Patents by Inventor Wei-Yu Chen

Wei-Yu Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11656443
    Abstract: A photographing lens assembly includes seven lens elements, which are, in order from an object side to an image side, a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element, a sixth lens element and a seventh lens element. The first lens element with positive refractive power has an object-side surface being convex in a paraxial region thereof. The second lens element with negative refractive power has an image-side surface being concave in a paraxial region thereof. The seventh lens element has an object-side surface being convex in a paraxial region thereof and an image-side surface being concave in a paraxial region thereof. The image-side surface of the seventh lens element includes at least one convex shape in an off-axis region thereof. The object-side surface and the image-side surface of the seventh lens element are aspheric.
    Type: Grant
    Filed: September 21, 2022
    Date of Patent: May 23, 2023
    Assignee: LARGAN PRECISION CO., LTD.
    Inventors: Chun-Che Hsueh, Chun-Yen Chen, Wei-Yu Chen
  • Patent number: 11651587
    Abstract: Various embodiments include a method for product quality inspection on a group of products. The method may include: getting for each product in the group of products: image, value for each known fabrication parameter affecting quality of the group of products, and quality evaluation result; training a neural network. A layer of the neural network comprises at least one first neuron and at least one second neuron; each first neuron represents a known fabrication parameter affecting quality of the group of products and each second neuron represents an unknown fabrication parameter affecting quality of the group of products; and the images of the group of products are input to the neural network, the quality evaluation results are output of the neural network, and the value of each first neuron is set to the value for the known fabrication parameter the first neuron representing.
    Type: Grant
    Filed: December 27, 2019
    Date of Patent: May 16, 2023
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Chang Wei Loh, Jing Wen Zhu, Wei Yu Chen, Yue Yu, Cong Chao Li, Li Qun Ding
  • Publication number: 20230144951
    Abstract: A photographing lens assembly includes a total of eight lens elements which are, in order from an object side to an image side: a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element, a sixth lens element, a seventh lens element and an eighth lens element. The first lens element with positive refractive power has an object-side surface being convex in a paraxial region thereof. The second lens element has negative refractive power. The eighth lens element with negative refractive power has an object-side surface being concave in a paraxial region thereof. At least one lens element of the photographing lens assembly has at least one lens surface having at least one inflection point.
    Type: Application
    Filed: January 2, 2023
    Publication date: May 11, 2023
    Applicant: LARGAN PRECISION CO., LTD.
    Inventors: Chun-Che HSUEH, Hung-Shuo CHEN, Kuan Chun WANG, Wei-Yu CHEN
  • Patent number: 11646293
    Abstract: A method for bonding semiconductor substrates includes placing a die on a substrate and performing a heating process on the die and the substrate to bond the respective first connectors with the respective second connectors. Respective first connectors of a plurality of first connectors on the die contact respective second connectors of a plurality of second connectors on the substrate. The heating process includes placing a mask between a laser generator and the substrate and performing a laser shot. The mask includes a masking layer and a transparent layer. Portions of the masking layer are opaque. The laser passes through a first gap in the masking layer and through the transparent layer to heat a first portion of a top side of the die opposite the substrate.
    Type: Grant
    Filed: July 22, 2020
    Date of Patent: May 9, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chia-Shen Cheng, Wei-Yu Chen, Philip Yu-Shuan Chung, Hsiu-Jen Lin, Ching-Hua Hsieh, Chen-Hua Yu
  • Publication number: 20230137616
    Abstract: The present disclosure provides an image capturing optical system comprising: a positive first lens element having a convex object-side surface; a negative second lens element having a concave object-side surface; a third lens element; a fourth lens element having a convex object-side surface and a concave image-side surface, the object-side surface and the image-side surface thereof being aspheric; a fifth lens element having a concave image-side surface concave, both of the object-side surface and the image-side surface being aspheric, at least one of the object-side surface and the image-side surface having at least one convex shape in an off-axis region thereof.
