Patents by Inventor Wei Wen

Wei Wen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10645775
    Abstract: The present disclosure provides a light-emitting diode (LED) drive circuit and an LED lamp. The LED drive circuit includes: a feedback control circuit and a load impedance increasing circuit, where the feedback control circuit acquires the operating current of an LED, compares the operating current with a default threshold, drives the load impedance increasing circuit to operate when the operating current of the LED is greater than or equal to the threshold, and allows the load impedance increasing circuit not to operate when the operating current of the LED is less than the threshold; and the load equivalent impedance of the LED drive circuit is increased when the load impedance increasing circuit operates.
    Type: Grant
    Filed: February 2, 2019
    Date of Patent: May 5, 2020
    Assignee: Opple Lighting Co., Ltd.
    Inventor: Wei Wen
  • Publication number: 20200136509
    Abstract: A regulator device includes a first switch, a second switch, and a controlling circuit. A control terminal of the first switch is configured to receive a first control signal. A first terminal of the second switch is coupled with a second terminal of the first switch at a node. A control terminal of the second switch is configured to receive a second control signal. The controlling circuit is coupled to the control terminal of the first switch, the control terminal of the second switch, and the node. The controlling circuit outputs the first control signal with a first slop to the first switch during a first period, and outputs the first control signal with a second slop to the first switch during a second period. The first period is less than the second period, and the first slope is larger than the second slope.
    Type: Application
    Filed: July 8, 2019
    Publication date: April 30, 2020
    Inventors: Wei-Wen OU, Shih-Chieh CHEN, Chien-Sheng CHEN
  • Publication number: 20200136499
    Abstract: A regulator device includes a first switch, a second switch, a protecting circuit, and a driving circuit. The first switch is configured to receive power supply voltage. One terminal of the second switch and the first switch are coupled at a node. The other terminal of the second switch is coupled to ground. The protecting circuit is coupled to the node, and outputs at least one protecting signal according to the turn on/off state of the first switch and the second switch and the voltage of the node. The driving circuit is coupled to the first switch, the second switch, and the protecting circuit, and turns off the first switch or the second switch according the at least one protecting signal.
    Type: Application
    Filed: June 28, 2019
    Publication date: April 30, 2020
    Inventors: Wei-Wen OU, Shih-Chieh CHEN, Chien-Sheng CHEN
  • Patent number: 10633558
    Abstract: A process for chemical mechanical polishing a substrate containing tungsten is disclosed to reduce static corrosion rate and inhibit dishing of the tungsten and erosion of underlying dielectrics. The process includes providing a substrate; providing a polishing composition, containing, as initial components: water; an oxidizing agent; alginate; a dicarboxylic acid, a source of iron ions; a colloidal silica abrasive; and, optionally a pH adjusting agent; providing a chemical mechanical polishing pad, having a polishing surface; creating dynamic contact at an interface between the polishing pad and the substrate; and dispensing the polishing composition onto the polishing surface at or near the interface between the polishing pad and the substrate; wherein some of the tungsten (W) is polished away from the substrate, static corrosion rate is reduced, dishing of the tungsten (W) is inhibited as well as erosion of dielectrics underlying the tungsten (W).
    Type: Grant
    Filed: September 29, 2016
    Date of Patent: April 28, 2020
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Wei-Wen Tsai, Lin-Chen Ho, Cheng-Ping Lee
  • Patent number: 10633557
    Abstract: A process for chemical mechanical polishing a substrate containing tungsten to reduce static corrosion rate and inhibit dishing of the tungsten and erosion of underlying dielectrics is disclosed. The process includes providing a substrate; providing a polishing composition, containing, as initial components: water; an oxidizing agent; xanthan gum; a dicarboxylic acid, a source of iron ions; a colloidal silica abrasive; and, optionally a pH adjusting agent; optionally a surfactant; providing a chemical mechanical polishing pad, having a polishing surface; creating dynamic contact at an interface between the polishing pad and the substrate; and dispensing the polishing composition onto the polishing surface at or near the interface between the polishing pad and the substrate; wherein some of the tungsten (W) is polished away from the substrate, static corrosion rate is reduced, dishing of the tungsten (W) is inhibited as well as erosion of dielectrics underlying the tungsten (W).
