Abstract: An electronic device package includes a first substrate, a second substrate and a conductive layer. The first substrate includes a first bonding pad, and a cavity exposing the first bonding pad. The second substrate is laminated on the first substrate. The second substrate includes a second bonding pad at least partially inserting into the cavity of the first substrate. The conductive layer is disposed in the cavity and at least between the first bonding pad and the second bonding pad to connect the first bonding pad and the second bonding pad.

Abstract: The present disclosure provides a semiconductor device package including a first device, a second device, and a spacer. The first device includes a substrate having a first dielectric constant. The second device includes a dielectric element, an antenna, and a reinforcing element. The dielectric element has a second dielectric constant less than the first dielectric constant. The antenna is at least partially within the dielectric element. The reinforcing element is disposed on the dielectric element, and the reinforcing element has a third dielectric constant greater than the first dielectric constant.

Abstract: An electronic device package includes a first substrate, a second substrate and a conductive layer. The first substrate includes a first bonding pad, and a cavity exposing the first bonding pad. The second substrate is laminated on the first substrate. The second substrate includes a second bonding pad at least partially inserting into the cavity of the first substrate. The conductive layer is disposed in the cavity and at least between the first bonding pad and the second bonding pad to connect the first bonding pad and the second bonding pad.

Abstract: The present disclosure provides a semiconductor device package including a first device, a second device, and a spacer. The first device includes a substrate having a first dielectric constant. The second device includes a dielectric element, an antenna, and a reinforcing element. The dielectric element has a second dielectric constant less than the first dielectric constant. The antenna is at least partially within the dielectric element. The reinforcing element is disposed on the dielectric element, and the reinforcing element has a third dielectric constant greater than the first dielectric constant. The spacer is disposed between the first device and the second device and configured to define a distance between the first device and the second device.

Abstract: The present disclosure provides a semiconductor device package including a first device, a second device, and a spacer. The first device includes a substrate having a first dielectric constant. The second device includes a dielectric element, an antenna, and a reinforcing element. The dielectric element has a second dielectric constant less than the first dielectric constant. The antenna is at least partially within the dielectric element. The reinforcing element is disposed on the dielectric element, and the reinforcing element has a third dielectric constant greater than the first dielectric constant.

Abstract: The present disclosure provides a semiconductor device package. The semiconductor device package includes a first electronic component having an active surface and a backside surface opposite to the active surface and a first antenna layer disposed on the backside surface of the first electronic component. The semiconductor device package further includes a first dielectric layer covering the first antenna layer and a second antenna layer disposed over the first antenna layer. The second antenna layer is spaced apart from the first antenna layer by the first dielectric layer. A method of manufacturing a semiconductor device package is also disclosed.

Abstract: The present disclosure provides a semiconductor device package. The semiconductor device package includes a first electronic component having an active surface and a backside surface opposite to the active surface and a first antenna layer disposed on the backside surface of the first electronic component. The semiconductor device package further includes a first dielectric layer covering the first antenna layer and a second antenna layer disposed over the first antenna layer. The second antenna layer is spaced apart from the first antenna layer by the first dielectric layer. A method of manufacturing a semiconductor device package is also disclosed.

Abstract: An electronic device package includes a first conductive substrate, a second conductive substrate and a dielectric layer. The first conductive substrate has a first coefficient of thermal expansion (CTE). The second conductive substrate is disposed on an upper surface of the first conductive substrate and electrically connected to the first conductive substrate. The second conductive substrate has a second CTE. The dielectric layer is disposed on the upper surface of the first conductive substrate and disposed on at least one sidewall of the second conductive substrate. The dielectric layer has a third CTE. A difference between the first CTE and the second CTE is larger than a difference between the first CTE and the third CTE.

Abstract: An electronic device package includes a first substrate, a second substrate and a conductive layer. The first substrate includes a first bonding pad, and a cavity exposing the first bonding pad. The second substrate is laminated on the first substrate. The second substrate includes a second bonding pad at least partially inserting into the cavity of the first substrate. The conductive layer is disposed in the cavity and at least between the first bonding pad and the second bonding pad to connect the first bonding pad and the second bonding pad.

Abstract: An electronic device package includes a first substrate, a second substrate and a conductive layer. The first substrate includes a first bonding pad, and a cavity exposing the first bonding pad. The second substrate is laminated on the first substrate. The second substrate includes a second bonding pad at least partially inserting into the cavity of the first substrate. The conductive layer is disposed in the cavity and at least between the first bonding pad and the second bonding pad to connect the first bonding pad and the second bonding pad.