    Type: Application
    Filed: December 30, 2022
    Publication date: May 4, 2023
    Inventors: KUAN-MING CHEN, Wei-Yu Chen
  • Publication number: 20230140099
    Abstract: An image capturing lens assembly includes, in order from an object side to an image side, a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element, and a sixth lens element. The first lens element with negative refractive power has an image-side surface being concave in a paraxial region thereof. The second and third lens elements have refractive power. The fourth lens element has positive refractive power. The fifth lens element with negative refractive power has an object-side surface being concave in a paraxial region thereof. The sixth lens element with refractive power has an object-side surface being convex in a paraxial region thereof and an image-side surface being concave in a paraxial region thereof. The image capturing lens assembly has a total of six lens elements with refractive power.
    Type: Application
    Filed: December 29, 2022
    Publication date: May 4, 2023
    Applicant: LARGAN PRECISION CO., LTD.
    Inventors: Cheng-Chen LIN, Wei-Yu CHEN
  • Publication number: 20230109686
    Abstract: A method includes placing an electronic die and a photonic die over a carrier, with a back surface of the electronic die and a front surface of the photonic die facing the carrier. The method further includes encapsulating the electronic die and the photonic die in an encapsulant, planarizing the encapsulant until an electrical connector of the electronic die and a conductive feature of the photonic die are revealed, and forming redistribution lines over the encapsulant. The redistribution lines electrically connect the electronic die to the photonic die. An optical coupler is attached to the photonic die. An optical fiber attached to the optical coupler is configured to optically couple to the photonic die.
    Type: Application
    Filed: December 12, 2022
    Publication date: April 13, 2023
    Inventors: Chen-Hua Yu, An-Jhih Su, Wei-Yu Chen
  • Publication number: 20230112466
    Abstract: An optical image capturing system comprising, in order from an object side to an image side, a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element, a sixth lens element and a seventh lens element. The first lens element with negative refractive power has a concave image-side surface. The second lens element, the third lens element and the fourth lens element have refractive power. The fifth lens element has refractive power. The sixth lens element with refractive power has an image-side surface being concave in a paraxial region and includes at least one convex shape in an off-axial region, wherein the surfaces thereof are aspheric. The seventh lens element with refractive power has an image-side surface being concave in a paraxial region and includes at least one convex shape in an off-axial region, wherein the surfaces thereof are aspheric.
    Type: Application
    Filed: December 13, 2022
    Publication date: April 13, 2023
    Inventors: Lin-Yao LIAO, Dung-Yi HSIEH, Wei-Yu CHEN
  • Patent number: 11626296
    Abstract: A semiconductor device includes a first die extending through a molding compound layer, a first dummy die having a bottom embedded in the molding compound layer, wherein a height of the first die is greater than a height of the first dummy die, and an interconnect structure over the molding compound layer, wherein a first metal feature of the interconnect structure is electrically connected to the first die and a second metal feature of the interconnect structure is over the first dummy die and extends over a sidewall of the first dummy die.
    Type: Grant
    Filed: March 8, 2021
    Date of Patent: April 11, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Hsien-Wei Chen, Wei-Yu Chen
  • Publication number: 20230109313
    Abstract: Disclosed herein is a carbon nanodot-polyacrylic acid composite hydrogel including a polyacrylic acid-based gel matrix having carboxyl groups, and a plurality of fluorescent carbon nanodots having amino groups on surfaces thereof. The fluorescent carbon nanodots are formed by subjecting polyethylenimine and hydrochloric acid to a hydrothermal reaction, and are distributed in the polyacrylic acid-based gel matrix. The amino groups of the fluorescent carbon nanodots are covalently bonded with the carboxyl groups of the polyacrylic acid-based gel matrix. Also disclosed herein are a method for preparing and a formulation for forming a carbon nanodot-polyacrylic acid composite hydrogel.
    Type: Application
    Filed: August 4, 2022
    Publication date: April 6, 2023
    Inventors: Wei-Yu CHEN, Cheng-Ho CHEN, En-Yu ZHOU, Hui-Shan CHANG, Chao-Wei HUANG, Han-Yi CHOU, Yueh YANG, Guan-Zhu ZHU
  • Publication number: 20230104261
    Abstract: A single inductor multiple output regulator includes an inductor, a number of capacitors, a number of switches coupled with the capacitors and a control circuit coupled with the switches and configured to apply at least two multi-switching pulses to a multi-pulse controlled one of the switches in each cycle.
