Patents by Inventor Wei-Yin Lee

Wei-Yin Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240169011
    Abstract: A computing device can present, within a display, first network-associated content and a tab strip, the first network-associated content being associated with a first content locator, the tab strip including a first content indicator associated with the first content locator and a second content indicator associated with a second content locator, receive a directional input associated with the tab strip, in response to receiving the directional input, modify the presentation of the tab strip, the modification ending presentation of the first content indicator and initiating presentation of a third content indicator, the third content indicator being associated with a third content locator, receive a selection of the third content indicator, and in response to receiving the selection of the third content indicator, present second network-associated content at a location where the first network-associated content was previously presented, the second network-associated content being associated with the third con
    Type: Application
    Filed: December 20, 2023
    Publication date: May 23, 2024
    Inventors: Samuel Birch, Yusuf Ozuysal, Christopher Matthew Lee, Mei Liang, Wei-Yin Chen, Yue Zhang, Ayman Almadhoun
  • Publication number: 20030164303
    Abstract: A method of metal-electro-plating for IC package substrate comprising the steps of: forming vias on the package substrate coated with copper film on both sides thereof; electro-plating the vias to form electrical conductive holes between the top layer and the bottom layer of the package substrate; coating a resisting agent where the patterns should be formed on the top layer and on the entire bottom layer of the package substrate; etching the pattern to form circuit without plating lines on the top layer of the substrate, and removing the resisting agent; coating with a resisting agent on the top side and the bottom side of the package substrate but the wiring position to be electro-plated as surface finish for wire-bonding electro-plating on the top side of the package substrate not being applied with the resisting agent; electro-plating the substrate with nickel and gold, and removing the resisting agent; fabricating the circuit on the bottom side of the package substrate and coating with a resisting agent
    Type: Application
    Filed: November 7, 2002
    Publication date: September 4, 2003
    Inventors: Fu-Yu Huang, Yu-Chun Huang, Chin-Hui chuang, Ya-Shin Tseng, Chi-Ju Chiang, Pei-Fen Hung, Wei-Yin Lee, Shu-Hui Lo, Che-Chen Chen