Patents by Inventor Wei Yao

Wei Yao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250149737
    Abstract: This disclosure is directed to composites comprising a polymeric film coated on one or both sides with a MXene material, as well as lithium metal electrodes and components thereof, including MXene-polymer composite separators.
    Type: Application
    Filed: November 20, 2024
    Publication date: May 8, 2025
    Inventors: Yury GOGOTSI, Xu XIAO, Wei YAO, Jun TANG
  • Publication number: 20250147107
    Abstract: In a bridge communication device that receives information for statuses of a battery from a monitoring device that monitors the statuses, an upstream communication port can transmit the information to an upstream bridge communication device; a downstream communication port can transmit the information to a downstream bridge communication device; a master communication module can transmit the information to a controller if the master communication module is enabled to communicate with the controller; and a slave communication module can operate in an upstream mode or a downstream mode if the master communication module is not enabled to communicate with the controller. In the upstream mode, the slave communication module transmits the information to the controller through the upstream communication port and the upstream bridge communication device.
    Type: Application
    Filed: November 2, 2023
    Publication date: May 8, 2025
    Inventors: Guoxing LI, Sterling DU, Bin ZHU, Wei YAO
  • Publication number: 20250136009
    Abstract: The present disclosure is directed to freestanding films for a lithium-metal-anode comprising a 2D arrays of nanocrystals of a transition metal nitride, carbide, or mixture and optionally a MXene as a conductive binder, and methods of making and using the same.
    Type: Application
    Filed: November 14, 2024
    Publication date: May 1, 2025
    Inventors: Yury Gogotsi, Xu Xiao, Wei Yao, Jun Tang
  • Publication number: 20250125815
    Abstract: A hybrid digital-to-analog converter (DAC) driver is provided. The hybrid DAC driver includes an upper DAC stage configured to receive an upper set of bits of a digital signal, the upper DAC stage comprising an upper set of DAC units, with a first DAC unit in the upper set of DAC units having a different weight than a second DAC unit in the upper set of DAC units; a lower DAC stage configured to receive a lower set of bits of the digital signal, the lower DAC stage comprising a lower set of DAC units formed in an R-2R resistor ladder network; and an output stage for outputting an analog signal from the upper DAC stage and the lower DAC stage.
    Type: Application
    Filed: January 10, 2024
    Publication date: April 17, 2025
    Inventors: Minsoo CHOI, Hiep PHAM, Chih-Wei YAO, Hyojun KIM
  • Publication number: 20250125998
    Abstract: A wireline transceiver system includes a predriver configured to generate a signal; a source-series termination (SST) driver configured to receive the generated signal; and a replica driver configured to continuously generate bias voltages in real time to modulate current of a push-pull current source of the SST driver based on a voltage of the received signal across a process, voltage, and temperature (PVT) range.
    Type: Application
    Filed: January 2, 2024
    Publication date: April 17, 2025
    Inventors: Minsoo CHOI, Hiep PHAM, Chih-Wei YAO, Hyojun KIM
  • Publication number: 20250118914
    Abstract: A connector assembly includes a printed circuit board having a first electrical pin and a second electrical pin positioned on the printed circuit board, a socket connector including an insulation housing having a first socket and a second socket, and a locker movable between a first position and a second position. The first electrical pin is removably inserted into the first socket and the second electrical pin is removably inserted into the second socket. The insulation housing has a locking cavity communicated with the first socket. The locker engages with the first electrical pin to lock the first electrical pin in the first socket in the first position, and the locker disengages from the first electrical pin to release the locking of the first electrical pin in the second position.
    Type: Application
    Filed: October 7, 2024
    Publication date: April 10, 2025
    Applicants: Tyco Electronics (Dongguan) Ltd., TE Connectivity Solutions GmbH, Tyco Electronics (Shanghai) Co., Ltd.
    Inventors: Hua (Andy) Li, Wei Yao, Michael James Horning, Chenglong Huang
  • Patent number: 12272741
    Abstract: Various embodiments of the present disclosure are directed towards an integrated chip including a first semiconductor layer overlying a substrate. A first barrier layer is disposed on the first semiconductor layer. A second semiconductor layer overlies and directly contacts the first barrier layer. A second barrier layer directly contacts the first barrier layer. A third semiconductor layer overlies the second barrier layer. A fourth semiconductor layer overlies the third semiconductor layer. Outer sidewalls of the third semiconductor layer, outer sidewalls of the fourth semiconductor layer, and outer sidewalls of the second barrier layer are respectively aligned.
