Patents by Inventor Wei Yu Liao

Wei Yu Liao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11982866
    Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a stopping assembly. The fixed assembly has a main axis. The movable assembly is configured to connect an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The stopping assembly is configured to limit the movement of the movable assembly relative to the fixed assembly within a range of motion.
    Type: Grant
    Filed: December 15, 2022
    Date of Patent: May 14, 2024
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Liang-Ting Ho, Chen-Er Hsu, Yi-Liang Chan, Fu-Lai Tseng, Fu-Yuan Wu, Chen-Chi Kuo, Ying-Jen Wang, Wei-Han Hsia, Yi-Hsin Tseng, Wen-Chang Lin, Chun-Chia Liao, Shou-Jen Liu, Chao-Chun Chang, Yi-Chieh Lin, Shang-Yu Hsu, Yu-Huai Liao, Shih-Wei Hung, Sin-Hong Lin, Kun-Shih Lin, Yu-Cheng Lin, Wen-Yen Huang, Wei-Jhe Shen, Chih-Shiang Wu, Sin-Jhong Song, Che-Hsiang Chiu, Sheng-Chang Lin
  • Patent number: 11976967
    Abstract: An electronic device includes a photodiode, a switching circuit, a readout circuit, and an energy storage device. The photodiode includes a first terminal and a second terminal and is configured to generate a signal according to a light. The switching circuit is electrically connected to the first terminal and the second terminal. When the electronic device operates in a sensing mode, the switching circuit electrically isolates the photodiode from the energy storage device so that the signal is provided to the readout circuit. When the electronic device operates in a charging mode, the switching circuit electrically connects the photodiode to the energy storage device so that the signal is provided to the energy storage device.
    Type: Grant
    Filed: August 19, 2022
    Date of Patent: May 7, 2024
    Assignee: INNOLUX CORPORATION
    Inventors: Te-Yu Lee, Yu-Tsung Liu, Wei-Ju Liao
  • Publication number: 20240130038
    Abstract: A transmission device for suppressing the glass-fiber effect includes a circuit board and a transmission line. The circuit board includes a plurality of glass fibers, so as to define a fiber pitch. The transmission line is disposed on the circuit board. The transmission line includes a plurality of non-parallel segments. Each of the non-parallel segments of the transmission line has an offset distance with respect to a reference line. The offset distance is longer than or equal to a half of the fiber pitch.
    Type: Application
    Filed: November 23, 2022
    Publication date: April 18, 2024
    Applicants: UNIMICRON TECHNOLOGY CORP., National Taiwan University
    Inventors: Chin-Hsun WANG, Ruey-Beei Wu, Ching-Sheng Chen, Chun-Jui Hung, Wei-Yu Liao, Chi-Min Chang
  • Patent number: 11948949
    Abstract: In some embodiments, the present disclosure relates to a device having a semiconductor substrate including a frontside and a backside. On the frontside of the semiconductor substrate are a first source/drain region and a second source/drain region. A gate electrode is arranged on the frontside of the semiconductor substrate and includes a horizontal portion, a first vertical portion, and a second vertical portion. The horizontal portion is arranged over the frontside of the semiconductor substrate and between the first and second source/drain regions. The first vertical portion extends from the frontside towards the backside of the semiconductor substrate and contacts the horizontal portion of the gate electrode structure. The second vertical portion extends from the frontside towards the backside of the semiconductor substrate, contacts the horizontal portion of the gate electrode structure, and is separated from the first vertical portion by a channel region of the substrate.
    Type: Grant
    Filed: July 15, 2022
    Date of Patent: April 2, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Yuan Chen, Ching-Chun Wang, Hsiao-Hui Tseng, Jen-Cheng Liu, Jhy-Jyi Sze, Shyh-Fann Ting, Wei Chuang Wu, Yen-Ting Chiang, Chia Ching Liao, Yen-Yu Chen
  • Patent number: 11895772
    Abstract: An interlayer connective structure is suitable for being formed in a wiring board, in which the wiring board includes two traces and an insulation part between the traces. The insulation part has a through hole. The interlayer connective structure located in the through hole is connected to the traces. The interlayer connective structure includes a column and a pair of protuberant parts. The protuberant parts are located at two ends of the through hole respectively and connected to the column and the traces. The protuberant parts stick out from the outer surfaces of the traces respectively. Each of the protuberant parts has a convex curved surface, in which the distance between the convex curved surface and the axis of the through hole is less than the radius of the through hole.
