Patents by Inventor Wei-Tsung Tsai

Wei-Tsung Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240404871
    Abstract: Methods for forming a dielectric isolation region between two active regions are disclosed herein. A mandrel is formed on a substrate, then etched to form a trench. Spacers are formed on the sidewalls of the mandrel. The mandrel is removed, and the substrate is etched to form fins extending in a first direction in the two active regions, and of fins extending in a second direction. A mask is formed that exposes the substrate between the fins extending in the second direction. The substrate is etched to form a trench. The trench is filled with a dielectric material up to the top of the fins to form the dielectric isolation region. The methods provide better depth control during etching between the two active regions, and also permit the trench to extend deeper into the substrate due to reduced depth/width ratios during the etching steps.
    Type: Application
    Filed: June 2, 2023
    Publication date: December 5, 2024
    Inventors: Wei Che Tsai, Yuan Tsung Tsai, Hsin-Yi Tsai, Ying Ming Wang, Hsien Hua Tseng, Shih-Hao Chen
  • Publication number: 20240405490
    Abstract: A high-frequency connector includes a plurality of connection terminal groups, at least one first metal part, a plurality of second metal parts and an insulating shell. Each connection terminal group includes a male terminal and a female terminal, the male terminal is in contact with the female terminal to transmit signals, and the connection terminal groups are arranged along a first direction; the at least one first metal part extends along the first direction; the second metal parts are disposed between the plurality of connection terminal groups and extend along a second direction, in which each second metal part includes at least two metal pieces, and the at least two metal pieces are not connected to each other; the insulating shell carries the second metal parts, so that the at least one first metal part and the second metal parts are not in contact with each other.
    Type: Application
    Filed: December 20, 2023
    Publication date: December 5, 2024
    Inventors: He-Tsung HUNG, Meng-Hua TSAI, Wei Ting LEE, Sin-Siang WANG
  • Publication number: 20240377557
    Abstract: An optical element with a lanthanide compound layer in accordance with the present invention comprises: an optical substrate including a first surface; the lanthanide compound layer made of lanthanide compound and being disposed on the first surface, and the lanthanide compound layer including a second surface; and an optical film stack disposed on the second surface. With the design of the lanthanide compound layer, the optical element has a blocking effect. Therefore, during the cleaning process of the optical element, a large number of particles can be removed, while effectively suppressing the expansion and generation of pinhole defects, and maintaining the original performance of the optical element.
    Type: Application
    Filed: June 14, 2023
    Publication date: November 14, 2024
    Inventors: Sen-Tsung HSIAO, Chih-Hung CHU, Wei-Li WAN, Shi-Chun ZHOU, Chia-Sheng TSAI
  • Patent number: 5903435
    Abstract: A heat dispersing method for IC of PC boards has a first step of placing a heat dispersing member having an excellent heat dispersing character and a plastic feature directly on an IC, a second step of transmitting the heat of the IC directly to the heat dispersing member, a third step of positioning and combining the heat dispersing member with a housing of an electronic equipment, a fourth step of transmitting the hat of the heat dispersing member and in the housing through the housing and into open air. The device includes a housing housing, a PC board and a heat dispersing member to disperse out the heat of the IC quickly for prolonging its service life.
    Type: Grant
    Filed: October 27, 1997
    Date of Patent: May 11, 1999
    Inventors: Shyn-Tsong Hsieh, Wei-Tsung Tsai