Abstract: The present disclosure provides an illumination device. The illumination device includes a cap structure. The cap structure is partially coated with a reflective material operable to reflect light. The illumination device includes one or more lighting-emitting devices disposed within the cap structure. The light-emitting devices may be light-emitting diode (LED) chips. The illumination device also includes a thermal dissipation structure. The thermal dissipation structure is coupled to the cap structure in a first direction. The thermal dissipation structure and the cap structure have a coupling interface. The coupling interface extends in a second direction substantially perpendicular to the first direction. The thermal dissipation structure has a portion that intersects the coupling interface at an angle. The angle is in a range from about 60 degrees to about 90 degrees according to some embodiments.

Abstract: The present disclosure provides a lighting module. The lighting module includes a heat sink, a board disposed over the heat sink, and a bonding component that bonds the heat sink and the board together. The bonding component contains a combination of a first metal and a second metal. The lighting module also includes a photonic lighting device disposed over the board.

Abstract: A lighting apparatus includes a first substrate, a plurality of first light-emitting devices disposed on the first substrate, a second substrate disposed over the first substrate, and a plurality of second light-emitting devices disposed on the second substrate. A reflective surface is disposed between the first substrate and the second substrate. The reflective surface is configured to reflect light emitted by at least some of the first light-emitting devices in a direction that is at least partially toward the first substrate. The reflective surface has one of: a saw-patterned side view profile, or a curved side view profile that is free of having an inflection point.

Abstract: A lamp includes a substrate having a center region and a peripheral region, a first subset of light-emitting devices disposed on the center region, and a second subset of light-emitting devices disposed on the peripheral region. A temperature difference between the center region and the peripheral region is greater than 10 degrees.

Abstract: A lighting device includes a multi-faceted heat sink with facets in a center portion facing outward. The facets form a central enclosed portion, and the heat sink further has a plurality of fins, where each of the fins is placed between adjacent facets and protrudes outwardly from the heat sink. The lighting device also has a plurality of circuit boards with semiconductor emitters mounted thereon. Each of the circuit boards is mounted on a respective facet of the heat sink. The lighting device also has a light-diffusion housing covering the plurality of circuit boards, a power module in communication with the circuit boards and operable to convert power to be compatible with the semiconductor emitters, and a power connector assembly in electrical communication with the power module.

Abstract: A system includes a plurality of light-emitting devices electrically coupled together. A temperature of each of the light-emitting devices is correlated with a voltage of said light-emitting device. The system includes a current driver configured to control an amount of current through at least a subset of the light-emitting devices. The system includes electronic circuitry that is electrically coupled to the subset of the light-emitting devices. The electronic circuitry is configured to: measure a voltage of the subset of the light-emitting devices while the light-emitting devices are in operation; determine, based on the measured voltage, whether the subset of the light-emitting devices is hotter than an acceptable temperature threshold; and instruct the current driver to reduce the amount of current through the subset of the light-emitting devices if the subset of the light-emitting devices has been determined to be hotter than the acceptable temperature threshold.

Abstract: The present disclosure provides one embodiment of an illumination structure. The illumination structure includes a substrate. A light-emitting diode (LED) is disposed over the substrate. A first lens is disposed over the LED. A second lens is disposed over the first lens. The first lens and the second lens are configured to refract light that is emitted by the LED backward.

Abstract: The present disclosure involves a lighting apparatus. The lighting apparatus includes a photonic device that generates light. The lighting apparatus includes a printed circuit board (PCB) on which the photonic device is located. The lighting apparatus includes a diffuser cap having a curved profile covering the PCB and the photonic device. The diffuser cap has a textured surface for scattering light generated by the photonic device. The lighting apparatus includes a thermally conductive cup that surrounds the diffuser cap and thermal conductively coupled to the PCB. The cup has a reflective inner surface that reflects light transmitting through the diffuser cap. The lighting apparatus includes a heat dissipation structure for dissipating heat generated by the photonic device. The heat dissipation structure is thermally coupled to the cup.

Abstract: The present disclosure discloses an apparatus for thermally protecting an LED device. The apparatus includes a substrate. A light-emitting device disposed on a first region of the substrate. The apparatus includes a thermistor disposed on a second region of the substrate. The second region is substantially spaced apart from the first region. The thermistor is thermally and electrically coupled to the light-emitting device. The present disclosure also discloses a method of thermally protecting an LED device. The method includes providing a substrate having a light-emitting diode (LED) die disposed thereon. The method includes detecting a temperature of the LED die using a negative temperature coefficient (NTC) thermistor. The NTC thermistor is positioned on a region of the substrate substantially away from the LED die. The method includes adjusting an electrical current of the LED die in response to the detecting.

Abstract: A light-emitting diode (LED) lamp includes a number of different color LEDs that can be turned on and off in different combinations using an external switch operable by a user. A user or a controller can adjust the color temperature of light output by the lamp. The color temperature change may be a user preference and can compensate for decreased phosphor efficiency over time.

