Abstract: Methods applicable in metrology modules and tools are provided, which enable adjusting metrology measurement parameters with respect to process variation, without re-initiating metrology recipe setup. Methods comprise, during an initial metrology recipe setup, recording a metrology process window and deriving baseline information therefrom, and during operation, quantifying the process variation with respect to the baseline information, and adjusting the metrology measurement parameters within the metrology process window with respect to the quantified process variation. The quick adjustment of metrology parameters avoids metrology-related process delays and releases prior art bottlenecks related thereto. Models of effects of various process variation factors on the metrology measurements may be used to enhance the derivation of required metrology tuning and enable their application with minimal delays to the production process.

Abstract: A light emitting package structure and a method of manufacturing the light emitting package structure are provided. The method includes: a preparation process: mounting a light emitting unit on a substrate; a dispensing process: coating a sealant on a first joint area of the substrate; a cover-enclosing process: disposing a cover element having a second joint area on the substrate, the first joint area and the second joint area joined to each other by the sealant; a vacuum process: reducing an ambient pressure to a first pressure lower than the original ambient pressure; a pressure-adjusting process: adjusting the ambient pressure around the package structure to a second pressure higher than the first pressure; and a curing process: curing the sealant.

Abstract: A light emitting structure includes a substrate, a light emitting unit disposed on the substrate, an annular wall, a first bonding layer adhering to the annular wall and the substrate, and a compound body. The light emitting unit is arranged inside of the annular wall. The annular wall, the first bonding layer, and the first surface surroundingly define a gap. The compound body is arranged in a space defined by the annular wall, and includes a reinforcing portion filled in the gap so as to connect the annular wall, the first bonding layer, and the substrate.

Abstract: Methods applicable in metrology modules and tools are provided, which enable adjusting metrology measurement parameters with respect to process variation, without re-initiating metrology recipe setup. Methods comprise, during an initial metrology recipe setup, recording a metrology process window and deriving baseline information therefrom, and during operation, quantifying the process variation with respect to the baseline information, and adjusting the metrology measurement parameters within the metrology process window with respect to the quantified process variation. The quick adjustment of metrology parameters avoids metrology-related process delays and releases prior art bottlenecks related thereto. Models of effects of various process variation factors on the metrology measurements may be used to enhance the derivation of required metrology tuning and enable their application with minimal delays to the production process.

Abstract: An package structure includes a substrate, a pair of electrodes and a solder pad layer both electrically connected to each other and respectively disposed on two opposite surfaces of the substrate, a lighting diode arranged above the substrate and electrically connected to the pair of electrodes, a wall disposed on the substrate and arranged around the lighting diode, and a package compound disposed inside of the wall and covering the lighting diode. The package compound includes an attaching portion disposed on a top surface of the lighting diode, and a surrounding portion arranged around the attaching portion. The surrounding portion has an annular slot arranged on a top surface thereof. A bottom end of the annular slot is located at a position aligning with 25%˜90% of a thickness of the lighting diode along a height direction.

Abstract: A light-emitting device and a control method are provided. The light-emitting device is applied to a memory module. The light-emitting device includes at least one memory module board, at least one light-emitting board and an application program unit. The at least one memory module board is connected with a host. Each light-emitting board includes plural light-emitting units and a control unit. The control unit controls a lighting mode of the plural light-emitting units. The control unit is electrically connected with the host through the corresponding memory module board. The application program unit generates a control signal. The control signal is transmitted to the control unit of each light-emitting board through the host. The control unit controls the corresponding light-emitting units according to the control signal.

Abstract: A storage device includes two flash memories of different flash memory types, and respectively including multiple data blocks. Each data block corresponds to a physical and a logical block address. The storage device further includes a processing module including a controller, which is capable of accessing two mapping tables respectively corresponding to the two flash memories and respectively recording the physical block addresses and the logical block addresses that correspond to the data blocks of the two flash memories. The controller is configured to determine, upon receipt of a command that contains a target logical block address therein, a selected one of the flash memories according to the target logical block address, and to locate a selected one of the physical block addresses by searching one of the mapping tables that corresponds to the selected one of the flash memories with reference to the target logical block address.

Abstract: A storage device includes two flash memories of different flash memory types, and respectively including multiple data blocks. Each data block corresponds to a physical and a logical block address. The storage device further includes a processing module including a controller, which is capable of accessing two mapping tables respectively corresponding to the two flash memories and respectively recording the physical block addresses and the logical block addresses that correspond to the data blocks of the two flash memories. The controller is configured to determine, upon receipt of a command that contains a target logical block address therein, a selected one of the flash memories according to the target logical block address, and to locate a selected one of the physical block addresses by searching one of the mapping tables that corresponds to the selected one of the flash memories with reference to the target logical block address.