Abstract: An environmental sensitive electronic device package includes a first substrate, a second substrate, an environmental sensitive electronic device, at least one side wall barrier structure, and a filler layer. The first substrate has at least one predetermined flexure area. The second substrate is located above the first substrate. The environmental sensitive electronic device is located on the first substrate and between the first substrate and the second substrate. The side wall barrier structure is located between the first substrate and the second substrate and surrounds the environmental sensitive electronic device. The side wall barrier structure has at least one flexure stress dispersing structure that is located in the predetermined flexure area. The filler layer is located between the first substrate and the second substrate and covers the side wall barrier structure and the environmental sensitive electronic device.

Abstract: A touch sensing structure including a plastic substrate, a buffer layer, an electrode layer, an insulation unit, and a passivation layer is provided. The buffer layer is disposed on the plastic substrate, and the electrode layer includes a first patterned transparent electrode layer and a second patterned transparent electrode layer. The first patterned transparent electrode layer is disposed on the buffer layer, and the second patterned transparent electrode layer is disposed on the buffer layer. The insulation unit insulates the first patterned transparent electrode layer and the second patterned transparent electrode layer, and the passivation layer is disposed on the electrode layer. Twice a total optical path length of the electrode layer and the passivation layer along a direction substantially parallel to a normal direction of the plastic substrate ranges from 1000 nm to 2500 nm.

Abstract: A touch panel includes a substrate, first electrodes, second electrodes, third electrodes, and fourth electrodes. The substrate includes a first touch region, a second touch region, and a first touch folding region disposed between the first touch region and the second touch region. The first electrodes extending from the first touch region to the first touch folding region and the second electrodes are disposed in the first touch region on the substrate. The third electrodes extending from the second touch region to the first touch folding region and the fourth electrodes are disposed in the second touch region on the substrate. The first electrodes and the third electrodes are not intersected with one another. A ratio of any side length of the touch panel to a distance between the first touch region and the second touch region is between 9.5 and 95.

Abstract: A touch panel is provided, which includes a poly(vinylidene fluoride) (PVDF) substrate and a touch electrode structure. The PVDF substrate has two opposite surfaces. The touch electrode structure is at least disposed on one of the surfaces.

Abstract: A heat dissipation module, comprising: a fan; and a heat dissipating fin; a heat conducting element, made of a conductive material, and composed of a first conductive component and two second conductive components in a manner that the first conductive component is disposed engaging with a heating element while allowing the two second conductive components to engage with the heat dissipating fin; and a wall element; wherein, the heat from the heating element is conducted to the first conductive component where it is further being dividedly conducted to the two second conductive components; and the air flow blowing from the fan is guided to the heating element and then it is blocked by the wall element for diverting the air flow toward the heat dissipating fin from an air intake side to an air outlet side, and then to be discharged out of the heat dissipating module through an outlet.

Abstract: An electronic apparatus is disclosed, which comprises: a housing, configured with a plurality of inlets and one outlet; a plurality of electronic elements, disposed inside the housing; and a plurality of gates, arranged at positions corresponding to the plural inlets in an one-by-one manner; wherein, the plural electronic elements are activated while the electronic apparatus is enabled for causing the temperature of the plural electronic elements to be raised to their respective working temperatures, thereby, causing a plurality of heating zones to be formed inside the housing at positions respectively corresponding to the plural inlets; and by enabling each gate to be configured with one thermal expansion element that is enabled to deform with the temperature variation of the corresponding heating zone, each gate is enabled to move between a first position and a second position according to the deformation of the corresponding thermal expansion element.

Abstract: A fan blade structure includes a hub, an annular partition surrounding the hub, a first blade group and a second blade group. The hub has a top surface and a flank connected to the top surface. The first blade group, disposed on one side of the annular partition, includes two blade arrays having multiple first and second blades respectively. The clearance between the two adjacent first blades is less than that between the two adjacent second blades. The second blade group, disposed on another side of the annular partition, includes another two blade arrays having a plurality of third and fourth blades respectively. The clearance between the two adjacent third blades is less than that between the two fourth blades adjacent to each other.