    Type: Application
    Filed: October 1, 2021
    Publication date: April 6, 2023
    Inventors: Wei-Jen CHANG, Wei-Yu CHEN, Hao-Hung LO, Tsung-Ling LI, Po-Hung CHEN
  • Publication number: 20230102538
    Abstract: Embodiments are directed to systems and methods for supporting generic pointers in hardware of a GPU. According to one embodiment, a GPU includes multiple sub-cores each having a processing resource and a load/store pipeline. The processing resource is operable to receive a memory access message including a pointer and a memory type identifier indicative of the pointer representing a generic pointer. The processing resource is further operable to output a load or store operation to the load/store pipeline based on the memory access message, including computing an address for the load or store operation by adding a base address of a named memory type of a plurality of named memory types referenced by the generic pointer to an offset into a memory of the named memory type. The load/store pipeline is operable to, responsive to receipt of the load or store operation, access the memory at the address.
    Type: Application
    Filed: September 24, 2021
    Publication date: March 30, 2023
    Applicant: Intel Corporation
    Inventors: Joydeep Ray, Prathamesh Raghunath Shinde, Ben J. Ashbaugh, Wei-Yu Chen, Abhishek R. Appu, Vasanth Ranganathan, Dmitry Yurievich Babokin, Ankur N. Shah
  • Publication number: 20230088743
    Abstract: An apparatus to facilitate gathering payload from arbitrary registers for send messages in a graphics environment is disclosed. The apparatus includes processing resources comprising execution circuitry to receive a send gather message instruction identifying a number of registers to access for a send message and identifying IDs of a plurality of individual registers corresponding to the number of registers; decode a first phase of the send gather message instruction; based on decoding the first phase, cause a second phase of the send gather message instruction to bypass an instruction decode stage; and dispatch the first phase subsequently followed by dispatch of the second phase to a send pipeline. The apparatus can also perform an immediate move of the IDs of the plurality of individual registers to an architectural register of the execution circuitry and include a pointer to the architectural register in the send gather message instruction.
    Type: Application
    Filed: September 22, 2021
    Publication date: March 23, 2023
    Applicant: Intel Corporation
    Inventors: Supratim Pal, Chandra Gurram, Fan-Yin Tzeng, Subramaniam Maiyuran, Guei-Yuan Lueh, Timothy R. Bauer, Vikranth Vemulapalli, Wei-Yu Chen
  • Patent number: 11610859
    Abstract: A system for reflowing a semiconductor workpiece including a stage, a first vacuum module and a second vacuum module, and an energy source is provided. The stage includes a base and a protrusion connected to the base, the stage is movable along a height direction of the stage relative to the semiconductor workpiece, the protrusion operably holds and heats the semiconductor workpiece, and the protrusion includes a first portion and a second portion surrounded by and spatially separated from the first portion. The first vacuum module and the second vacuum module respectively coupled to the first portion and the second portion of the protrusion, and the first vacuum module and the second vacuum module are operable to respectively apply a pressure to the first portion and the second portion. The energy source is disposed over the stage to heat the semiconductor workpiece held by the protrusion of the stage.
    Type: Grant
    Filed: October 27, 2020
    Date of Patent: March 21, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Cheng-Shiuan Wong, Ching-Hua Hsieh, Hsiu-Jen Lin, Hao-Jan Pei, Hsuan-Ting Kuo, Wei-Yu Chen, Chia-Shen Cheng, Philip Yu-Shuan Chung
  • Patent number: 11611972
    Abstract: A method and apparatus are disclosed. In an example from the perspective of a device, a grant is received on a first interface. The grant is associated with transmission on a second interface. A first resource and/or a second resource are derived based upon the grant. A first transmission for delivering a transport block is performed on the first resource on a first transmission beam. The first transmission is on the second interface. A second transmission for delivering the transport block is performed on the second resource on a second transmission beam. The second transmission is on the second interface.
