Abstract: In some embodiments, the present disclosure relates to an integrated circuit (IC) in which a memory structure comprises an inhibition layer inserted between two ferroelectric layers to create a tetragonal-phase dominant ferroelectric structure. In some embodiments, the ferroelectric structure includes a first ferroelectric layer, a second ferroelectric layer overlying the first ferroelectric layer, and a first inhibition layer disposed between the first and second ferroelectric layers and bordering the second ferroelectric layer. The first inhibition layer is a different material than the first and second ferroelectric layers.

Abstract: An optical transmission device includes: a control module generate a control signal output which includes a slope adjust signal and a bias voltage offset adjust signal according to an input signal indicating a dispersion amount an electrical level adjust signal; a multi-level pulse amplitude modulator; and an asymmetrical optical modulator which is controlled by the slope adjust signal to be operated at one of a positive slope and a negative slope of a transfer function of the asymmetrical optical modulator itself, and is controlled by the bias voltage offset adjust signal of the control signal output to offset a bias voltage point of the asymmetrical optical modulator itself from a quadrature point of the transfer function, and modulates the multi-level pulse amplitude modulation signal to an optical signal to generate an optical modulate signal having a chirp.

Abstract: A thin film transistor includes a gate electrode embedded in an insulating layer that overlies a substrate, a gate dielectric overlying the gate electrode, an active layer comprising a compound semiconductor material and overlying the gate dielectric, and a source electrode and drain electrode contacting end portions of the active layer. The gate dielectric may have thicker portions over interfaces with the insulating layer to suppress hydrogen diffusion therethrough. Additionally or alternatively, a passivation capping dielectric including a dielectric metal oxide material may be interposed between the active layer and a dielectric layer overlying the active layer to suppress hydrogen diffusion therethrough.

Abstract: Packaged memory devices including memory devices hybrid bonded to logic devices and methods of forming the same are disclosed. In an embodiment, a semiconductor device includes a first memory die including a first memory cell electrically coupled to a first word line; a second memory cell electrically coupled to the first word line; and a first interconnect structure electrically coupled to the first word line; a circuitry die including a second interconnect structure, a first conductive feature of the first interconnect structure being bonded to a second conductive feature of the second interconnect structure through metal-to-metal bonds; and a word line driver electrically coupled to the first word line between the first memory cell and the second memory cell, the word line driver being electrically coupled to the first word line through the first interconnect structure and the second interconnect structure.

Abstract: A method of forming a semiconductor device is provided. A transistor is formed at a first side of the substrate and a first dielectric layer is formed aside the transistor. A first metal via is formed through the first dielectric layer and aside the transistor. A first interconnect structure is formed over the first side of the substrate and electrically connected to the transistor and the first metal via. The substrate is thinned from a second side of the substrate. A capacitor is formed at the second side of the substrate and a second dielectric layer is formed aside the capacitor. A second metal via is formed through the second dielectric layer and the substrate and electrically connected to the first metal via.

Abstract: A ferroelectric memory device and a semiconductor die are provided. The ferroelectric memory device includes a gate electrode; a channel layer, overlapped with the gate electrode; source/drain contacts, in contact with separate ends of the channel layer; a ferroelectric layer, lying between the gate electrode and the channel layer; and a first insertion layer, extending in between the ferroelectric layer and the channel layer, and comprising a metal carbonitride or a metal nitride.

Abstract: Semiconductor package includes a pair of dies, a redistribution structure, and a conductive plate. Dies of the pair of dies are disposed side by side. Each die includes a contact pad. Redistribution structure is disposed on the pair of dies, and electrically connects the pair of dies. Redistribution structure includes an innermost dielectric layer, an outermost dielectric layer, and a redistribution conductive layer. Innermost dielectric layer is closer to the pair of dies. Redistribution conductive layer extends between the innermost dielectric layer and the outermost dielectric layer. Outermost dielectric layer is furthest from the pair of dies. Conductive plate is electrically connected to the contact pads of the pair of dies. Conductive plate extends over the outermost dielectric layer of the redistribution structure and over the pair of dies. Vertical projection of the conductive plate falls on spans of the dies of the pair of dies.

Abstract: An appressed antenna includes an antenna housing and a metal shell. The antenna housing comprising a housing and a planar antenna, where the planar antenna is bent with one part folded onto the inner surface of the housing and other part pressed onto the outer surface of the housing. The antenna housing is sleeve fitted to the metal shell with a gap between for the planar antenna to radiate. In this all-metal environment, the position of the antenna is close to the gap opening will increase radiation efficiency. By having at least a branch at the tail end of the appressed antenna, the appressed antenna can have a good return loss and antenna gain.

Abstract: An antenna device includes a differential-line, a first metal and a second metal. The differential-line includes a first line and a second line. The first metal and second metal are coupled to the first line and second line respectively. The first metal and second metal have different shapes and/or different sizes. The first metal and second metal form symmetric or asymmetric dipole. The first metal and second metal can be disposed on the same plane or different planes, can be electrically insulated and can have a first slot and a second slot respectively. The antenna device can further include a base coupled to the first line and second line. The base can be a daughter board having a front-end module or not. The IC package in daughter board can have different sizes. The daughter board can be offset by different distances and can be coupled to a mother board.

Abstract: A built-in electric air pump for an inflatable product includes an outer casing, an inner casing, a motor, and an impeller. The outer casing has an accommodating cavity therein. The inner casing is rotatably disposed in the accommodating cavity. By rotating the inner casing, the inflatable product can be inflated or deflated.

