Patents by Inventor Wei-Ting Hsiao

Wei-Ting Hsiao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240128324
    Abstract: A field effect transistor includes a substrate having a transistor forming region thereon; an insulating layer on the substrate; a first graphene layer on the insulating layer within the transistor forming region; an etch stop layer on the first graphene layer within the transistor forming region; a first inter-layer dielectric layer on the etch stop layer; a gate trench recessed into the first inter-layer dielectric layer and the etch stop layer within the transistor forming region; a second graphene layer on interior surface of the gate trench; a gate dielectric layer on the second graphene layer and on the first inter-layer dielectric layer; and a gate electrode on the gate dielectric layer within the gate trench.
    Type: Application
    Filed: November 21, 2022
    Publication date: April 18, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Kuo-Chih Lai, Shih-Min Chou, Nien-Ting Ho, Wei-Ming Hsiao, Li-Han Chen, Szu-Yao Yu, Chung-Yi Chiu
  • Publication number: 20240049019
    Abstract: Wireless local area network (WLAN) device testing that includes acquiring a data flow feature value used in testing a WLAN device, generating a WLAN simulation environment based on an interference environment index feature of the WLAN, controlling a data transmitter in the WLAN simulation environment to transmit a data packet based on the data flow feature value, acquiring a reception status of the data receiver device for the data packet, and based on the reception status of the data receiver device for the data packet, testing the network performance in the simulation environment.
    Type: Application
    Filed: October 20, 2023
    Publication date: February 8, 2024
    Applicant: Tencent Technology (Shenzhen) Company Limited
    Inventors: Wei-Ting HSIAO, Zhen-Xing WEN, Honghao LIU
  • Publication number: 20230397067
    Abstract: This application provides a method for accessing a wireless network performed by an electronic device acting as a station (STA). The method includes: determining interference information of a target channel, the target channel being a channel currently connected between the STA and an access point (AP); determining a target network access parameter group corresponding to the interference information; disconnecting the target channel between the STA and the AP; and accessing the AP via a new channel established between the STA and the AP according to the target network access parameter group.
    Type: Application
    Filed: August 22, 2023
    Publication date: December 7, 2023
    Inventors: Honghao LIU, Wei-Ting HSIAO, Longwei JIANG
  • Patent number: 11835725
    Abstract: A head-mounted display device assembly and an external adjustment module are provided. The head-mounted display device assembly includes a head-mounted display device and the external adjustment module. The head-mounted display device has a first lens and a second lens corresponding to both eyes, and also has a driven mechanism. The first lens and the second lens are respectively coupled to the driven mechanism. The external adjustment module is used for assembling and electrically connecting to the head-mounted display device, and includes a driving element and a transmission element. In a coupling state, the transmission element is coupled to the driving element and the driven mechanism, and the driving element drives the driven mechanism via the transmission element to adjust a distance between the first lens and the second lens. In a separation state, at least one of the driving element and the driven mechanism is separated from the transmission element.
    Type: Grant
    Filed: October 11, 2022
    Date of Patent: December 5, 2023
    Assignee: HTC Corporation
    Inventors: Chun-Wei Chang, Ying-Chieh Huang, Pei-Yu Su, Yen-Te Chiang, Chun-Kai Yang, Wei-Ting Hsiao, Yien-Chun Kuo
  • Publication number: 20230324699
    Abstract: A head-mounted display device assembly and an external adjustment module are provided. The head-mounted display device assembly includes a head-mounted display device and the external adjustment module. The head-mounted display device has a first lens and a second lens corresponding to both eyes, and also has a driven mechanism. The first lens and the second lens are respectively coupled to the driven mechanism. The external adjustment module is used for assembling and electrically connecting to the head-mounted display device, and includes a driving element and a transmission element. In a coupling state, the transmission element is coupled to the driving element and the driven mechanism, and the driving element drives the driven mechanism via the transmission element to adjust a distance between the first lens and the second lens. In a separation state, at least one of the driving element and the driven mechanism is separated from the transmission element.
    Type: Application
    Filed: October 11, 2022
    Publication date: October 12, 2023
    Applicant: HTC Corporation
    Inventors: Chun-Wei Chang, Ying-Chieh Huang, Pei-Yu Su, Yen-Te Chiang, Chun-Kai Yang, Wei-Ting Hsiao, Yien-Chun Kuo
  • Publication number: 20230298919
    Abstract: Apparatus and methods for handling die carriers are disclosed. In one example, a disclosed apparatus includes: a load port configured to load a die carrier operable to hold a plurality of dies into a processing tool; and a lane changer coupled to the load port and configured to move at least one die in the die carrier to an input of the processing tool and transfer the at least one die into the processing tool for processing the at least one die.
