Abstract: An oligomer (2,6-dimethylphenylene ether) is provided. Its structure is shown as follows: which comprises separately independent hydrogen; alkyl or phenyl; separately independent —NR—, —CO—, —SO—, —CS—, —SO2—, —CH2—, —O—, null, —C(CH3)2—, or and a hydrogen, The features of the cured products include a high glass-transition temperature, a low dielectric feature, preferred thermal stability, and good flame retardancy. The present invention effectively controls the number-average molecular weight of the product to obtain excellent organic solubility.

Abstract: A phosphinated (2,6-dimethylphenyl ether) oligomer, preparation method thereof and cured product. The phosphinated (2,6-dimethylphenyl ether) oligomer includes a structure represented by Formula (1): wherein X is a single bond, —CH2—, —O—, —C(CH3)2— or R?0, R0, R1, R2 and R3 are independently hydrogen, C1-C6 alkyl or phenyl; n and m are independently an integer from 0 to 300; p and q are independently an integer from 1 to 4; Y is hydrogen, U and V are independently an aliphatic structure.

Abstract: An oligomer (2,6-dimethylphenylene ether) is provided. Its structure is shown as follows: which comprises separately independent hydrogen; alkyl or phenyl; separately independent —NR—, —CO—, —SO—, —CS—, —SO2—, —CH2—, —O—, null, —C(CH3)2—, or and a hydrogen, The features of the cured products include a high glass-transition temperature, a low dielectric feature, preferred thermal stability, and good flame retardancy. The present invention effectively controls the number-average molecular weight of the product to obtain excellent organic solubility.

Abstract: A phosphinated (2,6-dimethylphenyl ether) oligomer, preparation method thereof and cured product are provided. The phosphinated (2,6-dimethylphenyl ether) oligomer includes a structure represented by Formula (1): wherein X is a single bond, —CH2—, —O—, —C(CH3)2— or R?0, R0, R1, R2 and R3 are independently hydrogen, C1-C6 alkyl or phenyl; n and m are independently an integer from 0 to 300; p and q are independently an integer from 1 to 4; Y is hydrogen, U and V are independently an aliphatic structure.

Abstract: A silicon photonic package structure including a substrate, a conductive bump, an obstacle structure, a laser diode, a mode converter, and a ball lens is provided. The conductive bump is disposed on the substrate. The obstacle structure is formed on the substrate. The laser diode is disposed above the substrate and electrically bonded to the conductive bump. A surface of the laser diode facing the substrate has a ridge. An end of the ridge has a light-emitting surface. The obstacle structure is located between the conductive bump and the ridge. A thickness of the obstacle structure in a direction perpendicular to the surface of the substrate is greater than a thickness of the ridge in the direction perpendicular to the surface of the substrate. The mode converter is formed on the substrate. The ball lens is formed on the substrate and located between the light-emitting surface and a light input end of the mode converter.

Abstract: A vertical fixing transmission box used for transmitting a container is disclosed. The transmission box includes a carrier substrate and an elastic component, wherein the carrier substrate is utilized to carry the container, and the elastic component may be switched between an opening state and a fixing state. When the container is carried by the carrier substrate and the elastic component is switched to the opening state, the elastic component provides a vertical elastic force to abut against the container downwardly and fix the container. Also, the transmission box may be transported by an automatic material handling system.

Abstract: A vertical fixing transmission box used for transmitting a container is disclosed. The transmission box includes a carrier substrate and an elastic component, wherein the carrier substrate is utilized to carry the container, and the elastic component may be switched between an opening state and a fixing state. When the container is carried by the carrier substrate and the elastic component is switched to the opening state, the elastic component provides a vertical elastic force to abut against the container downwardly and fix the container. Also, the transmission box may be transport by an automatic material handling system.

Abstract: The present invention relates to an EUV pod having marks, which comprises a mask pod and one or more mark disposed on the mask pod. One or more sensor of a processing machine is used for detecting the one or more mark. By including the one or more mark, the surface roughness of one or more region of the mask pod detectable by the one or more sensor can be altered. The one or more sensor emits light to the mask pod, which reflects the light to the one or more sensor. The one or more sensor receives the reflection light from the mask pod and judges if the voltage generated by the reflection light falls within the reflection ranges of the mark. Thereby, whether the one or more sensor corresponds to the one or more make can be confirmed.

Abstract: A method for fabricating liquid crystal display panels. The method includes forming at least one adhesive structure on a first substrate, to partition the first substrate into at least one dummy region and panel group regions, in which the dummy region is located between the two adjacent panel group regions; pouring liquid crystal into the dummy region and the panel group regions; and conjugating a second substrate at a side of the first substrate disposed with the adhesive structure, to seal spaces of the dummy region and the panel group regions between the first substrate and the second substrate, in which the liquid crystal can fill up the spaces of the panel group regions and at least a part of the spaces of the dummy region being sealed between the first substrate and the second substrate.

Abstract: A method for fabricating liquid crystal display panels. The method includes forming at least one adhesive structure on a first substrate, to partition the first substrate into at least one dummy region and panel group regions, in which the dummy region is located between the two adjacent panel group regions; pouring liquid crystal into the dummy region and the panel group regions; and conjugating a second substrate at a side of the first substrate disposed with the adhesive structure, to seal spaces of the dummy region and the panel group regions between the first substrate and the second substrate, in which the liquid crystal can fill up the spaces of the panel group regions and at least a part of the spaces of the dummy region being sealed between the first substrate and the second substrate.

Abstract: The present invention relates to an EUV pod having marks, which comprises a mask pod and one or more mark disposed on the mask pod. One or more sensor of a processing machine is used for detecting the one or more mark. By including the one or more mark, the surface roughness of one or more region of the mask pod detectable by the one or more sensor can be altered. The one or more sensor emits light to the mask pod, which reflects the light to the one or more sensor. The one or more sensor receives the reflection light from the mask pod and judges if the voltage generated by the reflection light falls within the reflection ranges of the mark. Thereby, whether the one or more sensor corresponds to the one or more make can be confirmed.

Abstract: This invention discloses a micro-stamping method for photoelectric process. First of all, in this invention, the micro-stamping method provides a stamp, an ink, an inkpad and a substrate, wherein the stamp or the inkpad having specific protruding bodies and the ink is one element of the group consisting of red ink, green ink and blue ink. Further, by adherence of the ink to the stamp, the specific pattern can be transferred to the surface of the substrate. Furthermore, this micro-stamping method comprises an ink adherence process, a positioning process, a pattern transferring process and a fixation process, and the above-mentioned processes will repeat until the three inks, such as red ink, green ink and blue ink, all adhered and fixed on the predetermined places of substrate.

Abstract: This invention discloses a micro-stamping method for photoelectric process. First of all, in this invention, the micro-stamping method provides a stamp, an ink, an inkpad and a substrate, wherein the stamp or the inkpad having a specific raised pattern and the ink is one element of the group consisting of red ink, green ink and blue ink. Further, by adherence of the ink to the stamp, the specific pattern can be transferred to the surface of the substrate. Furthermore, this micro-stamping method comprises an ink adherence process, a positioning process, a pattern transferring process and a fixation process, and the above-mentioned processes will repeat until the three inks, such as red ink, green ink and blue ink, all adhered and fixed on the predetermined places of substrate.