Abstract: This application is directed to electronic systems, devices, circuits, and methods for voltage level shifting. An electronic device includes a pair of current mirroring transistors, which includes a first mirroring transistor and a second mirroring transistor and is configured to mirror a drive current passing the first mirroring transistor to the second mirroring transistor. A pair of differential input transistors is coupled to the pair of current mirroring transistors, includes a first input transistor and a second input transistor, and is configured to receive at least a first input signal. A first swing-clamped transistor is coupled between the second mirroring transistor and the second input transistor, and a gate and a drain of the first swing-clamped transistor are coupled to each other. A first output stage is coupled to the first swing-clamped transistor and configured to generate a first output signal.

Abstract: An electronic package and a manufacturing method thereof are provided, the electronic package has at least one dam at the edge thereof to prevent packaging material from overflowing to the bottom of the electronic package, so that the packaging material is free from contacting the conductive components on the bottom of the electronic package, thereby avoiding problem of non-wetting of the conductive components when the conductive components are subsequently reflowed.

Abstract: A method performed by at least one processor comprises the steps of: generating a layout data of a chip comprising transistors; determining heat-related parameters for the transistors based on the locations thereof in the layout data; generating a netlist data comprising the heat-related parameters; performing a post-layout simulation based on the netlist data; and verifying whether the post-layout simulation meets a design specification.

Abstract: A method performed by at least one processor comprises the steps of: generating a layout data of a chip comprising transistors; determining heat-related parameters for the transistors based on the locations thereof in the layout data; generating a netlist data comprising the heat-related parameters; performing a post-layout simulation based on the netlist data; and verifying whether the post-layout simulation meets a design specification.

Abstract: An integrated circuit device includes a semiconductor substrate having a top surface; at least one insulation region extending from the top surface into the semiconductor substrate; a plurality of base contacts of a first conductivity type electrically interconnected to each other; and a plurality of emitters and a plurality of collectors of a second conductivity type opposite the first conductivity type. Each of the plurality of emitters, the plurality of collectors, and the plurality of base contacts is laterally spaced apart from each other by the at least one insulation region. The integrated circuit device further includes a buried layer of the second conductivity type in the semiconductor substrate, wherein the buried layer has an upper surface adjoining bottom surfaces of the plurality of collectors.

Abstract: An integrated circuit device includes a semiconductor substrate having a top surface; at least one insulation region extending from the top surface into the semiconductor substrate; a plurality of base contacts of a first conductivity type electrically interconnected to each other; and a plurality of emitters and a plurality of collectors of a second conductivity type opposite the first conductivity type. Each of the plurality of emitters, the plurality of collectors, and the plurality of base contacts is laterally spaced apart from each other by the at least one insulation region. The integrated circuit device further includes a buried layer of the second conductivity type in the semiconductor substrate, wherein the buried layer has an upper surface adjoining bottom surfaces of the plurality of collectors.

Abstract: An image is analyzed to locate an object appearing in the image. A contour of that object is extracted from the image and normalized. Based on the normalized contour, one or more summation invariant values are determined and compared to templates comprising one or more summation invariants for each of one or more target objects. The determined summation invariants for the extracted object are compared to summation invariants for the target objects. When the summation invariants for the extracted object sufficiently match the summation invariants determined from an image of a target object, the extracted object is recognized as that target object. The summation invariants can be semi-local summation invariants determined for each point along the normalized contour, based on a number of points neighboring that point on the normalized contour. The semi-local summation invariants are determined as a function of the x and y coordinates of those points.

Abstract: An image is analyzed to locate an object appearing in the image. A contour of that object is extracted from the image and normalized. Based on the normalized contour, one or more summation invariant values are determined and compared to templates comprising one or more summation invariants for each of one or more target objects. The determined summation invariants for the extracted object are compared to summation invariants for the target objects. When the summation invariants for the extracted object sufficiently match the summation invariants determined from an image of a target object, the extracted object is recognized as that target object. The summation invariants can be semi-local summation invariants determined for each point along the normalized contour, based on a number of points neighboring that point on the normalized contour. The semi-local summation invariants are determined as a function of the x and y coordinates of those points.