    Type: Grant
    Filed: August 3, 2023
    Date of Patent: April 8, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Man-Ho Kwan, Fu-Wei Yao, Chun Lin Tsai, Jiun-Lei Jerry Yu, Ting-Fu Chang
  • Patent number: 12268686
    Abstract: The disclosure provides new transmucosal and subcutaneous pharmaceutical compositions comprising 1-(4-fluoro-phenyl)-4-((6bR,10aS)-3-methyl-2,3,6b,9,10,10a-hexahydro-1H,7H-pyrido[3?,4?:4,5]pyrrolo[1,2,3-de]quinoxalin-8-yl)-butan-1-one or 1-(4-fluoro-phenyl)-4-((6bR,10aS)-2,2-d2-3-methyl-2,3,6b,9,10,10a-hexahydro-1H,7H-pyrido[3?,4?:4,5]pyrrolo[1,2,3-de]quinoxalin-8-yl)-butan-1-one or comprising -(4-fluoro-phenyl)-4-((6bR,10aS)-1,1,2,2-d4-3-methyl-2,3,6b,9,10,10a-hexahydro-1H,7H-pyrido[3?,4?:4,5]pyrrolo[1,2,3-de]quinoxalin-8-yl)-butan-1-one, in free base, co-crystal or salt form, together with methods of making and using them.
    Type: Grant
    Filed: May 17, 2023
    Date of Patent: April 8, 2025
    Assignee: INTRA-CELLULAR THERAPIES, INC.
    Inventors: Peng Li, Wei Yao, Robert Davis
  • Publication number: 20250104412
    Abstract: Various embodiments of the teachings herein include a method for detecting a workpiece. An example includes: performing data augmentation on an original image of an original workpiece; performing training on a neural network model comprising multiple feature extraction branches to obtain a workpiece detection model based on a workpiece image group obtained through the data augmentation; converting the workpiece detection model into a lightweight workpiece detection model; and performing detection on workpieces with the same shape and at least one different dimension as the original workpiece based on the lightweight workpiece detection model.
    Type: Application
    Filed: September 17, 2024
    Publication date: March 27, 2025
    Applicant: Siemens Aktiengesellschaft
    Inventors: Wei Yao, Dong Li, Chuan Yu Zhang
  • Publication number: 20250101022
    Abstract: The present invention provides methods for the preparation of substituted heterocycle fused gamma-carbolines, such as the compound of Formula 1J, as shown below, intermediates useful in producing them and methods for producing such intermediates and such heterocycle fused gamma-carbolines, and as further defined herein:
    Type: Application
    Filed: October 3, 2024
    Publication date: March 27, 2025
    Applicant: INTRA-CELLULAR THERAPIES, INC.
    Inventors: John Charles TOMESCH, Peng LI, Wei YAO, Qiang ZHANG, James David BEARD, Andrew S. THOMPSON, Hua CHENG, Lawrence P. WENNOGLE
  • Publication number: 20250099471
    Abstract: The invention relates to particular substituted deuterated heterocycle fused gamma-carbolines, their prodrugs, in free, solid, pharmaceutically acceptable salt and/or substantially pure form as described herein, pharmaceutical compositions thereof, and methods of use in the treatment of diseases involving 5-HT2A receptor, serotonin transporter (SERT) and/or pathways involving dopamine D1/D2 receptor signaling systems, and/or the treatment of residual symptoms.
    Type: Application
    Filed: November 26, 2024
    Publication date: March 27, 2025
    Applicant: INTRA-CELLULAR THERAPIES, INC.
    Inventors: Wei YAO, Peng LI
  • Publication number: 20250087951
    Abstract: A connector includes a housing, a first terminal disposed in the housing, and a second terminal disposed in the housing and located above the first terminal. An adapter terminal is fixed to the first terminal and has a connection end extending beyond the first terminal and the second terminal in a transverse direction of the housing. A first connecting member electrically connects a first conductive component to a top surface of the connection end of the adapter terminal. A second connecting member electrically connects a second conductive component to a top surface of the second terminal.
    Type: Application
    Filed: September 6, 2024
    Publication date: March 13, 2025
    Applicant: Tyco Electronics (Shanghai) Co., Ltd.
    Inventors: Hua (Andy) Li, Wei Yao
  • Publication number: 20250087927
    Abstract: A connector includes an insulation housing, a pair of terminal modules, and an insulation component. The pair of terminal modules are installed side by side in the insulation housing. Each terminal module includes a shell having a first side wall and an opposite second side wall, a first terminal having a rear part installed in the shell, a connection member rotatably connecting the first terminal to the shell, and a second terminal having a front part inserted between the first terminal and the second side wall of the shell. The insulation component is movably arranged in the insulation housing, and is clamped between the second terminals of the pair of terminal modules.
    Type: Application
    Filed: September 12, 2024
    Publication date: March 13, 2025
    Applicant: Tyco Electronics (Shanghai) Co., Ltd.
    Inventors: Jiaoyong (Mac) Liu, Wei Yao
  • Publication number: 20250081335
    Abstract: An electronic device includes a surface structure. The surface structure has a curved surface and includes a substrate, a first conductive line, and a first dielectric pattern. The first conductive line is disposed above the substrate. The first dielectric pattern is disposed above the first conductive line and overlaps with the first conductive line. The surface structure has a first region and a second region. The first dielectric pattern in the first region has a first average width, the first dielectric pattern in the second region has a second average width, and the first average width is different from the second average width.