Abstract: A non-common-ground bandpass filter circuit with electrostatic discharge (ESD) protection is disclosed. The non-common-ground bandpass filter circuit with ESD protection includes a non-common-ground plane, a dielectric substrate and a conductor. The conductor is disposed above the non-common-ground plane. The dielectric substrate is disposed between the conductor and the non-common-ground plane. The non-common-ground plane at least has a first ground region and a second ground region separated and insulated from each other. The first ground region corresponds to a first terminal of the conductor and the second ground region corresponds to a second terminal of the conductor. When an ESD event occurs on one of the first ground region and the second ground region, the other of the first ground region and the second ground region will not be damaged by the ESD event. The non-common-ground bandpass filter circuit also provides surge protection.

Abstract: A built-in electric air pump for an inflatable product includes an outer casing, an inner casing, a motor, and an impeller. The outer casing has an accommodating cavity therein. The inner casing is rotatably disposed in the accommodating cavity. By rotating the inner casing, the inflatable product can be inflated or deflated. There is no need to provide an additional button for switching inflation and deflation functions, which simplifies the assembly procedure in the manufacturing process and facilitates production.

Abstract: A transparent conductive film is disclosed. The transparent conductive film includes a substrate; a first silver nanowire layer disposed on the substrate; and a protective layer disposed on the first silver nanowire layer, wherein the protective layer is a patternable photoresist and has an identical pattern as the first silver nanowire layer.

Abstract: A positioning and tracking system is disclosed. The positioning and tracking system includes positioning sensors disposed in a space, wherein the positioning sensors are all movable and all have functions of sensing distance, angle and time, and the positioning sensors communicate with each other to sense relative distances, relative angles and relative times between every two positioning sensors of the positioning sensors. when at least one of the positioning sensors moves in the space, the positioning sensors re-communicate with each other to instantly update the relative distances, the relative angles and the relative times between every two positioning sensors of the positioning sensors.

Abstract: An envelope tracking power amplifier module and an envelope tracking method are provided. The envelope tracking power amplifier module includes a power amplifier and a linear amplifier coupled to the power amplifier and configured to receive and amplify an envelope signal and provide the amplified envelope signal to the power amplifier. The power amplifier is configured to receive and amplify a signal according to the amplified envelope signal. The envelope tracking method includes: providing a signal to the power amplifier; deriving an envelope phase of the signal, the envelope phase corresponding to an output power of the power amplifier; providing an envelope signal including the envelope phase to the envelope tracking module; the envelope tracking module providing the amplified envelope signal to the power amplifier; and the power amplifier amplifying the signal according to the amplified envelope signal and outputting the amplified signal at the output power.

Abstract: A non-common-ground bandpass filter circuit with electrostatic discharge (ESD) protection is disclosed. The non-common-ground bandpass filter circuit with ESD protection includes a non-common-ground plane, a dielectric substrate and a conductor. The conductor is disposed above the non-common-ground plane. The dielectric substrate is disposed between the conductor and the non-common-ground plane. The non-common-ground plane at least has a first ground region and a second ground region separated and insulated from each other. The first ground region corresponds to a first terminal of the conductor and the second ground region corresponds to a second terminal of the conductor. When an ESD event occurs on one of the first ground region and the second ground region, the other of the first ground region and the second ground region will not be damaged by the ESD event. The non-common-ground bandpass filter circuit also provides surge protection.

Abstract: A positioning and tracking system is disclosed. The positioning and tracking system includes positioning sensors disposed in a space, wherein the positioning sensors are all movable and all have functions of sensing distance, angle and time, and the positioning sensors communicate with each other to sense relative distances, relative angles and relative times between every two positioning sensors of the positioning sensors. when at least one of the positioning sensors moves in the space, the positioning sensors re-communicate with each other to instantly update the relative distances, the relative angles and the relative times between every two positioning sensors of the positioning sensors.

Abstract: An envelope tracking power amplifier module and an envelope tracking method are provided. The envelope tracking power amplifier module includes a power amplifier and a linear amplifier coupled to the power amplifier and configured to receive and amplify an envelope signal and provide the amplified envelope signal to the power amplifier. The power amplifier is configured to receive and amplify a signal according to the amplified envelope signal. The envelope tracking method includes: providing a signal to the power amplifier; deriving an envelope phase of the signal, the envelope phase corresponding to an output power of the power amplifier; providing an envelope signal including the envelope phase to the envelope tracking module; the envelope tracking module providing the amplified envelope signal to the power amplifier; and the power amplifier amplifying the signal according to the amplified envelope signal and outputting the amplified signal at the output power.

Abstract: The present invention provides an antenna structure, an antenna device and a wireless localization method. The antenna structure includes a first radiation unit including a plurality of first connecting portions and a plurality of first annular radiation portions, a second radiation unit including a plurality of second connecting portions and a plurality of second annular radiation portions, a first conductive wire and a plurality of second conductive wires. A first end of each first annular radiation portion is connected to the first connecting portion, and the second end thereof extends towards the first end of the adjacent first annular radiation portion. A first end of each second annular radiation portion is connected to the second connecting portion, and the second end thereof extends towards the first end of the adjacent second annular radiation portion.

Abstract: The present invention provides an antenna structure, an antenna device and a wireless localization method. The antenna structure includes a first radiation unit including a plurality of first connecting portions and a plurality of first annular radiation portions, a second radiation unit including a plurality of second connecting portions and a plurality of second annular radiation portions, a first conductive wire and a plurality of second conductive wires. A first end of each first annular radiation portion is connected to the first connecting portion, and the second end thereof extends towards the first end of the adjacent first annular radiation portion. A first end of each second annular radiation portion is connected to the second connecting portion, and the second end thereof extends towards the first end of the adjacent second annular radiation portion.