Abstract: A method includes implanting impurities in a semiconductor substrate to form an etch stop region within the semiconductor substrate; forming a transistor structure on a front side of the semiconductor substrate; forming a front-side interconnect structure over the transistor structure; performing a thinning process on a back side of the semiconductor substrate to reduce a thickness of the semiconductor substrate, wherein the thinning process is slowed by the etch stop region; and forming a back-side interconnect structure over the back side of the semiconductor substrate.

Abstract: A wireless packet relay apparatus is disclosed including: an RF module for receiving a streaming service request from a wireless set-top box; a network interface; and a processing circuit for performing a predetermined network connection authentication with the wireless set-top box via the RF module; wherein the processing circuit transmits the streaming service request to a multimedia streaming server via the network interface if the streaming service request is received by the RF module within a predetermined period.

Abstract: A wireless routing circuit is disclosed including: a first RF circuit having a first physical address for communicating with a first set of one or more wireless networking devices each has a gateway address configured as the first physical address; a second RF circuit having a second physical address for communicating with a second set of one or more wireless networking devices each has a gateway address configured as the second physical address; a processing circuit coupled with the first and second RF circuits for processing packets received or to be transmitted by the first and second RF circuits; and a network interface coupled with the processing circuit for communicating with one or more network areas under the control of the processing circuit.