Abstract: A method for deploying and controlling a mobile operating system on a platform comprises sending a first deployment message to the platform by an administration console; establishing a first communicable connection to the platform by a mobile communication device; getting at least an image file of a mobile operating system and an image file of a first mobile application from a data center, activating the mobile operating system by the platform and executing the first mobile application; executing a remounting procedure by the administration console according to another instruction sent from the mobile communication device; wherein the remounting procedure is configured to disconnect the first communicable connection and establish a second communicable connection between the mobile communication device and the platform or another platform that the mobile operating system and a second mobile application can be executed on the platform or on said another platform.

Abstract: A method for deploying and controlling a mobile operating system on a platform comprises sending a first deployment message to the platform by an administration console; establishing a first communicable connection to the platform by a mobile communication device; getting at least an image file of a mobile operating system and an image file of a first mobile application from a data center, activating the mobile operating system by the platform and executing the first mobile application; executing a remounting procedure by the administration console according to another instruction sent from the mobile communication device; wherein the remounting procedure is configured to disconnect the first communicable connection and establish a second communicable connection between the mobile communication device and the platform or another platform that the mobile operating system and a second mobile application can be executed on the platform or on said another platform.

Abstract: An optical sensor module is provided. The optical sensor module includes a light source, a first lens and a sensor device. The light source is arranged for generating a light signal. The first lens has a first optical center axis. The sensor device is disposed in correspondence with one side of the first lens. The sensor device includes a light sensitive area, and a center of the light sensitive area deviates from the first optical center axis. The sensor device is arranged for receiving a reflected signal reflected from an object in response to the light signal, and accordingly generating a sensing result.

Abstract: An optical sensor module is provided. The optical sensor module includes a light source, a first lens and a sensor device. The light source is arranged for generating a light signal. The first lens has a first optical center axis. The sensor device is disposed in correspondence with one side of the first lens. The sensor device includes a light sensitive area, and a center of the light sensitive area deviates from the first optical center axis. The sensor device is arranged for receiving a reflected signal reflected from an object in response to the light signal, and accordingly generating a sensing result.

Abstract: An optical sensor module is provided. The optical sensor module includes a light source, a first lens and a sensor device. The light source is arranged for generating a light signal. The first lens has a first optical center axis. The sensor device is disposed in correspondence with one side of the first lens. The sensor device includes a light sensitive area, and a center of the light sensitive area deviates from the first optical center axis. The sensor device is arranged for receiving a reflected signal reflected from an object in response to the light signal, and accordingly generating a sensing result.

Abstract: An optical sensor module is provided. The optical sensor module includes a light source, a first lens and a sensor device. The light source is arranged for generating a light signal. The first lens has a first optical center axis. The sensor device is disposed in correspondence with one side of the first lens. The sensor device includes a light sensitive area, and a center of the light sensitive area deviates from the first optical center axis. The sensor device is arranged for receiving a reflected signal reflected from an object in response to the light signal, and accordingly generating a sensing result.

Abstract: A portable electronic device uses the initial heartbeat value to calculate a possible heartbeat variation. Then a reference range is determined. Only the real time heartbeat value falling in the reference range is output as a correct real time heartbeat value. Thus, the too large or too small erroneous heartbeat values influenced by the vibration noise are eliminated to precisely output the correct real time heartbeat value. Therefore, the extra vibration sensors need not to be installed to lower the cost and to reduce the volume.

Abstract: A system for through silicon via (TSV) structure measurement comprises a reflectometer, and a computing unit. The reflectometer emits a broadband light beam to at least a TSV structure and receives a reflection spectrum of at least a TSV structure. The computing unit is coupled with the reflectometer and determines the depth of the TSV structure in accordance with the reflection spectrum.

Abstract: An operation method of dual operating systems, a touch sensitive electronic device having dual operating systems, and a computer readable storage medium having dual operating systems are disclosed. The touch sensitive electronic device includes an image outputting interface and a touch sensitive screen, and is capable of operating a first operating system and a second operating system simultaneously. First, whether the image outputting interface is connected with a display device is detected when the touch sensitive screen displays the operation screen of the first operating system. Then, the operation screen of the second operating system is output to the display device via the image outputting interface when the image outputting interface is connected with the display device. Lastly, a virtual input interface is displayed on the operation screen of the first operating system displayed on the touch sensitive screen.

Abstract: A method for measuring a via bottom profile is disclosed for obtaining a profile of a bottom of a via in a front side of a substrate. In this method, an infrared (IR) light source is transmitted from the back of the substrate to the bottom of the via through an objective by using an IR-microscope, and lights scattered from the bottom of the via are acquired by an image capturing device to generate an image, where the image displays a diameter (2Ea) of the via bottom profile and a diameter (2Ec) of a maximum receivable base area of the via for the IR-microscope. Thereafter, by using an elliptic equation, a minor axis radius thereof (Eb) is obtained, and thus the via bottom profile is obtained from a radius (Ea) of the via bottom profile and the minor axis radius (Eb) of the elliptic equation.

