Patents by Inventor Wei-Tei Shih

Wei-Tei Shih has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Composite enclosure for electronic hardware
    Patent number: 5520976
    Abstract: The present invention contemplates a significant departure from known shielded enclosure designs by providing an enclosure for electronic modules, comprising walls made of composite material including conductive fibers for shielding the enclosure interior from electromagnetic radiation, and means for securely mounting at least one module inside the enclosure with a fastener means, the mounting means comprising composite material. The present invention further contemplates methods for making shielded enclosures and card guides for such enclosures that represent a significant improvement over known enclosure designs. This invention contemplates composite cold walls and composite fins. These composite fins and cold walls may be used alone or together in structures and enclosures which are useful in conducting heat.
    Type: Grant
    Filed: June 16, 1994
    Date of Patent: May 28, 1996
    Assignee: Simmonds Precision Products Inc.
    Inventors: William B. Giannetti, David G. Hess, Stuart J. McCord, Robert E. Rudd, III, Wei-Tei Shih