Abstract: A package includes an interposer structure free of any active devices. The interposer structure includes an interconnect device; a dielectric film surrounding the interconnect device; and first metallization pattern bonded to the interconnect device. The package further includes a first device die bonded to an opposing side of the first metallization pattern as the interconnect device and a second device die bonded to a same side of the first metallization pattern as the first device die. The interconnect device electrically connects the first device die to the second device die.

Abstract: An electronic device and a method for detecting abnormal device operation are provided. The method includes: obtaining multiple action events of a movable input device, and each action event including a relative coordinate and a time stamp of the movable input device; generating multiple absolute coordinates based on the relative coordinate of each action event; estimating multiple speed vectors based on the absolute coordinates and the time stamp of each action event; estimating multiple acceleration vectors based on the speed vectors and the time stamp of each action event; and estimating a probability of abnormal operation based on the speed vectors and the acceleration vectors.

Abstract: A method includes receiving a device design layout and a scribe line design layout surrounding the device design layout. The device design layout and the scribe line design layout are rotated in different directions. An optical proximity correction (OPC) process is performed on the rotated device design layout and the rotated scribe line design layout. A reticle includes the device design layout and the scribe line design layout is formed after performing the OPC process.

Abstract: A positioning method for a specific sound source is provided. An acoustic signal in each of multiple positions of on a preset path is respectively collected through a sensor. A pre-processing is performed on the acoustic signal to obtain multiple signal features. The signal features are used as an input of a deep learning model. The deep learning model is used for a signal recognition to obtain multiple specific sound signals of each position. An autocorrelation function operation is performed on the specific sound signals obtained at a same position to obtain multiple autocorrelation coefficients. A representative value among the autocorrelation coefficients is selected as a representative coefficient corresponding to each position. A specific sound source position is found according to the representative coefficient of each position.