Abstract: A method for manufacturing a package structure includes providing a carrier board; providing at least one die having a top surface, a bottom surface, and a side surface on the carrier board; and forming a protective layer to cover at least a portion of the side surface of the die. The die includes a substrate, a semiconductor layer, a gate structure, a source structure and a drain structure, at least one dielectric layer, and at least one pad. The semiconductor layer is disposed on the substrate. The gate structure is disposed on the semiconductor layer. The source and the drain structures are disposed on opposite sides of the gate structure. The dielectric layer covers the gate, source, and drain structures. The pad is disposed on the dielectric layer and penetrates through the dielectric layer to electrically contact with the gate, source or drain structure.

Abstract: Embodiments herein provide high performance foam formulations and processing methods that address issues with traditional ethylene vinyl acetate (EVA) foams. In various embodiments, when used in midsoles, the high performance foam formulations may provide superior impact energy absorption per given load during compression, improved energy recovery during expansion, and reduced compression set over repeated impact cycles. In various embodiments, the high performance foam formulations may include a mixture of no more than about 75 PHR EVA foam and at least 15 PHR polyolefin foam.

Abstract: Embodiments herein relate generally to the field of footwear, and more particularly to components of performance footwear, such as midsoles, as well as methods of making midsoles. In various embodiments, multiple response property midsoles and/or portions of footwear are provided that may include strategically arranged multiple response property areas having blended transition zones disposed there between. Such blended transition zones may help facilitate a more fluid foot movement, improve manufacturing and production techniques, and prevent injury to the foot, ankle, and/or legs during exercise, such as running, hiking, walking, and other impact-generating activities.