Abstract: The invention provides a high density package substrate and a method for fabricating the same. A double-sided copper clad laminate containing an upper copper foil and a lower copper foil is provided. A bottom pad is disposed on the lower copper foil, aligned to a predetermined position of a through hole. The through hole is formed by laser drilling through the upper copper foil and the substrate, but not through the bottom pad. A seed layer is formed conformally lining the through hole, and a metal layer is formed on the seed layer by plating to form a plated through hole (PTH).

Abstract: A method for forming a wire bonding substrate is disclosed. A substrate comprising a first surface and a second surface is provided. A through hole is formed in the substrate. A conductive layer is formed on the first surface and the second surface of the substrate and covers a sidewall of the through hole. The conductive layer on the first surface of the substrate is patterned to form at least a first conductive pad, and the conductive layer on the second surface of the substrate is patterned to form at least a second conductive pad. An insulating layer is formed on the first surface and the second surface of the substrate and covers the first conductive pad and the second conductive pad. The insulating layer is recessed until top surfaces of the first conductive pad and the second conductive pad are exposed. A first metal layer is electroplated on the first conductive pad by applying current from the second conductive pad to the first conductive pad through the conductive layer passing the through hole.

Abstract: The invention provides a high density package substrate and a method for fabricating the same. A double-sided copper clad laminate containing an upper copper foil and a lower copper foil is provided. A bottom pad is disposed on the lower copper foil, aligned to a predetermined position of a through hole. The through hole is formed by laser drilling through the upper copper foil and the substrate, but not through the bottom pad. A seed layer is formed conformally lining the through hole, and a metal layer is formed on the seed layer by plating to form a plated through hole (PTH).

Abstract: A method for forming a wire bonding substrate is disclosed. A substrate comprising a first surface and a second surface is provided. A through hole is formed in the substrate. A conductive layer is formed on the first surface and the second surface of the substrate and covers a sidewall of the through hole. The conductive layer on the first surface of the substrate is patterned to form at least a first conductive pad, and the conductive layer on the second surface of the substrate is patterned to form at least a second conductive pad. An insulating layer is formed on the first surface and the second surface of the substrate and covers the first conductive pad and the second conductive pad. The insulating layer is recessed until top surfaces of the first conductive pad and the second conductive pad are exposed. A first metal layer is electroplated on the first conductive pad by applying current from the second conductive pad to the first conductive pad through the conductive layer passing the through hole.