    Type: Application
    Filed: August 29, 2024
    Publication date: March 6, 2025
    Applicant: Industrial Technology Research Institute
    Inventors: Yi-Rong Lin, Hsiao-Fen Wei, Chung-Wei Wang, Li-Wei Yao
  • Publication number: 20250073752
    Abstract: A multi-tactile feedback component is suitable for an electronic device and includes a thin film deformation element, a thin film vibration element, and a power module. The thin film deformation element has first and second elastic layers and a gain layer disposed therebetween and forming a channel to accommodate a fluid. The thin film vibration element is connected to the thin film deformation element and has a piezoelectric layer and tactile structures. The tactile structures are disposed at a side surface of the piezoelectric layer. The power module is coupled to the thin film deformation element and the thin film vibration element. When the power module supplies an electrical energy to the thin film deformation element, the first elastic layer is deformed to push the fluid and the second elastic layer. When the power module supplies the electrical energy to the thin film vibration element, the piezoelectric layer vibrates.
    Type: Application
    Filed: August 29, 2024
    Publication date: March 6, 2025
    Applicant: Industrial Technology Research Institute
    Inventors: Chen-Tsai Yang, Chih-Cheng Cheng, Wan-Hsin Chen, Chien-Hsun Chu, Li-Wei Yao
  • Patent number: 12234806
    Abstract: The disclosure provides a frequency support method, device and wind farm for a wind farm and belongs to the technical field of new energy power generation and grid connection. In the frequency support method, a state that can reflect a frequency modulation capability of a wind turbine is designed, measured, and recorded as a consistency factor of frequency modulation. Each wind turbine is controlled to exchange the consistency factors with two adjacent wind turbines. Each wind turbine combines its own consistency factors with the consistency factors of two adjacent wind turbines to generate consistent added power through a PI link and adjusts real-time frequency modulation output based on the consistency added power. In this way, the states of the wind turbines in the wind farm are similar during the frequency support process, so that a reasonable distribution of frequency support power is achieved.
    Type: Grant
    Filed: January 8, 2024
    Date of Patent: February 25, 2025
    Assignee: HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY
    Inventors: Wei Yao, Hongyu Zhou, Kangyi Sun, Xiaomeng Ai, Jinyu Wen
  • Publication number: 20250062549
    Abstract: A connector comprises a first fastener and a housing. The first fastener is arranged on the housing and is adapted to secure a wire between the housing and the first fastener. The housing includes at least one side wall, and a finger extending from one end of the at least one side wall. The at least one side wall includes a shoulder adapted to withstand external force applied to crimp the finger into a circuit board. A height from the shoulder to the one end of the at least one side wall is sufficient to prevent deformation of the housing during crimping of the finger to the circuit board.
    Type: Application
    Filed: August 14, 2024
    Publication date: February 20, 2025
    Applicants: Tyco Electronics (Shanghai) Co., Ltd., TE Connectivity Svenksa AB
    Inventors: Jiaoyong (Mac) Liu, Jie (Roger) Luo, Hans Magnus Emil Andersson, Wei Yao
  • Patent number: 12230690
    Abstract: The transistor includes a first III-V compound layer. A second III-V compound layer is disposed on the first III-V compound layer and is different from the first III-V compound layer in composition. A carrier channel is located between the first III-V compound layer and the second III-V compound layer. A source feature and a drain feature are disposed on the second III-V compound layer.
    Type: Grant
    Filed: July 27, 2023
    Date of Patent: February 18, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chun-Wei Hsu, Jiun-Lei Jerry Yu, Fu-Wei Yao, Chen-Ju Yu, Fu-Chih Yang, Chun Lin Tsai
  • Publication number: 20250040766
    Abstract: Apparatus for mounting a rod is described. The rod has a first diameter. The apparatus comprises a plug assembly and a socket assembly. The socket assembly is pivotably connected to the plug assembly. The socket assembly is plugged by the plug assembly. The socket assembly is connected to the rod.
    Type: Application
    Filed: August 3, 2023
    Publication date: February 6, 2025
    Inventor: WEI-YAO LEE
  • Publication number: 20250037232
    Abstract: This application provides an image processing method and apparatus, an electronic device, a computer-readable storage medium, and a computer program product. The method includes: obtaining an image parameter corresponding to a target image, and constructing, based on the image parameter, a mesh for downsampling the target image, the mesh including N mesh cells, the N mesh cells including at least mesh cells of different sizes, and N being a positive integer greater than 1; using the mesh cells in the mesh separately to downsample the target image to obtain N downsampled images; and performing image fusion on the N downsampled images to obtain a target image.
    Type: Application
    Filed: October 9, 2024
    Publication date: January 30, 2025
    Inventors: Hongchuan ZHU, Wei YAO