Abstract: The present disclosure provides an illumination device. The illumination device comprises a light-emitting diode (LED) device on a substrate, a heat sink and a cap. The heat sink is thermally connected to the LED device. The cap is secured over the substrate and covering the LED device. The cap includes a coating material having diffusion and reflection characteristics, and the coating material is free of being in direct contact with the LED device. The coating material is applied on a first portion of an inner surface of the cap, but not on a second portion of the inner surface of the cap.

Abstract: A lamp includes a substrate having a center region and a peripheral region, a first subset of light-emitting devices disposed on the center region, and a second subset of light-emitting devices disposed on the peripheral region. A temperature difference between the center region and the peripheral region is greater than 10 degrees.

Abstract: A lighting device includes a first heat sink having a first surface and a second surface opposite the first surface, a second heat sink having a third surface and a fourth surface opposite the third surface. The third surface of the second heat sink is bonded to the second surface of the first heat sink. The lighting device further includes a plurality of first light emitting diode (LED) modules mounted on the first surface of the first heat sink; and a plurality of second light emitting diode (LED) modules mounted on the fourth surface of the second heat sink. One or more the first LED modules generally radiates lights in a first direction. One or more the second LED modules generally radiates lights in a second direction. The first and second LED modules are covered by respective non-reflective caps. The first LED module and the second LED module are configured to be selectively turned on or off according to a predefined algorithm.

Abstract: A lamp includes a substrate, a plurality of light-emitting devices located over the substrate, and a cap that is located over the light-emitting devices. The plurality of light-emitting devices include a first subset of light-emitting devices and a second subset of light-emitting devices. Each light-emitting device in the first subset is free of a phosphor coating. Each light-emitting device in the second subset includes a phosphor coating. The cap has both photo-conversion properties and light-scattering properties, and the cap is located over the first subset of the light-emitting devices but exposes the second subset of the light-emitting devices.

Abstract: The present disclosure involves a lighting apparatus. The lighting apparatus includes a photonic device that generates light. The lighting apparatus includes a printed circuit board (PCB) on which the photonic device is located. The lighting apparatus includes a diffuser cap having a curved profile covering the PCB and the photonic device. The diffuser cap has a textured surface for scattering light generated by the photonic device. The lighting apparatus includes a thermally conductive cup that surrounds the diffuser cap and thermal conductively coupled to the PCB. The cup has a reflective inner surface that reflects light transmitting through the diffuser cap. The lighting apparatus includes a heat dissipation structure for dissipating heat generated by the photonic device. The heat dissipation structure is thermally coupled to the cup.

Abstract: A system includes a plurality of light-emitting devices electrically coupled together. A temperature of each of the light-emitting devices is correlated with a voltage of said light-emitting device. The system includes a current driver configured to control an amount of current through at least a subset of the light-emitting devices. The system includes electronic circuitry that is electrically coupled to the subset of the light-emitting devices. The electronic circuitry is configured to: measure a voltage of the subset of the light-emitting devices while the light-emitting devices are in operation; determine, based on the measured voltage, whether the subset of the light-emitting devices is hotter than an acceptable temperature threshold; and instruct the current driver to reduce the amount of current through the subset of the light-emitting devices if the subset of the light-emitting devices has been determined to be hotter than the acceptable temperature threshold.

Abstract: A light emitting diode (LED) carrier assembly includes an LED die mounted on a silicon submount, a middle layer that is thermally conductive and electrically isolating disposed below the silicon submount, and a printed circuit board (PCB) disposed below the middle layer. The middle layer is bonded with the silicon submount and the PCB.

Abstract: A semiconductor structure includes a module with a plurality of die regions, a plurality of light-emitting devices disposed upon the substrate so that each of the die regions includes one of the light-emitting devices, and a lens board over the module and adhered to the substrate with glue. The lens board includes a plurality of microlenses each corresponding to one of the die regions, and at each one of the die regions the glue provides an air-tight encapsulation of one of the light-emitting devices by a respective one of the microlenses. Further, phosphor is included as a part of the lens board.

Abstract: The present disclosure provides a lighting module. The lighting module includes a heat sink, a board disposed over the heat sink, and a bonding component that bonds the heat sink and the board together. The bonding component contains a combination of a first metal and a second metal. The lighting module also includes a photonic lighting device disposed over the board.

Abstract: The present disclosure involves a lighting apparatus. The lighting apparatus includes a photonic device that generates light. The lighting apparatus includes a printed circuit board (PCB) on which the photonic device is located. The lighting apparatus includes a diffuser cap having a curved profile covering the PCB and the photonic device. The diffuser cap has a textured surface for scattering light generated by the photonic device. The lighting apparatus includes a thermally conductive cup that surrounds the diffuser cap and thermal conductively coupled to the PCB. The cup has a reflective inner surface that reflects light transmitting through the diffuser cap. The lighting apparatus includes a heat dissipation structure for dissipating heat generated by the photonic device. The heat dissipation structure is thermally coupled to the cup.