Abstract: A semiconductor package includes a chip, a circuit board and a filling material. The circuit board includes a substrate, a patterned metal layer and a protective layer. A circuit area, a chip-mounting area and a flow-guiding area are defined on a surface of the substrate. The chip is mounted on the chip-mounting area. A flow-guiding member of the patterned metal layer is arranged on the flow-guiding area and includes a hollow portion and flow-guiding grooves which are communicated with the hollow portion and arranged radially. The flow-guiding grooves are provided to allow the protective layer to flow toward the hollow portion, and the hollow portion and the flow-guiding grooves are provided to allow the filling material to flow toward the protective layer such that the filling material can cover the protective layer to improve structural strength of the semiconductor package.

Abstract: The present invention discloses a miniature photographic apparatus applicable to an endoscopic device, and including a casing, at least one light source device and at least one viewing lens device. The casing is disposed at a front end of the endoscopic device. The casing includes an accommodating space. The light source device is disposed in the accommodating space, and emits at least one light and includes a first protecting layer at a front end of the light source device. The viewing lens device is disposed in the accommodating space and includes a second protecting layer at a front end of the viewing lens device. The second protecting layer is separated from the first protecting layer to prevent lights reflected by the second protecting layer from entering into the viewing lens device.

Abstract: An endoscope with a USB signal transmission includes an exploring tube, a lens, an image sensing element and a USB chip. The image sensing element has an output circuit for outputting a series signal. The USB chip is coupled to an image sensing element. The series-to-universal series unit converts the series signal into a universal series bus signal. The power supply circuit supplies electric power to the image sensing element. The data transmission circuit transmits a universal series bus signal. The USP chip integrates the output circuit into a power supply circuit and a data transmission circuit of a USB specification and converts the series signal into the universal series bus signal.

Abstract: The present invention discloses a two-way endoscope steering mechanism and four-way endoscope steering mechanism, and the two-way endoscope steering mechanism includes a hollow steering member, a two-way flexible plastic member and a guiding wire member. The hollow steering member has a hollow positioning portion and a connecting portion. The guiding wire member is passed and installed in the hollow positioning portion. The densely wound coil is coupled to an end of a steering module, and the steering module is formed by arranging and coupling the two-way flexible plastic member to the hollow steering member, and the densely wound coil is sheathed on the guiding wire member, such that the guiding wire member can be pulled to drive the steering module to turn in a direction.

Abstract: The present invention discloses a micro sensing apparatus comprising a sensing device, a cylindrical plastic body and a plurality of circuits. The sensing device has a bottom surface. The cylindrical plastic body is axially coupled to the sensing device and includes a connecting portion and a carrying portion, and the connecting portion has a first end surface coupled to the bottom surface, and the carrying portion is integrally formed and coupled to the connecting portion, and the carrying portion includes a plurality of electronic devices installed thereon and a plurality of circuits formed on the carrying portion. With the integrally formed connecting portion and carrying portion, the problem of requiring an adapting mechanism of a conventional sensing device to couple a printed circuit board can be solved. The cylindrical plastic body is axially coupled to the sensing device to reduce the overall external diameter of the micro sensing apparatus.

Abstract: The present invention discloses a miniature photographic apparatus applicable to an endoscopic device, and including a casing, at least one light source device and at least one viewing lens device. The casing is disposed at a front end of the endoscopic device. The casing includes an accommodating space. The light source device is disposed in the accommodating space, and emits at least one light and includes a first protecting layer at a front end of the light source device. The viewing lens device is disposed in the accommodating space and includes a second protecting layer at a front end of the viewing lens device. The second protecting layer is separated from the first protecting layer to prevent lights reflected by the second protecting layer from entering into the viewing lens device.

Abstract: The present invention discloses a four-directional tip deflection device for endoscope including a tip deflecting mechanism, an elastic element, a support portion, a four-directionally flexible body, and first, second, third and fourth wires. The tip deflecting mechanism includes an endoscope lens, and first, second, third and fourth connecting portions facing the endoscope lens. The elastic element is sheathed to the tip deflecting mechanism. The support portion is sheathed to the elastic element. The four-directionally flexible body disposed in a first accommodating space has an end connected to the tip deflecting mechanism and another end connected to the support portion. The first, second, third and fourth wires are connected to the first, second, third and fourth connecting portions respectively. If the first, second, third or fourth wire is pulled, the four-directionally flexible body will be bent into an angle corresponding with a first, second, third or fourth wire direction respectively.

Abstract: The present invention discloses an endoscope head apparatus comprising a head mechanism, an elastic element, a support portion, a first wire, a second wire and a bilaterally flexible body. The elastic element is connected to the head mechanism and has a first accommodating space therein. The support portion is connected to the elastic element and has a second accommodating space therein. The first wire and the second wire are connected to head mechanism. The bilaterally flexible body is located at the first accommodating space, and connected to the head mechanism and the support portion respectively, and has a first bendable surface and a second bendable surface. The bilaterally flexible body can swing toward the first surface or the second surface by pulling the first wire or the second wire.