Abstract: A method for designing an overlay target comprises selecting a plurality of overlay target pairs having different overlay errors or offsets, calculating a deviation of the simulated diffraction spectrum for each overlay target pair, selecting a plurality of sensitive overlay target pairs by taking the deviation of the simulated diffraction spectrum into consideration, selecting an objective overlay target pair from the sensitive overlay target pairs by taking the influence of the structural parameters to the simulated diffraction spectrum into consideration, and designing the overlay target pair based on the structural parameter of the objective overlay target pair.

Abstract: A method for designing a two-dimensional array overlay target comprises the steps of: selecting a plurality of two dimensional array overlay targets having different overlay errors; calculating a deviation of a simulated diffraction spectrum for each two-dimensional array overlay target; selecting an error-independent overlay target by taking the deviations of the simulated diffraction spectra into consideration; and designing a two dimensional array overlay target based on structural parameters of the error-independent overlay target.

Abstract: A method for designing a two-dimensional array overlay target set comprises the steps of: selecting a plurality of two-dimensional array overlay target sets having different overlay errors; calculating a deviation of a simulated diffraction spectra for each two-dimensional array overlay target set; selecting a sensitive overlay target set by taking the deviations of the simulated diffraction spectra into consideration; and designing a two-dimensional array overlay target set based on the structural parameters of the sensitive overlay target set.

Abstract: A system for through silicon via (TSV) structure measurement comprises a reflectometer, and a computing unit. The reflectometer emits a broadband light beam to at least a TSV structure and receives a reflection spectrum of at least a TSV structure. The computing unit is coupled with the reflectometer and determines the depth of the TSV structure in accordance with the reflection spectrum.

Abstract: A method for measuring a via bottom profile is disclosed for obtaining a profile of a bottom of a via in a front side of a substrate. In this method, an infrared (IR) light source is transmitted from the back of the substrate to the bottom of the via through an objective by using an IR-microscope, and lights scattered from the bottom of the via are acquired by an image capturing device to generate an image, where the image displays a diameter (2Ea) of the via bottom profile and a diameter (2Ec) of a maximum receivable base area of the via for the IR-microscope. Thereafter, by using an elliptic equation, a minor axis radius thereof (Eb) is obtained, and thus the via bottom profile is obtained from a radius (Ea) of the via bottom profile and the minor axis radius (Eb) of the elliptic equation.

Abstract: A system for via structure measurement is disclosed. The system comprises a reflectometer, a simulation unit and a comparing unit. The reflectometer is configured to collect a measured diffraction spectrum of at least a via. The simulation unit is configured to provide simulated diffraction spectrums of the at least a via. The comparing unit is configured to determine at least a depth and at least a bottom profile of the at least a via by comparing the collected diffraction spectrum and the simulated diffraction spectrums.

Abstract: A method for designing an overlay target comprises selecting a plurality of overlay target pairs having different overlay errors or offsets, calculating a deviation of the simulated diffraction spectrum for each overlay target pair, selecting a plurality of sensitive overlay target pairs by taking the deviation of the simulated diffraction spectrum into consideration, selecting an objective overlay target pair from the sensitive overlay target pairs by taking the influence of the structural parameters to the simulated diffraction spectrum into consideration, and designing the overlay target pair based on the structural parameter of the objective overlay target pair.

Abstract: A system for via structure measurement is disclosed. The system comprises a reflectometer, a simulation unit and a comparing unit. The reflectometer is configured to collect a measured diffraction spectrum of at least a via. The simulation unit is configured to provide simulated diffraction spectrums of the at least a via. The comparing unit is configured to determine at least a depth and at least a bottom profile of the at least a via by comparing the collected diffraction spectrum and the simulated diffraction spectrums.

Abstract: A method for designing a two-dimensional array overlay target set comprises the steps of: selecting a plurality of two-dimensional array overlay target sets having different overlay errors; calculating a deviation of a simulated diffraction spectra for each two-dimensional array overlay target set; selecting a sensitive overlay target set by taking the deviations of the simulated diffraction spectra into consideration; and designing a two-dimensional array overlay target set based on the structural parameters of the sensitive overlay target set.

Abstract: A method for designing a two-dimensional array overlay target comprises the steps of: selecting a plurality of two dimensional array overlay targets having different overlay errors; calculating a deviation of a simulated diffraction spectrum for each two-dimensional array overlay target; selecting an error-independent overlay target by taking the deviations of the simulated diffraction spectra into consideration; and designing a two dimensional array overlay target based on structural parameters of the error-independent overlay target.