 22 and through the side plates 40.
    Type: Application
    Filed: September 22, 2004
    Publication date: June 23, 2005
    Inventor: Wei-Ta Lo
  • Patent number: 6813155
    Abstract: A heat sink clip includes a main body (20), and an operating body (40) rotatably attached to the main body. The main body includes a central portion (21), and two clipping portions (23) depending from opposite ends thereof. Two mounting portions (27) depend from the main body. A claw (25) is formed on each mounting portion. The operating body includes a shaft (41) rotatably received in the claws of the main body, and a handle (43) perpendicularly extending from one end of the shaft. A cam (45) is formed on the shaft. Two annular recesses (47) are defined in the shaft at opposite sides of the cam, the recesses rotatably receiving the claws. If the operating body needs to be replaced with another operating body having a different sized cam, the operating body is easily pulled out from the claws.
    Type: Grant
    Filed: February 11, 2003
    Date of Patent: November 2, 2004
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventor: Wei-Ta Lo
  • Publication number: 20040134642
    Abstract: A heat dissipation device includes a heat sink (10) and a pair of heat pipes (20). The heat sink includes a base (12), a top plate (18), and a plurality of fins (16) thermally connecting the base and the plate through solder. Opposite ends of each heat pipe are engaged with the base and the plate respectively, for transferring heat accumulated at the base to the plate.
    Type: Application
    Filed: August 11, 2003
    Publication date: July 15, 2004
    Inventor: Wei-Ta Lo
  • Publication number: 20040062008
    Abstract: A heat sink clip includes a main body (20), and an operating body (40) rotatably attached to the main body. The main body includes a central portion (21), and two clipping portions (23) depending from opposite ends thereof. Two mounting portions (27) depend from the main body. A claw (25) is formed on each mounting portion. The operating body includes a shaft (41) rotatably received in the claws of the main body, and a handle (43) perpendicularly extending from one end of the shaft. A cam (45) is formed on the shaft. Two annular recesses (47) are defined in the shaft at opposite sides of the cam, the recesses rotatably receiving the claws. If the operating body needs to be replaced with another operating body having a different sized cam, the operating body is easily pulled out from the claws.
    Type: Application
    Filed: February 11, 2003
    Publication date: April 1, 2004
    Inventor: Wei-Ta Lo
  • Patent number: 6480384
    Abstract: A clip (40) adapted to attach a heat sink (30) to an electronic device (20) includes a body (50) and a lever (70). The lever is fastened to the body with a pivot (96). The lever includes a pressing portion (74) and a bore (80). First and second contact points (76, 78) are defined at a lower edge of the pressing portion at different distances from the bore. The clip is initially placed in a groove (36) of the heat sink, whereupon the first contact point abuts a top surface of the groove. When the lever is fully depressed, the second contact point firmly abuts the top surface of the groove. Thus the clip securely attaches the heat sink to the electronic device.
    Type: Grant
    Filed: December 4, 2000
    Date of Patent: November 12, 2002
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventor: Wei-Ta Lo
  • Patent number: 6459583
    Abstract: A heat dissipating assembly includes a heat sink (12) and a pair of clips (14). The heat sink has a base (20) defining a pair of slots (24) spaced from each other, and a plurality of fins (22) extending from a top surface of the base between the slots. The clip defines a pressing body (40) and two legs (50) extending from opposite ends of the pressing body, each leg defining an aperture (52). A horizontal portion (48) formed at the middle of the pressing body forms a U-shaped hook (42) extending downward from one side edge thereof. The hook is elastically deformable to be engagingly and interferentially received in the slot of the base of the heat sink for attaching the clip to the heat sink. The assembly is a singe unit ready to be conveniently mounted onto an electronic device.
    Type: Grant
    Filed: October 10, 2000
    Date of Patent: October 1, 2002
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventor: Wei-Ta Lo
  • Patent number: 6452800
    Abstract: A heat sink assembly for an electrical socket of the present invention comprises a heat sink and a latching member latching with a pair of lugs on the socket. The heat sink comprises a base plate and a plurality of fins projecting upward therefrom. A receiving channel is integrally formed between the fins in the base plate for receiving the latching member. A pair of positioning tabs depends downward from a bottom surface of the base plate to tightly engage in a slit between the electric socket and a CPU mounted thereon for positioning the heat sink assembly on the CPU and keeping it from moving along the CPU. The receiving channel and the fins extend in a first direction while the tabs extend in a second direction vertical to the first direction.
