Abstract: An impeller is provided, including a metal housing, a shaft, and a plastic member. The metal housing has a shaft mounting hole. The inner surface of the shaft mounting hole includes three or more contact points, and the contact points are closer to the shaft than other portions of the inner surface of the shaft mounting hole. The shaft passes through the shaft mounting hole and is affixed by the contact points. The metal housing divides the shaft into an upper section, a middle section, and a lower section. The plastic member passes through the shaft mounting hole and is in contact with the middle section.

Abstract: A transparent electromagnetic wave focusing device is provided, which includes a plurality of metamaterial unit cells arranged to form a metamaterial array plate, and each metamaterial unit cell includes a plurality of metal layers and a plurality of transparent substrates stacked alternately. Each of the metal layers has a comb-tooth pattern, and the plurality of metamaterial unit cells correspond to a plurality of comb-tooth pattern combinations, respectively. The metamaterial array plate has an incident surface and an exit surface opposite to each other, and for an incident electromagnetic wave with a predetermined operating frequency band incident from the incident surface, the metamaterial unit cells correspond to a plurality of compensation phase differences, such that the incident electromagnetic wave that passes through the exit surface are focused on a reference point. The comb-tooth pattern combinations vary with the corresponding compensation phase differences.

Abstract: An antenna module and a wireless transceiver device are provided. The wireless transceiver device includes an antenna module. The antenna module includes a circuit board and at least one antenna array. The at least one antenna array defines a midline. The at least one antenna array includes a plurality of antenna elements and a signal feeding line. Each antenna element includes a feeding branch and a radiating portion. The radiating portion is coupling to the feeding branch, and the radiating portion is exposed on the upper surface of the circuit board. The signal feeding line is arranged in the circuit board and is perpendicular to the midline, and the signal feeding line is coupling to the feeding branch. The radiating portion defines an extension line along its extension direction. There is an included angle between the extension line and the midline.

Abstract: An antenna system includes a dielectric substrate, a ground element, and a first antenna element. The dielectric substrate has a first surface and a second surface, which are opposite to each other. The ground element is disposed on the first surface of the dielectric substrate. The first antenna element includes a first radiation element, a feeding radiation element, a second radiation element, and a shorting radiation element. The first radiation element has a feeding point, and is disposed on the second surface of the dielectric substrate. The feeding radiation element is adjacent to the first radiation element. The second radiation element is coupled to the feeding radiation element. The second radiation element is further coupled through the shorting radiation element to the ground element.

Abstract: An antenna module and a wireless transceiver device are provided. The wireless transceiver device includes an antenna module. The antenna module includes a circuit board and at least one antenna array. The at least one antenna array defines a midline. The at least one antenna array includes a plurality of antenna elements and a signal feeding line. Each antenna element includes a feeding branch and a radiating portion. The radiating portion is coupling to the feeding branch, and the radiating portion is exposed on the upper surface of the circuit board. The signal feeding line is arranged in the circuit board and is perpendicular to the midline, and the signal feeding line is coupling to the feeding branch. The radiating portion defines an extension line along its extension direction. There is an included angle between the extension line and the midline.

Abstract: A method for forming a semiconductor device is disclosed. A substrate comprising a structural layer thereon is provided. A hard mask layer is formed on the structural layer. A photoresist layer is formed on the hard mask layer. The photoresist layer is patterned to from a plurality of main photoresist patterns and at least one dummy photoresist pattern between the main photoresist patterns or adjacent to one of the main photoresist patterns, wherein width of the dummy photoresist pattern is less than that of the main photoresist patterns. Two main photoresist patterns are separated with each other by a first opening, and two dummy photoresist patterns are separated with each other by a second opening. Width of the second opening is less than that of the first opening. The hard mask layer is patterned using the patterned photoresist layer as a mask. The structural layer is patterned using the patterned hard mask layer as a mask.

Abstract: A method for forming a semiconductor device is disclosed. A substrate comprising a structural layer thereon is provided. A hard mask layer is formed on the structural layer. A photoresist layer is formed on the hard mask layer. The photoresist layer is patterned to from a plurality of main photoresist patterns and at least one dummy photoresist pattern between the main photoresist patterns or adjacent to one of the main photoresist patterns, wherein width of the dummy photoresist pattern is less than that of the main photoresist patterns. Two main photoresist patterns are separated with each other by a first opening, and two dummy photoresist patterns are separated with each other by a second opening. Width of the second opening is less than that of the first opening. The hard mask layer is patterned using the patterned photoresist layer as a mask. The structural layer is patterned using the patterned hard mask layer as a mask.

Abstract: The present invention discloses a multi-function interface card. The multi-function interface card comprises a central processor mounted on a PCB (printed circuits board). A communication module is coupled to the central processor. An arbitrator is coupled to the central processor. An interface is coupled to the arbitrator to act as I/O for exchanging signal between the multi-function interface card and an external device. A plurality of switches are included, wherein each one of the plurality of switches is coupled to the arbitrator respectively. A plurality of controllers are included, wherein each one of the plurality of controllers is coupled to corresponding one of the plurality of switches respectively. The arbitrator is capable of recognizing a configuration access from an input signal received by the arbitrator and to determine which one switch of the plurality of switches is turned off thereby allowing the corresponding function controller to respond to the data access.