    Type: Application
    Filed: May 23, 2023
    Publication date: September 21, 2023
    Inventors: Tsung-Sheng KUO, Kai-Chieh HUANG, Wei-Ting HSIAO, Yang-Ann CHU, I-Lun YANG, Hsuan LEE
  • Patent number: 11682571
    Abstract: Apparatus and methods for handling die carriers are disclosed. In one example, a disclosed apparatus includes: a load port configured to load a die carrier operable to hold a plurality of dies into a processing tool; and a lane changer coupled to the load port and configured to move at least one die in the die carrier to an input of the processing tool and transfer the at least one die into the processing tool for processing the at least one die.
    Type: Grant
    Filed: June 24, 2022
    Date of Patent: June 20, 2023
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tsung-Sheng Kuo, Kai-Chieh Huang, Wei-Ting Hsiao, Yang-Ann Chu, I-Lun Yang, Hsuan Lee
  • Patent number: 11683850
    Abstract: A BLUETOOTH reconnection method is used in a BLUETOOTH connection system that includes a first device and a second device. The method includes that the first device sends a BLUETOOTH Low Energy (BLE) advertising signal to the second device after a BLUETOOTH connection between the first device and the second device is disconnected. If the second device determines that the received BLE advertising signal is a first BLE advertising signal, the second device does not page the first device, and waits to receive a page packet sent by the first device. If the second device determines that the received BLE advertising signal is a second BLE advertising signal, the second device actively pages the first device, and the first device waits to receive a page packet sent by the second device.
    Type: Grant
    Filed: August 6, 2020
    Date of Patent: June 20, 2023
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Wei Ting Hsiao, Bin Peng, Liang Wang, Haw-Wei Shu
  • Publication number: 20220319890
    Abstract: Apparatus and methods for handling die carriers are disclosed. In one example, a disclosed apparatus includes: a load port configured to load a die carrier operable to hold a plurality of dies into a processing tool; and a lane changer coupled to the load port and configured to move at least one die in the die carrier to an input of the processing tool and transfer the at least one die into the processing tool for processing the at least one die.
    Type: Application
    Filed: June 24, 2022
    Publication date: October 6, 2022
    Inventors: Tsung-Sheng KUO, Kai-Chieh HUANG, Wei-Ting HSIAO, Yang-Ann CHU, I-Lun YANG, Hsuan LEE
  • Publication number: 20220304094
    Abstract: A BLUETOOTH reconnection method is used in a BLUETOOTH connection system that includes a first device and a second device. The method includes that the first device sends a BLUETOOTH Low Energy (BLE) advertising signal to the second device after a BLUETOOTH connection between the first device and the second device is disconnected. If the second device determines that the received BLE advertising signal is a first BLE advertising signal, the second device does not page the first device, and waits to receive a page packet sent by the first device. If the second device determines that the received BLE advertising signal is a second BLE advertising signal, the second device actively pages the first device, and the first device waits to receive a page packet sent by the second device.
    Type: Application
    Filed: August 6, 2020
    Publication date: September 22, 2022
    Inventors: Wei Ting Hsiao, Bin Peng, Liang Wang, Haw-Wei Shu
  • Patent number: 11398396
    Abstract: Apparatus and methods for handling die carriers are disclosed. In one example, a disclosed apparatus includes: a load port configured to load a die carrier operable to hold a plurality of dies into a processing tool; and a lane changer coupled to the load port and configured to move at least one die in the die carrier to an input of the processing tool and transfer the at least one die into the processing tool for processing the at least one die.
    Type: Grant
    Filed: July 30, 2019
    Date of Patent: July 26, 2022
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tsung-Sheng Kuo, Kai-Chieh Huang, Wei-Ting Hsiao, Yang-Ann Chu, I-Lun Yang, Hsuan Lee
  • Publication number: 20200058534
    Abstract: Apparatus and methods for handling die carriers are disclosed. In one example, a disclosed apparatus includes: a load port configured to load a die carrier operable to hold a plurality of dies into a processing tool; and a lane changer coupled to the load port and configured to move at least one die in the die carrier to an input of the processing tool and transfer the at least one die into the processing tool for processing the at least one die.