    Type: Grant
    Filed: June 18, 2001
    Date of Patent: September 17, 2002
    Assignee: Hon Hai Precision Ind., Co., Ltd.
    Inventors: Chao-Yang Lee, Chao Kun Tseng, Chung-Yung Sun, Wei-Ta Lo
  • Patent number: 6373701
    Abstract: A heat dissipation assembly (20) includes a heat sink (10) and a metal plate (30). The heat sink includes a chassis (14) and a plurality of fins (12). The chassis forms a pair of tabs (17) depending from each of two opposite sides of a bottom surface (15) of the chassis. First and second flanges (18, 19) respectively depend from the opposite sides, between the tabs. A material (45) with low thermal resistance is arranged between the metal plate and the chassis. The metal plate is attached to the bottom surface of the chassis. The flanges are bent inwardly to fasten the metal plate to the chassis.
    Type: Grant
    Filed: October 25, 2000
    Date of Patent: April 16, 2002
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventor: Wei-Ta Lo
  • Patent number: 6370024
    Abstract: A heat sink clip (30) includes a spring portion (31) and two arms (36) extending from respective opposite ends of the spring portion. The spring portion has a horizontal portion (35) which forms a tab (33) extending horizontally and then downwardly from a side edge of the horizontal portion. The tab defines a positioning hole (34) for engaging with a catch (62) formed on a side wall of a retention module (60). Each arm defines an aperture (37) for engaging with a beam (61) formed on each end of the retention module. The end of each arm extends outward to form a T-shaped handle (40). The handle includes an L-shaped connecting portion (41) and an L-shaped operation portion (42).
    Type: Grant
    Filed: September 21, 2000
    Date of Patent: April 9, 2002
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventor: Wei-Ta Lo
  • Publication number: 20020036891
    Abstract: A clip (40) adapted to attach a heat sink (30) to an electronic device (20) includes a body (50) and a lever (70). The lever is fastened to the body with a pivot (96). The lever includes a pressing portion (74) and a bore (80). First and second contact points (76, 78) are defined at a lower edge of the pressing portion at different distances from the bore. The clip is initially placed in a groove (36) of the heat sink, whereupon the first contact point abuts a top surface of the groove. When the lever is fully depressed, the second contact point firmly abuts the top surface of the groove. Thus the clip securely attaches the heat sink to the electronic device.
    Type: Application
    Filed: December 4, 2000
    Publication date: March 28, 2002
    Inventor: Wei-Ta Lo
  • Patent number: 6360812
    Abstract: A heat dissipating assembly (10) includes a heat sink (12), a pair of clips (14), and a pair of holders (16). The heat sink includes a chassis (20) defining a pair of slots (24) spaced from each other and a plurality of fins (22) extending from the chassis between the slots. Each clip includes a central horizontal portion (42), two pressing bodies (40) extending from respective sides of the horizontal portion, and two legs (44) extending from respective distal ends of the pressing bodies. Each leg defines an aperture (46). Each holder has a tab (62) and a U-shaped hook (64) depending perpendicularly from respective opposite ends thereof. Each hook is elastically deformable to be engagingly received in the slot of the chassis. The horizontal portion of each clip is located between the tab and the hook of the holder, whereby the clip is attached to the heat sink by the holder.
    Type: Grant
    Filed: September 12, 2000
    Date of Patent: March 26, 2002
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventor: Wei-Ta Lo
  • Patent number: 6341644
    Abstract: A heat sink assembly includes a fan, a heat sink, and a fixing device which attaches the fan to the heat sink. The heat sink has a plurality of fins. Four catches are respectively formed on four outermost fins, two on each of two longitudinal sides of the base. The fixing device has a base and four legs depending from respective corners of the base. A pair of protrusions depends from the base near respective lateral sides of the base. Four poles extend upwardly from the base near respective corners of the base. Each leg defines an aperture for engaging with the corresponding catch of the heat sink. The fan defines four through holes for respectively receiving the poles of the fixing device.