Abstract: An electronic device package includes a first conductive substrate, a second conductive substrate and a dielectric layer. The first conductive substrate has a first coefficient of thermal expansion (CTE). The second conductive substrate is disposed on an upper surface of the first conductive substrate and electrically connected to the first conductive substrate. The second conductive substrate has a second CTE. The dielectric layer is disposed on the upper surface of the first conductive substrate and disposed on at least one sidewall of the second conductive substrate. The dielectric layer has a third CTE. A difference between the first CTE and the second CTE is larger than a difference between the first CTE and the third CTE.

Abstract: An electronic device package includes a first substrate, a second substrate and a conductive layer. The first substrate includes a first bonding pad, and a cavity exposing the first bonding pad. The second substrate is laminated on the first substrate. The second substrate includes a second bonding pad at least partially inserting into the cavity of the first substrate. The conductive layer is disposed in the cavity and at least between the first bonding pad and the second bonding pad to connect the first bonding pad and the second bonding pad.

Abstract: Disclosed herein is a system for mediating connection for assisting a first node of a network for NAT traversal. The system for mediating connection includes at least three response servers respectively for receiving a detection message passing through a router from the first node, and for sending a response message passing through the router to the first node according to the detection message. The response message includes an EPN. The at least three response servers are configured to respectively add the EPNs into the response messages after a port number of each of the detection messages received by the at least three response servers is modified, by the router, as the EPNs respectively, wherein a connection is built between the first node and a second node according to a second rule for proximal EPNs and a network address of the second node.

Abstract: Disclosed herein is a system for mediating connection for assisting a first node of a network for NAT traversal. The system for mediating connection includes at least three response servers respectively for receiving a detection message passing through a router from the first node, and for sending a response message passing through the router to the first node according to the detection message. The response message includes an EPN. The at least three response servers are configured to respectively add the EPNs into the response messages after a port number of each of the detection messages received by the at least three response servers is modified, by the router, as the EPNs respectively, wherein a connection is built between the first node and a second node according to a second rule for proximal EPNs and a network address of the second node.

Abstract: Disclosed herein is a network address translation (NAT) traversal method. A node sends a first, second, and third detection message from a local port to a first, second, and third response server, respectively, in order to receive from the response servers a first, second, and third response message, which respectively include a first, second, and third proximal external port number (EPN). The node then deduces a rule for proximal EPNs based on the received ones. Also disclosed is a system for mediating connection. The system assists a first node on a network in NAT traversal and includes at least three response servers, which receive detection messages from the first node and send back response messages that include EPNs.

Abstract: Disclosed herein, among others, is a media streaming system, comprising a registrar server, a media stream providing device, and a media stream receiving device. The registrar server is configured to register a piece of connection information associated with the media stream providing device, the connection information comprising a local network location, a public network location, a broker location, and a proxy location. The media stream receiving device is configured to obtain the connection information from the registrar server, and to commence measuring simultaneously, based on the aforementioned locations, first, second, third, and fourth costs for connecting to the media stream providing device via a local path, a remote path, a peer-to-peer path, and a proxy-assisted path, respectively. The media stream receiving device then selects one of those paths based on the measured costs.

Abstract: Disclosed herein is a network address translation (NAT) traversal method. A node sends a first, second, and third detection message from a local port to a first, second, and third response server, respectively, in order to receive from the response servers a first, second, and third response message, which respectively include a first, second, and third proximal external port number (EPN). The node then deduces a rule for proximal EPNs based on the received ones. Also disclosed is a system for mediating connection. The system assists a first node on a network in NAT traversal and includes at least three response servers, which receive detection messages from the first node and send back response messages that include EPNs.

Abstract: Disclosed herein, among others, is a media streaming system, comprising a registrar server, a media stream providing device, and a media stream receiving device. The registrar server is configured to register a piece of connection information associated with the media stream providing device, the connection information comprising a local network location, a public network location, a broker location, and a proxy location. The media stream receiving device is configured to obtain the connection information from the registrar server, and to commence measuring simultaneously, based on the aforementioned locations, first, second, third, and fourth costs for connecting to the media stream providing device via a local path, a remote path, a peer-to-peer path, and a proxy-assisted path, respectively. The media stream receiving device then selects one of those paths based on the measured costs.