Patents by Inventor Wei-Ting Hsiao
Wei-Ting Hsiao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240128324Abstract: A field effect transistor includes a substrate having a transistor forming region thereon; an insulating layer on the substrate; a first graphene layer on the insulating layer within the transistor forming region; an etch stop layer on the first graphene layer within the transistor forming region; a first inter-layer dielectric layer on the etch stop layer; a gate trench recessed into the first inter-layer dielectric layer and the etch stop layer within the transistor forming region; a second graphene layer on interior surface of the gate trench; a gate dielectric layer on the second graphene layer and on the first inter-layer dielectric layer; and a gate electrode on the gate dielectric layer within the gate trench.Type: ApplicationFiled: November 21, 2022Publication date: April 18, 2024Applicant: UNITED MICROELECTRONICS CORP.Inventors: Kuo-Chih Lai, Shih-Min Chou, Nien-Ting Ho, Wei-Ming Hsiao, Li-Han Chen, Szu-Yao Yu, Chung-Yi Chiu
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Publication number: 20240049019Abstract: Wireless local area network (WLAN) device testing that includes acquiring a data flow feature value used in testing a WLAN device, generating a WLAN simulation environment based on an interference environment index feature of the WLAN, controlling a data transmitter in the WLAN simulation environment to transmit a data packet based on the data flow feature value, acquiring a reception status of the data receiver device for the data packet, and based on the reception status of the data receiver device for the data packet, testing the network performance in the simulation environment.Type: ApplicationFiled: October 20, 2023Publication date: February 8, 2024Applicant: Tencent Technology (Shenzhen) Company LimitedInventors: Wei-Ting HSIAO, Zhen-Xing WEN, Honghao LIU
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Publication number: 20230397067Abstract: This application provides a method for accessing a wireless network performed by an electronic device acting as a station (STA). The method includes: determining interference information of a target channel, the target channel being a channel currently connected between the STA and an access point (AP); determining a target network access parameter group corresponding to the interference information; disconnecting the target channel between the STA and the AP; and accessing the AP via a new channel established between the STA and the AP according to the target network access parameter group.Type: ApplicationFiled: August 22, 2023Publication date: December 7, 2023Inventors: Honghao LIU, Wei-Ting HSIAO, Longwei JIANG
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Patent number: 11835725Abstract: A head-mounted display device assembly and an external adjustment module are provided. The head-mounted display device assembly includes a head-mounted display device and the external adjustment module. The head-mounted display device has a first lens and a second lens corresponding to both eyes, and also has a driven mechanism. The first lens and the second lens are respectively coupled to the driven mechanism. The external adjustment module is used for assembling and electrically connecting to the head-mounted display device, and includes a driving element and a transmission element. In a coupling state, the transmission element is coupled to the driving element and the driven mechanism, and the driving element drives the driven mechanism via the transmission element to adjust a distance between the first lens and the second lens. In a separation state, at least one of the driving element and the driven mechanism is separated from the transmission element.Type: GrantFiled: October 11, 2022Date of Patent: December 5, 2023Assignee: HTC CorporationInventors: Chun-Wei Chang, Ying-Chieh Huang, Pei-Yu Su, Yen-Te Chiang, Chun-Kai Yang, Wei-Ting Hsiao, Yien-Chun Kuo
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Publication number: 20230324699Abstract: A head-mounted display device assembly and an external adjustment module are provided. The head-mounted display device assembly includes a head-mounted display device and the external adjustment module. The head-mounted display device has a first lens and a second lens corresponding to both eyes, and also has a driven mechanism. The first lens and the second lens are respectively coupled to the driven mechanism. The external adjustment module is used for assembling and electrically connecting to the head-mounted display device, and includes a driving element and a transmission element. In a coupling state, the transmission element is coupled to the driving element and the driven mechanism, and the driving element drives the driven mechanism via the transmission element to adjust a distance between the first lens and the second lens. In a separation state, at least one of the driving element and the driven mechanism is separated from the transmission element.Type: ApplicationFiled: October 11, 2022Publication date: October 12, 2023Applicant: HTC CorporationInventors: Chun-Wei Chang, Ying-Chieh Huang, Pei-Yu Su, Yen-Te Chiang, Chun-Kai Yang, Wei-Ting Hsiao, Yien-Chun Kuo