    Type: Application
    Filed: July 30, 2019
    Publication date: February 20, 2020
    Inventors: Tsung-Sheng KUO, Kai-Chieh HUANG, Wei-ting HSIAO, Yang-Ann CHU, 1-Lun YANG, Hsuan LEE
  • Patent number: 9741600
    Abstract: An apparatus and method for processing semiconductor substrates provides a substrate stage being a rotatable disc with a solid surface and a terraced edge with upper, intermediate and lower portions of increasing diameter. A hollow edge ring rests on the intermediate edge portion and a substrate disposed on the rotatable disc is lifted and transported by robot blades positioned beneath the edge ring and which lift the edge ring which holds the substrate around its edges. The rotatable disc and edge ring find application in MOCVD and other semiconductor manufacturing tools.
    Type: Grant
    Filed: June 7, 2016
    Date of Patent: August 22, 2017
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chih-Chang Hsieh, Chung-chieh Hsu, Chian-kun Chan, Chih-Kuo Chang, Chih-Ping Chen, Hsu-Shui Liu, Kai Lo, Wei-ting Hsiao, Yung-Kai Lin
  • Publication number: 20160284584
    Abstract: An apparatus and method for processing semiconductor substrates provides a substrate stage being a rotatable disc with a solid surface and a terraced edge with upper, intermediate and lower portions of increasing diameter. A hollow edge ring rests on the intermediate edge portion and a substrate disposed on the rotatable disc is lifted and transported by robot blades positioned beneath the edge ring and which lift the edge ring which holds the substrate around its edges. The rotatable disc and edge ring find application in MOCVD and other semiconductor manufacturing tools.
    Type: Application
    Filed: June 7, 2016
    Publication date: September 29, 2016
    Inventors: Hsieh Chih-Chang, Chung-chieh Hsu, Chian-kun Chan, Chih-Kuo Chang, Chih-Ping Cheng-Jen, Hsu-Shui Liu, Lo Kai, Wei-ting Hsiao, Yung-Kai Lin
  • Patent number: 9425077
    Abstract: An apparatus and method for processing semiconductor substrates provides a substrate stage being a rotatable disc with a solid surface and a terraced edge with upper, intermediate and lower portions of increasing diameter. A hollow edge ring rests on the intermediate edge portion and a substrate disposed on the rotatable disc is lifted and transported by robot blades positioned beneath the edge ring and which lift the edge ring which holds the substrate around its edges. The rotatable disc and edge ring find application in MOCVD and other semiconductor manufacturing tools.
    Type: Grant
    Filed: April 9, 2013
    Date of Patent: August 23, 2016
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chih-Chang Hsieh, Yung-Kai Lin, Hsu-Shui Liu, Kai Lo, Chih-Ping Chen, Chian-Kun Chan, Chung-Chieh Hsu, Chih-Kuo Chang, Wei-Ting Hsiao
  • Publication number: 20140273505
    Abstract: An apparatus and method for processing semiconductor substrates provides a substrate stage being a rotatable disc with a solid surface and a terraced edge with upper, intermediate and lower portions of increasing diameter. A hollow edge ring rests on the intermediate edge portion and a substrate disposed on the rotatable disc is lifted and transported by robot blades positioned beneath the edge ring and which lift the edge ring which holds the substrate around its edges. The rotatable disc and edge ring find application in MOCVD and other semiconductor manufacturing tools.
    Type: Application
    Filed: April 9, 2013
    Publication date: September 18, 2014
    Inventors: Chih-Chang HSIEH, Yung-Kai Lin, Hsu-Shui Liu, Kai Lo, Chih-Ping Chen, Chian-Kun Chan, Chung-Chieh Hsu, Chih-Kuo Chang, Wei-Ting Hsiao
  • Patent number: D1000437
    Type: Grant
    Filed: May 3, 2021
    Date of Patent: October 3, 2023
    Assignee: HTC CORPORATION
    Inventors: Wei-Ting Hsiao, Zhi-Qing Wu, Tse-Hsun Pang, Yien-Chun Kuo, Meng-Sheng Chiang
  • Patent number: D1010648
    Type: Grant
    Filed: May 24, 2023
    Date of Patent: January 9, 2024
    Assignee: HTC Corporation
    Inventors: Wei-Ting Hsiao, Zhi-Qing Wu, Tse-Hsun Pang, Yien-Chun Kuo, Meng-Sheng Chiang
  • Patent number: D1012931
    Type: Grant
    Filed: June 17, 2022
    Date of Patent: January 30, 2024
    Assignee: HTC CORPORATION
    Inventors: Wei-Ting Hsiao, Yien-Chun Kuo, Meng-Sheng Chiang
  • Patent number: D1013687
    Type: Grant
    Filed: May 24, 2023
    Date of Patent: February 6, 2024
    Assignee: HTC Corporation
    Inventors: Wei-Ting Hsiao, Zhi-Qing Wu, Tse-Hsun Pang, Yien-Chun Kuo, Meng-Sheng Chiang