    Type: Grant
    Filed: September 29, 2016
    Date of Patent: April 28, 2020
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Lin-Chen Ho, Wei-Wen Tsai, Cheng-Ping Lee
  • Publication number: 20200124994
    Abstract: The present disclosure provides a method of treating a mask for photolithography. The method includes disposing the mask on a stage in a tool. The mask includes a pellicle and a substrate. The method further includes providing oxygen gas in a space between the pellicle and the substrate, and splitting the oxygen gas in the space to form an oxygen atom or an ozone molecule. The method further includes exposing surfaces of the pellicle and the substrate to the oxygen atom or the ozone molecule for a predetermined duration. A mask treating system is also provided.
    Type: Application
    Filed: October 23, 2018
    Publication date: April 23, 2020
    Inventors: WU-HUNG KO, CHUNG-HUNG LIN, CHIH-WEI WEN
  • Patent number: 10626725
    Abstract: A gas passage switching structure for a pneumatic rotary hand tool includes a pneumatic motor and a revolving valve disposed in a device case. The pneumatic motor has an input ending surface. A forward gas inlet and a reverse gas inlet are formed and spaced apart on the input ending surface. The revolving valve has a gas supply surface. A gas supply port and a discharge port are formed and spaced apart on the gas supply surface. The gas supply surface and the input ending surface are arranged along an axis line in the device case adjacent or in contact with the arrangement so that it allows the pneumatic motor to drive the forward and reverse rotation by the high pressure air flow along the fluid passage in the axis line direction.
    Type: Grant
    Filed: November 24, 2017
    Date of Patent: April 21, 2020
    Assignee: DE POAN PNEUMATIC CORP.
    Inventors: I-Tsung Wu, Yi-Wei Wen, Shun-Yao Yang
  • Patent number: 10624164
    Abstract: The present disclosure provides an electronic ballast-based device for controlling an electronic control circuit and a lighting lamp. The device includes an electronic ballast and an electronic control circuit which are connected with each other, the electronic control circuit including a filament analog circuit, a rectifier bridge circuit, at least two frequency detection circuits connected in parallel, an interface logic circuit and a switching circuit; the electronic ballast is connected with the switch circuit sequentially through the filament analog circuit and the rectifier bridge circuit; the at least two frequency detection circuits connected in parallel have one end connected between the filament analog circuit and the rectifier bridge circuit, or connected between the electronic ballast and the filament analog circuit, and another end connected with the interface logic circuit; and the interface logic circuit is connected with the switching circuit.
    Type: Grant
    Filed: February 2, 2019
    Date of Patent: April 14, 2020
    Assignee: Opple Lighting Co., Ltd.
    Inventor: Wei Wen
  • Patent number: 10616631
    Abstract: An electronic apparatus including a communication interface, a display, a memory configured to store one or more instructions, and a processor configured to execute the one or more instructions stored in the memory, wherein, when executed, the one or more instructions cause the processor to receive, based on a fingerprint extracted from content displayed on the display, information of a first broadcast channel corresponding to the content from a server and recognize the first broadcast channel corresponding to the content, in response to determining that a broadcast schedule of a replacement target existing advertisement is included in a broadcast schedule of the first broadcast channel, download a replacement advertisement from the server based on a start point of the replacement target existing advertisement, and reproduce the replacement advertisement at an advertisement time of the replacement target existing advertisement of the first broadcast channel.
    Type: Grant
    Filed: August 1, 2017
    Date of Patent: April 7, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yoon-hee Choi, Tae-ung Jung, Hae-dong Yeo, Wei Wen
  • Publication number: 20200105431
    Abstract: A method for generating extreme ultraviolet (EUV) radiation includes introducing a fuel droplet; applying a first laser beam to strike the fuel droplet at a location to generate EUV radiation and form a movable debris of the fuel droplet; and forming an energy field proximal to the location of the first laser beam strike to trap the movable debris. An EUV radiation source includes a fuel droplet generator, a first laser, a collector and an energy field. The fuel droplet generator is configured to provide a fuel droplet. The first laser is configured to generate a first laser beam to strike the fuel droplet at a location to generate EUV radiation and form a movable debris. The collector is configured to reflect the EUV radiation. The energy field is configured to trap the movable debris, wherein the energy field is proximal to the location of the first laser beam strike.