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Publication number: 20230298919Abstract: Apparatus and methods for handling die carriers are disclosed. In one example, a disclosed apparatus includes: a load port configured to load a die carrier operable to hold a plurality of dies into a processing tool; and a lane changer coupled to the load port and configured to move at least one die in the die carrier to an input of the processing tool and transfer the at least one die into the processing tool for processing the at least one die.Type: ApplicationFiled: May 23, 2023Publication date: September 21, 2023Inventors: Tsung-Sheng KUO, Kai-Chieh HUANG, Wei-Ting HSIAO, Yang-Ann CHU, I-Lun YANG, Hsuan LEE
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Patent number: 11682571Abstract: Apparatus and methods for handling die carriers are disclosed. In one example, a disclosed apparatus includes: a load port configured to load a die carrier operable to hold a plurality of dies into a processing tool; and a lane changer coupled to the load port and configured to move at least one die in the die carrier to an input of the processing tool and transfer the at least one die into the processing tool for processing the at least one die.Type: GrantFiled: June 24, 2022Date of Patent: June 20, 2023Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Tsung-Sheng Kuo, Kai-Chieh Huang, Wei-Ting Hsiao, Yang-Ann Chu, I-Lun Yang, Hsuan Lee
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Patent number: 11683850Abstract: A BLUETOOTH reconnection method is used in a BLUETOOTH connection system that includes a first device and a second device. The method includes that the first device sends a BLUETOOTH Low Energy (BLE) advertising signal to the second device after a BLUETOOTH connection between the first device and the second device is disconnected. If the second device determines that the received BLE advertising signal is a first BLE advertising signal, the second device does not page the first device, and waits to receive a page packet sent by the first device. If the second device determines that the received BLE advertising signal is a second BLE advertising signal, the second device actively pages the first device, and the first device waits to receive a page packet sent by the second device.Type: GrantFiled: August 6, 2020Date of Patent: June 20, 2023Assignee: HUAWEI TECHNOLOGIES CO., LTD.Inventors: Wei Ting Hsiao, Bin Peng, Liang Wang, Haw-Wei Shu
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Publication number: 20220319890Abstract: Apparatus and methods for handling die carriers are disclosed. In one example, a disclosed apparatus includes: a load port configured to load a die carrier operable to hold a plurality of dies into a processing tool; and a lane changer coupled to the load port and configured to move at least one die in the die carrier to an input of the processing tool and transfer the at least one die into the processing tool for processing the at least one die.Type: ApplicationFiled: June 24, 2022Publication date: October 6, 2022Inventors: Tsung-Sheng KUO, Kai-Chieh HUANG, Wei-Ting HSIAO, Yang-Ann CHU, I-Lun YANG, Hsuan LEE
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Publication number: 20220304094Abstract: A BLUETOOTH reconnection method is used in a BLUETOOTH connection system that includes a first device and a second device. The method includes that the first device sends a BLUETOOTH Low Energy (BLE) advertising signal to the second device after a BLUETOOTH connection between the first device and the second device is disconnected. If the second device determines that the received BLE advertising signal is a first BLE advertising signal, the second device does not page the first device, and waits to receive a page packet sent by the first device. If the second device determines that the received BLE advertising signal is a second BLE advertising signal, the second device actively pages the first device, and the first device waits to receive a page packet sent by the second device.Type: ApplicationFiled: August 6, 2020Publication date: September 22, 2022Inventors: Wei Ting Hsiao, Bin Peng, Liang Wang, Haw-Wei Shu
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Patent number: 11398396Abstract: Apparatus and methods for handling die carriers are disclosed. In one example, a disclosed apparatus includes: a load port configured to load a die carrier operable to hold a plurality of dies into a processing tool; and a lane changer coupled to the load port and configured to move at least one die in the die carrier to an input of the processing tool and transfer the at least one die into the processing tool for processing the at least one die.Type: GrantFiled: July 30, 2019Date of Patent: July 26, 2022Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Tsung-Sheng Kuo, Kai-Chieh Huang, Wei-Ting Hsiao, Yang-Ann Chu, I-Lun Yang, Hsuan Lee
