Patents by Inventor Wei-Tai C.-I. CHIU

Wei-Tai C.-I. CHIU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9180609
    Abstract: This invention discloses a method of forming an uneven structure on a substrate. Cut a plurality of trenches in an order on a surface of a mold through a control system, wherein the plurality of trenches comprise at least one first trench, wherein for any second trench of the at least one first trench, the second trench overlaps with at least one third trench different from the second trench such that the second trench is cut off by the at least one third trench. Use the surface of the mold to emboss a thin film on the substrate to form the uneven structure.
    Type: Grant
    Filed: August 26, 2014
    Date of Patent: November 10, 2015
    Assignee: UBright Optronics Corporation
    Inventors: Ching-An Yang, Wei-Tai C.-I. Chiu, Han-Tsung Pan, Lung-Pin Hsin, Yu-Mei Juan
  • Publication number: 20140367873
    Abstract: This invention discloses a method of forming an uneven structure on a substrate. Cut a plurality of trenches in an order on a surface of a mold through a control system, wherein the plurality of trenches comprise at least one first trench, wherein for any second trench of the at least one first trench, the second trench overlaps with at least one third trench different from the second trench such that the second trench is cut off by the at least one third trench. Use the surface of the mold to emboss a thin film on the substrate to form the uneven structure.
    Type: Application
    Filed: August 26, 2014
    Publication date: December 18, 2014
    Inventors: Ching-An YANG, Wei-Tai C.-I. CHIU, Han-Tsung PAN, Lung-Pin HSIN, Yu-Mei JUAN