Abstract: An environmental sensitive electronic device package may include a first substrate, a second substrate, an environmental sensitive electronic device, at least one side wall barrier structure, and a filler layer. The first substrate has at least one predetermined flexure area. The second substrate is located above the first substrate. The environmental sensitive electronic device is located on the first substrate and between the first substrate and the second substrate. The side wall barrier structure is located between the first substrate and the second substrate and surrounds the environmental sensitive electronic device. The side wall barrier structure has at least one flexure stress dispersing structure that is located in the predetermined flexure area. The filler layer is located between the first substrate and the second substrate and covers the side wall barrier structure and the environmental sensitive electronic device.

Abstract: A dust removal method of an electronic device is provided that the electronic device includes a first body, a heat dissipation module and a cover plate. The first body includes a heat dissipation opening. The heat dissipation module comprises a fan and a fin assembly. The fan has a fan case body and a blade assembly. The fan case body includes an air inlet, an air outlet and a dust collecting opening. The air outlet and the heat dissipation opening are connected with each other. The cover plate is installed in the fan case body and adjacent to the dust collecting opening. The blade assembly turns and the cover plate covers the dust collecting opening. An air current flows in from the air inlet and flows out from the air outlet.

Abstract: A fan includes a casing and a fan blade. The casing has at least one air inlet and an air outlet. The fan blade is disposed in the casing. An air flow compression area is defined in the casing. An auxiliary air inlet is disposed on the casing at the air flow compression area. Furthermore, another fan includes a casing and a fan blade. The casing has an upper casing, a lower casing and a side casing located between the upper casing and the lower casing. The upper casing or the lower casing has at least one air inlet, and the side casing has an air outlet. The fan blade is disposed in the casing. An internal space of the casing is defined as an air flow compression area. An auxiliary air inlet is disposed on the casing at the air flow compression area.

Abstract: A heat dissipation device includes a fan module, a first plate structure and a fin assembly. The fan module includes a fan outlet. The first plate structure is disposed at the fan outlet. The thermal conductance of the first plate structure is above 100 W/(m·K). The first plate structure includes a heat-absorbing and a heat-dissipation surface. The heat-absorbing surface includes a heat-absorbing region in thermal contact with a heat source. The heat-dissipation surface includes a heat-dissipation region. The fin assembly is disposed on the heat-dissipation surface and in thermal contact with the heat-dissipation surface. The fan module is adapted to exhaust an air flow flowing above the heat-dissipation surface via the fan outlet. The air flow flows through the heat-dissipation region before through the fin assembly. The distance between the fan outlet and the heat-dissipation region is greater than the distance between the fan outlet and the fin assembly.

Abstract: An electronic apparatus with improved heat dissipation comprises a first body with a first shell and a second shell, a second body, a coupling device and a linkage device. The first shell is pivotally connected to the second shell to form an accommodation space. The first shell can pivot relative to the second shell to enlarge the accommodation space and form an opening between the first shell and the second shell. The coupling device couples the second body and the second shell to pivot the second body relative to the second shell to expose or hide the first shell. The linkage device drives the first shell to pivot relative to the second shell. When the second body pivots relative to the second shell toward a first direction, the linkage device drives the first shell to pivot relative to the second shell toward a second direction opposite to the first direction.

Abstract: An electronic apparatus is disclosed, which comprises: a housing, configured with a plurality of inlets and one outlet; a plurality of electronic elements, disposed inside the housing; and a plurality of gates, arranged at positions corresponding to the plural inlets in an one-by-one manner; wherein, the plural electronic elements are activated while the electronic apparatus is enabled for causing the temperature of the plural electronic elements to be raised to their respective working temperatures, thereby, causing a plurality of heating zones to be formed inside the housing at positions respectively corresponding to the plural inlets; and by enabling each gate to be configured with one thermal expansion element that is enabled to deform with the temperature variation of the corresponding heating zone, each gate is enabled to move between a first position and a second position according to the deformation of the corresponding thermal expansion element.