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Publication number: 20200058534Abstract: Apparatus and methods for handling die carriers are disclosed. In one example, a disclosed apparatus includes: a load port configured to load a die carrier operable to hold a plurality of dies into a processing tool; and a lane changer coupled to the load port and configured to move at least one die in the die carrier to an input of the processing tool and transfer the at least one die into the processing tool for processing the at least one die.Type: ApplicationFiled: July 30, 2019Publication date: February 20, 2020Inventors: Tsung-Sheng KUO, Kai-Chieh HUANG, Wei-ting HSIAO, Yang-Ann CHU, 1-Lun YANG, Hsuan LEE
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Patent number: 9741600Abstract: An apparatus and method for processing semiconductor substrates provides a substrate stage being a rotatable disc with a solid surface and a terraced edge with upper, intermediate and lower portions of increasing diameter. A hollow edge ring rests on the intermediate edge portion and a substrate disposed on the rotatable disc is lifted and transported by robot blades positioned beneath the edge ring and which lift the edge ring which holds the substrate around its edges. The rotatable disc and edge ring find application in MOCVD and other semiconductor manufacturing tools.Type: GrantFiled: June 7, 2016Date of Patent: August 22, 2017Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chih-Chang Hsieh, Chung-chieh Hsu, Chian-kun Chan, Chih-Kuo Chang, Chih-Ping Chen, Hsu-Shui Liu, Kai Lo, Wei-ting Hsiao, Yung-Kai Lin
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Publication number: 20160284584Abstract: An apparatus and method for processing semiconductor substrates provides a substrate stage being a rotatable disc with a solid surface and a terraced edge with upper, intermediate and lower portions of increasing diameter. A hollow edge ring rests on the intermediate edge portion and a substrate disposed on the rotatable disc is lifted and transported by robot blades positioned beneath the edge ring and which lift the edge ring which holds the substrate around its edges. The rotatable disc and edge ring find application in MOCVD and other semiconductor manufacturing tools.Type: ApplicationFiled: June 7, 2016Publication date: September 29, 2016Inventors: Hsieh Chih-Chang, Chung-chieh Hsu, Chian-kun Chan, Chih-Kuo Chang, Chih-Ping Cheng-Jen, Hsu-Shui Liu, Lo Kai, Wei-ting Hsiao, Yung-Kai Lin
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Patent number: 9425077Abstract: An apparatus and method for processing semiconductor substrates provides a substrate stage being a rotatable disc with a solid surface and a terraced edge with upper, intermediate and lower portions of increasing diameter. A hollow edge ring rests on the intermediate edge portion and a substrate disposed on the rotatable disc is lifted and transported by robot blades positioned beneath the edge ring and which lift the edge ring which holds the substrate around its edges. The rotatable disc and edge ring find application in MOCVD and other semiconductor manufacturing tools.Type: GrantFiled: April 9, 2013Date of Patent: August 23, 2016Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chih-Chang Hsieh, Yung-Kai Lin, Hsu-Shui Liu, Kai Lo, Chih-Ping Chen, Chian-Kun Chan, Chung-Chieh Hsu, Chih-Kuo Chang, Wei-Ting Hsiao
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Publication number: 20140273505Abstract: An apparatus and method for processing semiconductor substrates provides a substrate stage being a rotatable disc with a solid surface and a terraced edge with upper, intermediate and lower portions of increasing diameter. A hollow edge ring rests on the intermediate edge portion and a substrate disposed on the rotatable disc is lifted and transported by robot blades positioned beneath the edge ring and which lift the edge ring which holds the substrate around its edges. The rotatable disc and edge ring find application in MOCVD and other semiconductor manufacturing tools.Type: ApplicationFiled: April 9, 2013Publication date: September 18, 2014Inventors: Chih-Chang HSIEH, Yung-Kai Lin, Hsu-Shui Liu, Kai Lo, Chih-Ping Chen, Chian-Kun Chan, Chung-Chieh Hsu, Chih-Kuo Chang, Wei-Ting Hsiao
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Patent number: D1000437Type: GrantFiled: May 3, 2021Date of Patent: October 3, 2023Assignee: HTC CORPORATIONInventors: Wei-Ting Hsiao, Zhi-Qing Wu, Tse-Hsun Pang, Yien-Chun Kuo, Meng-Sheng Chiang
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Patent number: D1010648Type: GrantFiled: May 24, 2023Date of Patent: January 9, 2024Assignee: HTC CorporationInventors: Wei-Ting Hsiao, Zhi-Qing Wu, Tse-Hsun Pang, Yien-Chun Kuo, Meng-Sheng Chiang
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Patent number: D1012931Type: GrantFiled: June 17, 2022Date of Patent: January 30, 2024Assignee: HTC CORPORATIONInventors: Wei-Ting Hsiao, Yien-Chun Kuo, Meng-Sheng Chiang
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Patent number: D1013687Type: GrantFiled: May 24, 2023Date of Patent: February 6, 2024Assignee: HTC CorporationInventors: Wei-Ting Hsiao, Zhi-Qing Wu, Tse-Hsun Pang, Yien-Chun Kuo, Meng-Sheng Chiang