Abstract: A multi-wavelength light-emitting diode epitaxial structure comprises of a substrate and at least three light-emitting elements, wherein the light-emitting elements are sequentially stacked on the substrate. For each two adjacent light-emitting elements, the light-emitting element disposed closer to the light-exiting surface has a higher bandgap than that of the light-emitting element disposed farther from the light-exiting surface. Each of the light-emitting elements comprises of an active layer and two cladding layers disposed on two opposite sides of the active layer, and each active layer includes a multiple quantum well structure. Cladding layers of different refractive indexes are arranged incrementally from the substrate to the light-exiting surface. Any given two adjacent cladding layers from two light-emitting elements have a combined thickness of 1 ?m or less. The emission wavelengths of the light-emitting elements are ultraviolet or infrared bands.

Abstract: A multi-wavelength light-emitting diode epitaxial structure comprises of a substrate and at least three light-emitting elements, wherein the light-emitting elements are sequentially stacked on the substrate. For each two adjacent light-emitting elements, the light-emitting element disposed closer to the light-exiting surface has a higher bandgap than that of the light-emitting element disposed farther from the light-exiting surface. Each of the light-emitting elements comprises of an active layer and two cladding layers disposed on two opposite sides of the active layer, and each active layer includes a multiple quantum well structure. Cladding layers of different refractive indexes are arranged incrementally from the substrate to the light-exiting surface. Any given two adjacent cladding layers from two light-emitting elements have a combined thickness of 1 ?m or less. The emission wavelengths of the light-emitting elements are ultraviolet or infrared bands.

Abstract: A system includes a first antenna for receiving a signal, a first band duplexer coupled to the first antenna, a first receiving path selection circuit connected to the first band duplexer configured to provide a first path and a second path, and a control circuit connected to the first path and the second path. The control circuit controls the first receiving path selection circuit to obtain receiving signal parameters from the first path and the second path, respectively. The control circuit selects a receiving path according to the receiving signal parameters from the first path and the second path. The receiving path is one of the first path or the second path, and is the path having a desired or optimum receiving signal parameter.

Abstract: An epitaxial structure with a tunnel junction, a p-side up processing intermediate structure and a manufacturing method thereof are provided. The epitaxial structure includes: a substrate, a first n-type semiconductor layer, a tunnel junction layer, a p-type semiconductor layer, a multiple quantum well layer and a second n-type semiconductor layer, wherein the first n-type and p-type semiconductor layers and the tunnel junction layer together form a p-type semiconductor structure. The manufacturing method of the p-side up processing intermediate structure includes disposing a permanent substrate on the second n-type semiconductor layer to form a laminated structure, flipping the laminated structure upside down and removing the substrate of the epitaxial structure, thereby resulting in the p-type semiconductor structure being disposed facing up.