    Type: Application
    Filed: September 27, 2018
    Publication date: April 2, 2020
    Inventors: TZU HAN LIU, CHIH-WEI WEN, CHUNG-HUNG LIN
  • Patent number: 10604678
    Abstract: A process and composition are disclosed for polishing tungsten containing select quaternary phosphonium compounds at low concentrations to at least reduce corrosion rate of tungsten. The process and composition include providing a substrate containing tungsten; providing a stable polishing composition, containing, as initial components: water; an oxidizing agent; select quaternary phosphonium compounds at low concentrations to at least reduce corrosion rate; a dicarboxylic acid, a source of iron ions; a colloidal silica abrasive; and, optionally a pH adjusting agent; providing a chemical mechanical polishing pad, having a polishing surface; creating dynamic contact at an interface between the polishing pad and the substrate; and dispensing the polishing composition onto the polishing surface at or near the interface between the polishing pad and the substrate; wherein some of the tungsten is polished away from the substrate, and corrosion rate of tungsten is reduced.
    Type: Grant
    Filed: February 8, 2019
    Date of Patent: March 31, 2020
    Assignee: Rohrn and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Lin-Chen Ho, Wei-Wen Tsai, Cheng-Ping Lee
  • Patent number: 10604826
    Abstract: Aluminum and aluminum alloy microstructures that are adapted for improved performance during shaping and forming production processes. Lower relative ratios of alpha fibers, particularly low-end alpha fibers, to beta fibers promotes improved formability of aluminum sheet or blanks without negatively impacting material strength. Beta fibers with higher relative ratios of S and Copper texture components improve formability and produce fewer and more uniform distortions during production. The resulting improvements in quality allow for cupping, drawing, wall ironing, shaping, and necking processes to be carried out faster and with reduced rates of spoilage.
    Type: Grant
    Filed: December 17, 2015
    Date of Patent: March 31, 2020
    Assignee: Novelis Inc.
    Inventors: Yi Wang, Wei Wen, Johnson Go
  • Publication number: 20200095664
    Abstract: Disclosed are high-strength aluminum alloys and methods of making and processing such alloys. More particularly, disclosed is a 6XXX series aluminum alloy exhibiting improved mechanical strength, formability, corrosion resistance, and anodized qualities. An exemplary method includes homogenizing, hot rolling, solutionizing, and quenching. In some cases, the processing steps can further include annealing and/or cold rolling.
    Type: Application
    Filed: November 27, 2019
    Publication date: March 26, 2020
    Applicant: Novelis Inc.
    Inventors: Wei Wen, Hany Ahmed, Rajeev G. Kamat, Corrado Bassi, Guillaume Florey, Cyrille Bezencon, Juergen Timm, David Leyvraz, Aude Despois, Sazol Kumar Das
  • Publication number: 20200080182
    Abstract: Provided are new high strength 6xxx aluminum alloys and methods of making aluminum sheets thereof. These aluminum sheets may be used to fabricate components which may replace steel in a variety of applications including the transportation industry. In some examples, the disclosed high strength 6xxx alloys can replace high strength steels with aluminum. In one example, steels having a yield strength below 340 MPa may be replaced with the disclosed 6xxx aluminum alloys without the need for major design modifications.
    Type: Application
    Filed: November 13, 2019
    Publication date: March 12, 2020
    Applicant: Novelis Inc.
    Inventors: Hany AHMED, Wei WEN, Corrado BASSI, Aude DESPOIS, Guillaume FLOREY, Xavier VARONE
  • Patent number: 10573524
    Abstract: A process for chemical mechanical polishing a substrate containing titanium nitride and titanium is provided comprising: providing a polishing composition, containing, as initial components: water; an oxidizing agent; a linear polyalkylenimine polymer; a colloidal silica abrasive with a positive surface charge; a carboxylic acid; a source of ferric ions; and, optionally pH adjusting agent; wherein the polishing composition has a pH of 1 to 4; providing a chemical mechanical polishing pad, having a polishing surface; creating dynamic contact at an interface between the polishing pad and the substrate; and dispensing the polishing composition onto the polishing surface at or near the interface between the polishing pad and the substrate; wherein at least some of the titanium nitride and at least some of the titanium is polished away with a selectivity between titanium nitride and titanium.
