Abstract: A heat dispersing method for IC of PC boards has a first step of placing a heat dispersing member having an excellent heat dispersing character and a plastic feature directly on an IC, a second step of transmitting the heat of the IC directly to the heat dispersing member, a third step of positioning and combining the heat dispersing member with a housing of an electronic equipment, a fourth step of transmitting the hat of the heat dispersing member and in the housing through the housing and into open air. The device includes a housing housing, a PC board and a heat dispersing member to disperse out the heat of the IC quickly for prolonging its service life.