Abstract: A semiconductor device includes a substrate, an interconnect structure, and conductive vias. The substrate has a first side, a second side and a sidewall connecting the first side and the second side, wherein the sidewall includes a first planar sidewall of a first portion of the substrate, a second planar sidewall of a second portion of the substrate and a curved sidewall of a third portion of the substrate, where the first planar sidewall is connected to the second planar sidewall through the curved sidewall. The interconnect structure is located on the first side of the substrate, where a sidewall of the interconnect structure is offset from the second planar sidewall. The conductive vias are located on the interconnect structure, where the interconnect structure is located between the conductive vias and the substrate.

Abstract: A liquid crystal module has a liquid crystal panel and a flexible printed circuit board. The liquid crystal panel has a substrate and an indium tin oxide (ITO) film on the substrate. A flexible printed circuit board has an insulating layer on which a lower conductive layer, a second protective layer, an upper conductive layer and a first protective layer are stacked in sequence. The lower conductive layer is electrically connected to predetermined portions of the lower conductive layer and has a conductive portion, which is unshielded by the insulating layer. The flexible printed circuit board is bonded to the liquid crystal panel with the insulting layer stacked on the indium tin oxide film and the pins of the indium tin oxide film electrically connected to the conductive portion of the lower conductive layer.

Abstract: A liquid crystal module has a liquid crystal panel and a flexible printed circuit board. The liquid crystal panel has a substrate and an indium tin oxide (ITO) film on the substrate. A flexible printed circuit board has an insulating layer on which a lower conductive layer, a second protective layer, an upper conductive layer and a first protective layer are stacked in sequence. The lower conductive layer is electrically connected to predetermined portions of the lower conductive layer and has a conductive portion, which is unshielded by the insulating layer. The flexible printed circuit board is bonded to the liquid crystal panel with the insulting layer stacked on the indium tin oxide film and the pins of the indium tin oxide film electrically connected to the conductive portion of the lower conductive layer.