Patents by Inventor Wei Te Wang

Wei Te Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10986751
    Abstract: An external air baffle nozzle has a top surface, a bottom surface, and a pair of sidewalls separating the top surface from the bottom surface. An end of the pair of sidewalls, an end of the top surface and an end of the bottom surface define an inlet. An opposite end of the pair of sidewalls, an opposite end of the top surface, and an opposite end of the bottom surface define an outlet. The outlet has a smaller cross section than a cross section of the inlet.
    Type: Grant
    Filed: January 27, 2020
    Date of Patent: April 20, 2021
    Assignee: QUANTA COMPUTER INC.
    Inventors: Yi-Chieh Chen, Jen-Mao Chen, Wei-Te Wang, Shuo-Ting Jian
  • Patent number: 10653040
    Abstract: The present disclosure is directed to an apparatus for a server chassis. A position of the apparatus changes the airflow in the server chassis. The apparatus can be adjacent to a slot in the server chassis. The apparatus adjusts among a plurality of positions based on a height of the slot and/or a size of a computer component received at the slot. The apparatus includes a base portion and an arm. The base portion can couple with a wall of the chassis body, and the arm can include a plurality of moveable segments.
    Type: Grant
    Filed: May 21, 2019
    Date of Patent: May 12, 2020
    Assignee: QUANTA COMPUTER INC.
    Inventors: Wei-Te Wang, Shuo-Ting Jian, Samuel Chatelier, Yi-Chieh Chen
  • Publication number: 20160227668
    Abstract: A heat sink includes a base and a removable air guide member. The base includes a thermal plate and two air guide plates fixed to opposite two sides of the thermal plate. An air guide channel is formed between the thermal plate and the two air guide plates. The fins are connected to the thermal plate. One end of each air guide plate bends and extends to form a windshield while another end has a connection portion. The removable air guide member is detachably connected to the base. The removable air guide member includes two vertical plates. One end of each vertical plate is connected to the connection portion while another end bends outward and extends to form a horizontal plate. Thereby, the cooling module and the heat sink can be installed on a motherboard with electronic components arranged densely and may receive maximum airflow.
    Type: Application
    Filed: January 31, 2015
    Publication date: August 4, 2016
    Inventors: Wei-Te WANG, Chi-Yuan Hsiao, Yao-Sheng GUO
  • Publication number: 20160212880
    Abstract: In an air guide heat sink and an air guide cooling module, the air guide heat sink includes a base and a pair of U-shaped air guide members. The base is connected with a plurality of fins. The pair of U-shaped air guide members is detachably connected to the base. The pair of U-shaped air guide members and the base surround and form an air guide channel. Each of the U-shaped air guide members has a vertical plate and two ends of the vertical plate extend towards a direction away from the base and form two horizontal plates. Thereby, the air guide cooling module and the air guide heat sink may be installed on the motherboard with electronic components densely disposed thereon. Additionally, the air guide cooling module and the air guide heat sink may receive maximum airflow.
    Type: Application
    Filed: January 20, 2015
    Publication date: July 21, 2016
    Inventors: Wei-Te WANG, Ming-Hung TSAI, Yan-Yu LEE
  • Patent number: 8884441
    Abstract: The present disclosure relates to an integrated chip (IC) having an ultra-thick metal layer formed in a metal layer trench having a rounded shape that reduces stress between an inter-level dielectric (ILD) layer and an adjacent metal layer, and a related method of formation. In some embodiments, the IC has an inter-level dielectric layer disposed above a semiconductor substrate. The ILD layer has a cavity with a sidewall having a plurality of sections, wherein respective sections have different slopes that cause the cavity to have a rounded shape. A metal layer is disposed within the cavity. The rounded shape of the cavity reduces stress between the ILD layer and the metal layer to prevent cracks from forming along an interface between the ILD layer and the metal layer.
    Type: Grant
    Filed: February 18, 2013
    Date of Patent: November 11, 2014
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chih-Hung Hsueh, Wei-Te Wang, Shao-Yu Chen, Chun-Liang Fan, Kuan-Chi Tsai
  • Publication number: 20140231955
    Abstract: The present disclosure relates to an integrated chip (IC) having an ultra-thick metal layer formed in a metal layer trench having a rounded shape that reduces stress between an inter-level dielectric (ILD) layer and an adjacent metal layer, and a related method of formation. In some embodiments, the IC has an inter-level dielectric layer disposed above a semiconductor substrate. The ILD layer has a cavity with a sidewall having a plurality of sections, wherein respective sections have different slopes that cause the cavity to have a rounded shape. A metal layer is disposed within the cavity. The rounded shape of the cavity reduces stress between the ILD layer and the metal layer to prevent cracks from forming along an interface between the ILD layer and the metal layer.
    Type: Application
    Filed: February 18, 2013
    Publication date: August 21, 2014
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chih-Hung Hsueh, Wei-Te Wang, Shao-Yu Chen, Chun-Liang Fan, Kuan-Chi Tsai
  • Patent number: 6647625
    Abstract: A method for fabricating a heat pipe structure in a radiating plate is provided. A tunneling means is used to form a plurality of radiating channels in the radiating plate. Each of the plurality of radiating channels has only one opening. Then, only one of the openings of the radiating channels is left unsealed, while sealing the other openings of the radiating channels. Working fluid is injected into the radiating channels via the unsealed opening. The radiating channels are vacuated and the unsealed opening is sealed.
    Type: Grant
    Filed: December 13, 2001
    Date of Patent: November 18, 2003
    Inventors: Wei Te Wang, Hung-Bin Chan
  • Publication number: 20030110631
    Abstract: A method for fabricating a heat pipe structure in a radiating plate is provided. A tunneling means is used to form a plurality of radiating channels in the radiating plate. Each of the plurality of radiating channels has only opening. Then, only one of the openings of the radiating channels is not sealed, while sealing the other openings of the radiating channels. Working fluid is injected into the radiating channels via the reserved opening. Radiating channels is vacuated and the reserved opening is sealed.
    Type: Application
    Filed: December 13, 2001
    Publication date: June 19, 2003
    Inventors: Wei Te Wang, Hung-Bin Chan
  • Patent number: 6097282
    Abstract: A memory device having the function of detecting the locking or unlocking condition of a remote controller comprises a battery, a key circuit a memory unit, a light emitting element, a testing key, an encoding unit, an infrared ray or a high frequency emitting driving circuit, etc. The positive end of the battery is connected with the power source (V+) of the memory unit. The lock key and unlock key of the key circuit are connected with the respective input end of the memory unit and the encoding unit. The output end of the memory unit is connected with one end of the light emitting element. Another end of the light emitting element is connected with one connection of the testing key and another end of the testing key is grounded. By the action of the testing key, the condition of the remote controller may inform the user. That is, if it is in a lock condition, then the light emitting element will light, while if it is in a "unlock" condition, then the light emitting element will extinguish.
    Type: Grant
    Filed: August 24, 1998
    Date of Patent: August 1, 2000
    Inventor: Wei Te Wang