    Type: Grant
    Filed: March 4, 2016
    Date of Patent: February 25, 2020
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Wei-Wen Tsai, Cheng-Ping Lee, Jiun-Fang Wang
  • Patent number: 10557060
    Abstract: A process for chemical mechanical polishing a substrate containing tungsten and titanium is provided comprising: providing the substrate; providing a polishing composition, containing, as initial components: water; an oxidizing agent; an allylamine additive; a carboxylic acid; a source of iron ions; a colloidal silica abrasive with a positive surface charge; and, optionally pH adjusting agent; providing a chemical mechanical polishing pad, having a polishing surface; creating dynamic contact at an interface between the polishing pad and the substrate; and dispensing the polishing composition onto the polishing surface at or near the interface between the polishing pad and the substrate; wherein the tungsten (W) is selectively polished away from the substrate relative to the titanium (Ti).
    Type: Grant
    Filed: March 1, 2016
    Date of Patent: February 11, 2020
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Lin-Chen Ho, Wei-Wen Tsai, Cheng-Ping Lee, Jiun-Fang Wang
  • Patent number: 10538834
    Abstract: Disclosed are high-strength aluminum alloys and methods of making and processing such alloys. More particularly, disclosed is a 6XXX series aluminum alloy exhibiting improved mechanical strength, formability, corrosion resistance, and anodized qualities. An exemplary method includes homogenizing, hot rolling, solutionizing, and quenching. In some cases, the processing steps can further include annealing and/or cold rolling.
    Type: Grant
    Filed: December 16, 2016
    Date of Patent: January 21, 2020
    Assignee: NOVELIS INC.
    Inventors: Wei Wen, Hany Ahmed, Rajeev Kamat, Corrado Bassi, Guillaume Florey, Cyrille Bezencon, Juergen Timm, David Leyvraz, Aude Despois, Sazol Kumar Das
  • Patent number: 10541195
    Abstract: A package structure for a capacitive coupling isolator is provided. The package structure includes a first and a second leadframes, a transmitter, a receiver and a packaging body. The first leadframe includes a first and a second signal input pins and a first electrode plate, and the second leadframe includes a first and a second signal output pins and a second electrode plate. The first and second electrode plates are arranged one above another and aligned with each other for forming a plurality of capacitors. The transmitter is disposed on the first leadframe and the receiver is disposed on the second leadframe. The packaging body encloses the first and second leadframes and is filled therebetween for electrically isolating the first and second leadframes from each other.
    Type: Grant
    Filed: October 19, 2018
    Date of Patent: January 21, 2020
    Assignee: LITE-ON SINGAPORE PTE. LTD.
    Inventors: You-Fa Wang, Wei-Wen Lai, Pu-Han Lin, Yuan-Lung Wu
  • Patent number: 10538833
    Abstract: Disclosed are alloys for anodized-quality aluminum sheets with improved surface quality, and methods for making these sheets. The alloys are designed to minimize the formation of cathodic intermetallic particles that result in surface streaks of anodized sheet products formed from the alloys. Further, the alloys allow the incorporation of recycled scrap aluminum in anodized-quality sheets.
    Type: Grant
    Filed: June 27, 2017
    Date of Patent: January 21, 2020
    Assignee: NOVELIS INC.
    Inventors: Daehoon Kang, Wei Wen, Devesh Mathur
  • Publication number: 20200017715
    Abstract: A process for chemical mechanical polishing a substrate containing tungsten is disclosed to reduce static corrosion rate and inhibit dishing of the tungsten and erosion of underlying dielectrics. The process includes providing a substrate; providing a polishing composition, containing, as initial components: water; an oxidizing agent; guar gum; a dicarboxylic acid, a source of iron ions; a colloidal silica abrasive; and, optionally a pH adjusting agent; providing a chemical mechanical polishing pad, having a polishing surface; creating dynamic contact at an interface between the polishing pad and the substrate; and dispensing the polishing composition onto the polishing surface at or near the interface between the polishing pad and the substrate; wherein some of the tungsten (W) is polished away from the substrate, static corrosion rate is reduced, dishing of the tungsten (W) is inhibited as well as erosion of dielectrics underlying the tungsten (W).
    Type: Application
    Filed: September 29, 2016
    Publication date: January 16, 2020
    Inventors: Wei-Wen Tsai, Lin-Chen Ho, Cheng-Ping Lee