Abstract: Semiconductor package includes a pair of dies, a redistribution structure, and a conductive plate. Dies of the pair of dies are disposed side by side. Each die includes a contact pad. Redistribution structure is disposed on the pair of dies, and electrically connects the pair of dies. Redistribution structure includes an innermost dielectric layer, an outermost dielectric layer, and a redistribution conductive layer. Innermost dielectric layer is closer to the pair of dies. Redistribution conductive layer extends between the innermost dielectric layer and the outermost dielectric layer. Outermost dielectric layer is furthest from the pair of dies. Conductive plate is electrically connected to the contact pads of the pair of dies. Conductive plate extends over the outermost dielectric layer of the redistribution structure and over the pair of dies. Vertical projection of the conductive plate falls on spans of the dies of the pair of dies.

Abstract: A field effect transistor includes a substrate having a transistor forming region thereon; an insulating layer on the substrate; a first graphene layer on the insulating layer within the transistor forming region; an etch stop layer on the first graphene layer within the transistor forming region; a first inter-layer dielectric layer on the etch stop layer; a gate trench recessed into the first inter-layer dielectric layer and the etch stop layer within the transistor forming region; a second graphene layer on interior surface of the gate trench; a gate dielectric layer on the second graphene layer and on the first inter-layer dielectric layer; and a gate electrode on the gate dielectric layer within the gate trench.

Abstract: Packaged memory devices including memory devices hybrid bonded to logic devices and methods of forming the same are disclosed. In an embodiment, a semiconductor device includes a first memory die including a first memory cell electrically coupled to a first word line; a second memory cell electrically coupled to the first word line; and a first interconnect structure electrically coupled to the first word line; a circuitry die including a second interconnect structure, a first conductive feature of the first interconnect structure being bonded to a second conductive feature of the second interconnect structure through metal-to-metal bonds; and a word line driver electrically coupled to the first word line between the first memory cell and the second memory cell, the word line driver being electrically coupled to the first word line through the first interconnect structure and the second interconnect structure.

Abstract: Disclosed herein are composite polypeptide. According to various embodiments, the composite polypeptide includes a parent polypeptide and a metal binding motif capable of forming a complex with a metal cation. The composite polypeptide may be conjugated with a linker unit having a plurality of functional elements to form a multi-functional molecular construct. Alternatively, multiple composite polypeptides may be conjugated to a linker unit to form a molecular construct, or a polypeptide bundle. Linker units suitable for conjugating with the composite polypeptide having the metal binding motif are also disclosed.

Abstract: Semiconductor package includes a pair of dies, a redistribution structure, and a conductive plate. Dies of the pair of dies are disposed side by side. Each die includes a contact pad. Redistribution structure is disposed on the pair of dies, and electrically connects the pair of dies. Redistribution structure includes an innermost dielectric layer, an outermost dielectric layer, and a redistribution conductive layer. Innermost dielectric layer is closer to the pair of dies. Redistribution conductive layer extends between the innermost dielectric layer and the outermost dielectric layer. Outermost dielectric layer is furthest from the pair of dies. Conductive plate is electrically connected to the contact pads of the pair of dies. Conductive plate extends over the outermost dielectric layer of the redistribution structure and over the pair of dies. Vertical projection of the conductive plate falls on spans of the dies of the pair of dies.

Abstract: A hard disk drive vibration-proof structure includes a casing and a buffer element for suspending a hard disk drive in the casing to render the hard disk drive vibration-proof. The buffer element encloses the hard disk drive and is disposed in the casing. The hard disk drive is suspended in the casing by the buffer element. Therefore, the hard disk drive vibration-proof structure achieves suspended antivibration which features enhanced efficiency of antivibration, and, in particular, achieves suspended antivibration with a simple structure.

Abstract: An electrical connector includes an insulator housing that has a base portion, a mating portion, and two retaining extensions. A plurality of terminals extend in the mating portion. Each retaining extension includes a lower part formed with a retaining slot, a top retaining wall defining a top end of the retaining slot, and a bottom opening. A pair of board locking members have inserting portions disposed in the retaining slots, and locking pegs projecting downwardly from the inserting portions through the bottom openings. The inserting portions abut against the top retaining walls when the locking pegs are pushed upwardly by an external force.

Abstract: An electrical connector includes a first terminal module having a row of first terminals and an insulative first seat body molded over the first terminals, a second terminal module having a row of second terminals and an insulative second seat body molded over the second terminals, a coupling member disposed on and coupling the first and second seat bodies, an insulative housing having a sleeve portion receiving the first and second terminal modules, a retaining member disposed on the housing for positioning the first and second seat bodies to the housing, and a metal shield surrounding the sleeve portion.

Abstract: A USB electrical connector includes an insulative seat body having a top wall and a protrusion projecting from the top wall, a plurality of terminals mounted on the seat body, and a metal shell snugly receiving the seat body and having a front open end, a top wall which has an opening interlocking with the protrusion, a slit that extends from the front open end to the opening, and two opposite resilient anchor plate portions that extend between the front open end and the opening on two opposite sides of the slit.