Abstract: A heat dissipation module, comprising: a fan; and a heat dissipating fin; a heat conducting element, made of a conductive material, and composed of a first conductive component and two second conductive components in a manner that the first conductive component is disposed engaging with a heating element while allowing the two second conductive components to engage with the heat dissipating fin; and a wall element; wherein, the heat from the heating element is conducted to the first conductive component where it is further being dividedly conducted to the two second conductive components; and the air flow blowing from the fan is guided to the heating element and then it is blocked by the wall element for diverting the air flow toward the heat dissipating fin from an air intake side to an air outlet side, and then to be discharged out of the heat dissipating module through an outlet.

Abstract: A flow-guiding device, connected between two fans disposed in series and rotating in the same rotation direction, includes a main frame and a plurality of flow-guiding pieces. The flow-guiding pieces are connected with the main frame. Each of the flow-guiding pieces is disposed corresponding to the stationary flow guiding device of the above fan so as to form a completed flow guiding device. A fan assembly including the flow-guiding device is also disclosed.

Abstract: An electronic apparatus and a keyboard supporting module thereof are provided. The electronic apparatus includes a heat source, the keyboard supporting module and a push-button key module. The keyboard supporting module includes a keyboard supporting structure and an insulator. The keyboard supporting structure is thermally connected to the heat source. Particularly, the keyboard supporting structure supports the push-button key module with the insulator.

Abstract: An electronic apparatus with improved heat dissipation comprises a first body with a first shell and a second shell, a second body, a coupling device and a linkage device. The first shell is pivotally connected to the second shell to form an accommodation space. The first shell can pivot relative to the second shell to enlarge the accommodation space and form an opening between the first shell and the second shell. The coupling device couples the second body and the second shell to pivot the second body relative to the second shell to expose or hide the first shell. The linkage device drives the first shell to pivot relative to the second shell. When the second body pivots relative to the second shell toward a first direction, the linkage device drives the first shell to pivot relative to the second shell toward a second direction opposite to the first direction.

Abstract: A fan has a fan frame for accommodating a first circuit board and a second circuit board. A fan frame includes a housing, a base, and at least one supporting element. The base is disposed in the housing, and the base includes a bottom portion and a tube portion, which is connected to and extended from the bottom portion. The supporting element is connected between the housing and the base. There is a predetermined distance between the bottom portion of the base and an end of the housing so as to form an accommodating space, the first circuit board is disposed on the base and is located on a first side of the bottom portion facing the tube portion, and the second circuit board is disposed in the accommodating space which is located on a second side of the bottom portion facing away from the tube portion.

Abstract: An electronic device including a heat generation element, a heat dissipation plate, and a heat pipe is provided. The heat dissipation plate includes a top surface, a bottom surface, a pair of longitudinal side surfaces, and a pair of lateral side surfaces including a third side surface and a fourth side surface. The longitudinal side surfaces include first and second side surfaces. The lateral side surfaces include third and fourth side surfaces. The first, second, third and fourth side surfaces are connected to both the top surface and the bottom surface. The heat pipe is disposed in contact with the heat dissipation plate, and the heat pipe and the heat generation element are disposed on the bottom surface of the heat dissipation plate. The heat pipe is disposed on the heat dissipation plate and extension of the heat pipe is not beyond the first, second, third and fourth side surfaces.

Abstract: A triode field emission display is provided. It utilizes the electrical characteristics that an edge structure may raise the electric field intensity to expose an edge of a cathode plate through an opening of a gate layer, thereby forming the edge structure at an emitter to raise the electric field intensity. Therefore, reduction of driving voltage is achieved.