Abstract: A semiconductor sensor device is packaged using a footed lid instead of a pre-molded lead frame. A semiconductor sensor die is attached to a first side of a lead frame. The die is then electrically connected to leads of the lead frame. A gel material is dispensed onto the sensor die. The footed lid is attached to the substrate such that the footed lid covers the sensor die and the electrical connections between the die and the lead frame. A molding compound is then formed over the substrate and the footed lid such that the molding compound covers the substrate, the sensor die and the footed lid.

Abstract: A method of forming a semiconductor package includes providing a transfer film and placing electronic components on the transfer film with active sides of the electronic components facing the transfer film. The electronic components include a first assembled package and one or more of a second assembled package and a passive component. A molding operation is performed to encapsulate the electronic components and one side of the transfer film. The transfer film is then removed, which exposes the active sides of the electronic components. An electrical distribution layer is formed over the active sides of the electronic components and electrically connects the electronic components. Conductive bumps are then formed on the electrical distribution layer.