Patents by Inventor Wei-Tse Tsai

Wei-Tse Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Advanced info POP and method of forming thereof
    Patent number: 11955460
    Abstract: In accordance with some embodiments, a package-on-package (PoP) structure includes a first semiconductor package having a first side and a second side opposing the first side, a second semiconductor package having a first side and a second side opposing the first side, and a plurality of inter-package connector coupled between the first side of the first semiconductor package and the first side of the second semiconductor package. The PoP structure further includes a first molding material on the second side of the first semiconductor package. The second side of the second semiconductor package is substantially free of the first molding material.
    Type: Grant
    Filed: October 5, 2020
    Date of Patent: April 9, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yi-Da Tsai, Meng-Tse Chen, Sheng-Feng Weng, Sheng-Hsiang Chiu, Wei-Hung Lin, Ming-Da Cheng, Ching-Hua Hsieh, Chung-Shi Liu
  • Etch Stop Region for Semiconductor Device Substrate Thinning
    Publication number: 20240079239
    Abstract: A method includes implanting impurities in a semiconductor substrate to form an etch stop region within the semiconductor substrate; forming a transistor structure on a front side of the semiconductor substrate; forming a front-side interconnect structure over the transistor structure; performing a thinning process on a back side of the semiconductor substrate to reduce a thickness of the semiconductor substrate, wherein the thinning process is slowed by the etch stop region; and forming a back-side interconnect structure over the back side of the semiconductor substrate.
    Type: Application
    Filed: January 10, 2023
    Publication date: March 7, 2024
    Inventors: Bau-Ming Wang, Liang-Yin Chen, Wei Tse Hsu, Jung-Tsan Tsai, Ya-Ching Tseng, Chunyii Liu
  • Compounds from , method for preparing the same and use thereof
    Patent number: 9884801
    Abstract: The invention relates to bioactive compounds purified from mycelium of Antrodia camphorata and the manufacturing method thereof. A method for treatment of cancers by administrating an effective amount of the said compounds selected from the group consisting of AC006, AC007, AC009, AC011, AC012, AC007-H1, AC009-H1, and AC012-H1 wherein the cancers is liver cancer, brain cancer, prostate cancer, breast cancer, colorectal cancer, or melanoma.
    Type: Grant
    Filed: December 30, 2015
    Date of Patent: February 6, 2018
    Assignee: Oneness Biotech Co., Ltd.
    Inventors: Chiung-Lin Liu, Wei-Tse Tsai, Kai-Hsin Hsieh
  • COMPOUNDS FROM ANTRODIA CAMPHORATA, METHOD FOR PREPARING THE SAME AND USE THEREOF
    Publication number: 20160185703
    Abstract: The invention relates to bioactive compounds purified from mycelium of Antrodia camphorata and the manufacturing method thereof. A method for treatment of cancers by administrating an effective amount of the said compounds selected from the group consisting of AC006, AC007, AC009, AC011, AC012, AC007-H1, AC009-H1, and AC012-H1 wherein the cancers is liver cancer, brain cancer, prostate cancer, breast cancer, colorectal cancer, or melanoma.
    Type: Application
    Filed: December 30, 2015
    Publication date: June 30, 2016
    Inventors: Chiung-Lin Liu, Wei-Tse Tsai, Kai-Hsin Hsieh