    Type: Grant
    Filed: July 15, 2021
    Date of Patent: February 6, 2024
    Assignee: Unimicron Technology Corp.
    Inventors: Chi-Min Chang, Ching-Sheng Chen, Jun-Rui Huang, Wei-Yu Liao, Yi-Pin Lin
  • Publication number: 20220386460
    Abstract: An interlayer connective structure is suitable for being formed in a wiring board, in which the wiring board includes two traces and an insulation part between the traces. The insulation part has a through hole. The interlayer connective structure located in the through hole is connected to the traces. The interlayer connective structure includes a column and a pair of protuberant parts. The protuberant parts are located at two ends of the through hole respectively and connected to the column and the traces. The protuberant parts stick out from the outer surfaces of the traces respectively. Each of the protuberant parts has a convex curved surface, in which the distance between the convex curved surface and the axis of the through hole is less than the radius of the through hole.
    Type: Application
    Filed: July 15, 2021
    Publication date: December 1, 2022
    Inventors: Chi-Min CHANG, Ching-Sheng CHEN, Jun-Rui HUANG, Wei-Yu LIAO, Yi-Pin LIN
  • Patent number: 8456811
    Abstract: A casing includes a main body made of a conductive composite material and a local portion located adjacent to a wireless device. The local portion has a non-conductive layer and a conductive composite material layer. The thickness of the conductive composite material layer is thinner than that of the main body that is immediately adjacent to the conductive composite material layer. Signal emitting and signal receiving of the wireless device is not affected by the thickness of the conductive composite material layer of the local portion. The part of the local portion that has a thickness thinner than a thickness of the adjacent main body is installed with the non-conductive layer. The non-conductive layer is tightly connected with the conductive composite material layer of the local portion and the main body that is immediately adjacent to the non-conductive layer.
    Type: Grant
    Filed: October 21, 2010
    Date of Patent: June 4, 2013
    Assignee: Kunshan Tong-Yin Industrial Electronics Making Co., Ltd.
    Inventor: Wei Yu Liao
  • Publication number: 20110293924
    Abstract: A housing structure for an electronic device and a manufacturing method thereof are disclosed. The housing structure includes a composite material panel. An inner surface of the composite material panel is coated with a film medium layer. One surface of the film medium layer is adhered to the inner surface of the composite material panel, and the other surface of the film medium layer is adhered with a plastic member. The method combines the composite material panel and the plastic member by way of the film medium layer as a medium to achieve the purpose of injection molding and adhering the plastic member on the composite material panel, and thereby obtaining the housing structure for an electronic device. In comparison with the prior art, the method can overcome the disadvantages of the composite material panel not able to be formed as a structural member having complicated structures.
    Type: Application
    Filed: May 24, 2011
    Publication date: December 1, 2011
    Applicant: Kunshan Tong-yin Industrial Electronic Making Co., Ltd.
    Inventor: Wei-Yu Liao
  • Publication number: 20110102985
    Abstract: A casing includes a main body made of a conductive composite material and a local portion located adjacent to a wireless device. The local portion has a non-conductive layer and a conductive composite material layer. The thickness of the conductive composite material layer is thinner than that of the main body that is immediately adjacent to the conductive composite material layer. Signal emitting and signal receiving of the wireless device is not affected by the thickness of the conductive composite material layer of the local portion. The part of the local portion that has a thickness thinner than a thickness of the adjacent main body is installed with the non-conductive layer. The non-conductive layer is tightly connected with the conductive composite material layer of the local portion and the main body that is immediately adjacent to the non-conductive layer.
    Type: Application
    Filed: October 21, 2010
    Publication date: May 5, 2011
    Applicant: Kunshan Tong-yin Industrial Electronic Making Co., Ltd.
    Inventor: Wei Yu Liao