    Type: Grant
    Filed: August 6, 2019
    Date of Patent: March 21, 2023
    Assignee: ASUSTek Computer Inc.
    Inventors: Ming-Che Li, Li-Te Pan, Li-Chih Tseng, Wei-Yu Chen
  • Patent number: 11611704
    Abstract: A motor controller used for driving a motor is provided. The motor includes a motor coil and a maximum rated current. The motor controller comprises a driving circuit, a control unit, a digital-to-analog converter, an operational amplifier, a switch circuit, and a resistor. When it is needed to decrease a settling time for the motor to reach a target position, or a vibration is detected within a camera module so as to enable an image stabilization mechanism, it is capable of temporarily supplying a driving current greater than the maximum rated current to the motor coil.
    Type: Grant
    Filed: March 17, 2020
    Date of Patent: March 21, 2023
    Assignee: Global Mixed-mode Technology Inc.
    Inventors: Wei-Yu Chen, Ching-Lung Tsai
  • Patent number: 11598935
    Abstract: An imaging optical lens assembly includes nine lens elements which are, in order from an object side to an image side along an optical path: a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element, a sixth lens element, a seventh lens element, an eighth lens element and a ninth lens element. The first lens element has positive refractive power. The eighth lens element with positive refractive power has an image-side surface being convex in a paraxial region thereof. The ninth lens element has an image-side surface being concave in a paraxial region thereof, and the image-side surface of the ninth lens element has at least one convex critical point in an off-axis region thereof.
    Type: Grant
    Filed: August 12, 2020
    Date of Patent: March 7, 2023
    Assignee: LARGAN PRECISION CO., LTD.
    Inventor: Wei-Yu Chen
  • Patent number: 11598938
    Abstract: The present disclosure provides an image capturing optical system comprising: a positive first lens element having a convex object-side surface; a negative second lens element having a concave object-side surface; a third lens element; a fourth lens element having a convex object-side surface and a concave image-side surface, the object-side surface and the image-side surface thereof being aspheric; a fifth lens element having a concave image-side surface concave, both of the object-side surface and the image-side surface being aspheric, at least one of the object-side surface and the image-side surface having at least one convex shape in an off-axis region thereof.
    Type: Grant
    Filed: January 7, 2021
    Date of Patent: March 7, 2023
    Assignee: LARGAN PRECISION CO., LTD.
    Inventors: Kuan-Ming Chen, Wei-Yu Chen
  • Patent number: 11600749
    Abstract: Disclosed is a light-emitting device comprising a light-emitting stack having a length, a width, a first semiconductor layer, an active layer on the first semiconductor layer, and a second semiconductor layer on the active layer, wherein the first semiconductor layer, the active layer, and the second semiconductor layer are stacked in a stacking direction. A first electrode is coupled to the first semiconductor layer and extended in a direction parallel to the stacking direction and a second electrode is coupled to the second semiconductor layer and extended in a direction parallel to the stacking direction. A dielectric layer is disposed between the first electrode and the second electrode.
    Type: Grant
    Filed: June 8, 2018
    Date of Patent: March 7, 2023
    Assignee: EPISTAR CORPORATION
    Inventors: Shih-I Chen, Wei-Yu Chen, Yi-Ming Chen, Ching-Pei Lin, Tsung-Xian Lee
  • Publication number: 20230055127
    Abstract: A method and apparatus are disclosed. In an example from the perspective of a first device, a grant is received from a network node. The grant allocates a set of sidelink data resources. One or more sidelink data transmissions are performed on the set of sidelink data resources. A second feedback information associated with the one or more sidelink data transmissions is received and/or detected. An uplink resource is derived. A first feedback information is transmitted on the uplink resource to the network node. The first feedback information is set based upon the second feedback information.
    Type: Application
    Filed: October 17, 2022
    Publication date: February 23, 2023
    Inventors: Ming-Che Li, Li-Chih Tseng, Wei-Yu Chen, Li-Te Pan