    Type: Grant
    Filed: October 6, 2000
    Date of Patent: January 29, 2002
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventors: Wei-Ta Lo, Chung-Yung Sun
  • Patent number: 6341065
    Abstract: A heat sink clip (10) includes a body (12) and a fastener (14). The body includes a spring portion (20) positioned above a heat sink, and two legs (28) extending from opposite ends of the spring portion. Each leg defines an aperture (30) for engaging a catch of a retention module mounted beside an electronic device. The spring portion has a horizontal section (26) which forms a spring tongue (21). A pair of L-shaped guiding tabs (22) is formed under and spaced from the horizontal section, with a space defined between the horizontal section and the guiding tabs. A gap (24) is formed between the guiding tabs. The fastener includes an operation portion (40), and a connecting portion (42) for insertion in the space between the horizontal section and the guiding tabs. The connecting portion defines a slot (43) for engagement with the spring tongue of the body. A spring tab (46) is formed under the connecting portion.
    Type: Grant
    Filed: October 4, 2000
    Date of Patent: January 22, 2002
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventor: Wei-Ta Lo
  • Patent number: 6317323
    Abstract: A heat sink assembly for an electrical socket of the present invention comprises a heat sink and a latching member latching with a pair of lugs on the socket. The heat sink comprises a base plate and a plurality of fins projecting upward therefrom. A receiving channel is integrally formed by a pressing means between the fins in the base plate for receiving the latching member. A pair of positioning pins depend downward from a bottom surface of the base plate to tightly engage in a slit between the electric socket and a CPU mounted thereon for positioning the heat sink assembly on the CPU and keeping it from moving along the CPU.
    Type: Grant
    Filed: December 29, 1999
    Date of Patent: November 13, 2001
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventors: Chao-Yang Lee, Chao Kun Tseng, Chung-Tung Sun, Wei-Ta Lo
  • Patent number: 6311765
    Abstract: A heat sink assembly includes a heat sink, a clip and a fastener. The heat sink includes a base and a plurality of fins extending upwardly from the base. A slot is defined between the fins. Grooves are defined on opposite sides of a particular row of the fins. The clip defines a spring portion received in the slot of the heat sink. The curved fastener forms a pair of projections with a gap defined therebetween extending inwardly from both ends of the fastener for engaging the corresponding grooves of the heat sink. A tab is defined on one side of the fastener for engagement with an edge of one of the fins.
    Type: Grant
    Filed: August 3, 2000
    Date of Patent: November 6, 2001
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Wei-Ta Lo, Chung-Yung Sun, Chao-Yang Lee
  • Publication number: 20010030853
    Abstract: A heat sink assembly for an electrical socket of the present invention comprises a heat sink and a latching member latching with a pair of lugs on the socket. The heat sink comprises a base plate and a plurality of fins projecting upward therefrom. A receiving channel is integrally formed between the fins in the base plate for receiving the latching member. A pair of positioning tabs depends downward from a bottom surface of the base plate to tightly engage in a slit between the electric socket and a CPU mounted thereon for positioning the heat sink assembly on the CPU and keeping it from moving along the CPU. The receiving channel and the fins extend in a first direction while the tabs extend in a second direction vertical to the first direction.
    Type: Application
    Filed: June 18, 2001
    Publication date: October 18, 2001
    Inventors: Chao-Yang Lee, Chao Kun Tseng, Chung-Yung Sun, Wei-Ta Lo
  • Patent number: 6304452
    Abstract: A clip includes a pin (40) and a leaf spring (50). The pin includes a columnar body (44), an expanded head (42) formed at a top end of the body, and a cone-shaped plug (48) formed at a bottom end of the body opposite the head. A slot (488) is defined through the plug and a bottom portion of the body, to enable the plug to elastically deform. The plug is thus adapted for extending through a heat sink and engaging with a printed circuit board. A flange (46) extends perpendicularly from the body between the head and the plug. The leaf spring includes a base (51), with an opening (52) defined therein for extension of the pin therethrough. A pair of inflexed prolongations (53) extends progressively downwards from opposite corners of the base, with the width of each prolongation being less than half the width of the base.
    Type: Grant
    Filed: September 25, 2000
    Date of Patent: October 16, 2001
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventor: Wei-Ta Lo